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    INDUCTOR PLATING PROCESS Search Results

    INDUCTOR PLATING PROCESS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation

    INDUCTOR PLATING PROCESS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PA183K-3F

    Abstract: PA101K8I pa822
    Text: PA SERIES The PA series fixed, chip inductor provides a cubed shape which is easily handled by automatic equipment for assembly into thick or thin film circuitry. An edge plating is provided for forming a solder fillet. The special metallization on the contact area


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    PDF inductoA103K3F PA123K3F PA153K3F PA183K3F PA223K3F PA273K3F PA333K3F PA393K3F PA473K3F PA563K3F PA183K-3F PA101K8I pa822

    Untitled

    Abstract: No abstract text available
    Text: Piconics, Inc. PA Series Piconics PA series fixed, chip inductor provides a cubed shape which, is easily handled by automatic equipment for assembly into thick or thin film circuitry. Other unique features are also offered by this series. An Edge plating is provided for forming a


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    Amplifier Research rf power amplifier schematic

    Abstract: design of multi section directional coupler Spiral Inductor technology 10 ghz driver amplifier mmic distributed amplifier c-band 50 Watt power amplifier c-Band mmic core chip pin diode limiter 3 ghz 1 watt directional coupler chip 8 GHz
    Text: TECHNICAL FEATURE HIGH PERFORMANCE WIDEBAND MSAG GAIN BLOCK/DRIVER AMPLIFIER MMICS USING MLP TECHNOLOGY The multi-level plating MLP process has been used to develop a family of wideband, low noise, generic gain block and driver amplifier MMICs operating


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    Untitled

    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Model Part Number Multilayer Inductor for Signal Line MLF Series 2012-J Type t=0.85mm MLF2012DR39JT000 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER


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    PDF 2012-J MLF2012DR39JT000 180mm TJA024 MLF2012DR39JT000216.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608A1R5JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608A1R5JT000 180mm TJA024 MLF1608A1R5JT000217.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608DR33JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608DR33JT000 180mm TJA024 MLF1608DR33JT000217.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Model Part Number Multilayer Inductor for Signal Line MLF Series 2012-J Type t=0.85mm MLF2012A1R0JT000 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER


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    PDF 2012-J MLF2012A1R0JT000 180mm TJA024 MLF2012A1R0JT000216.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608DR68JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608DR68JT000 180mm TJA024 MLF1608DR68JT000217.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608DR22JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608DR22JT000 180mm TJA024 MLF1608DR22JT000217.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Model Part Number Multilayer Inductor for Signal Line MLF Series 2012-J Type t=0.85mm MLF2012DR22JT000 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER


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    PDF 2012-J MLF2012DR22JT000 180mm TJA024 MLF2012DR22JT000216.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608DR56JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608DR56JT000 180mm TJA024 MLF1608DR56JT000217.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608DR18JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608DR18JT000 180mm TJA024 MLF1608DR18JT000217.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Model Part Number Multilayer Inductor for Signal Line MLF Series 2012-J Type t=0.85mm MLF2012A1R8JT000 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER


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    PDF 2012-J MLF2012A1R8JT000 180mm TJA024 MLF2012A1R8JT000216.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608A4R7JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608A4R7JT000 180mm TJA024 MLF1608A4R7JT000217.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608A1R0JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608A1R0JT000 180mm TJA024 MLF1608A1R0JT000217.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608A2R7JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608A2R7JT000 180mm TJA024 MLF1608A2R7JT000217.

    MLF1608DR10JT000

    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608DR10JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608DR10JT000 180mm TJA024 MLF1608DR10JT000217. MLF1608DR10JT000

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608DR39JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608DR39JT000 180mm TJA024 MLF1608DR39JT000217.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Model Part Number Multilayer Inductor for Signal Line MLF Series 2012-J Type t=0.85mm MLF2012DR18JT000 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER


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    PDF 2012-J MLF2012DR18JT000 180mm TJA024 MLF2012DR18JT000216.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608A3R9JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608A3R9JT000 180mm TJA024 MLF1608A3R9JT000217.

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    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608DR27JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608DR27JT000 180mm TJA024 MLF1608DR27JT000217.

    Untitled

    Abstract: No abstract text available
    Text: Page 1 of 2 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 1608-J Type MLF1608A3R3JT000 Product Lifecycle Stage PROD Release Date 2001/10/01 Specification Summary/Applications/Feature Mounting Method Flag Yes Processing


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    PDF 1608-J MLF1608A3R3JT000 180mm TJA024 MLF1608A3R3JT000217.

    Untitled

    Abstract: No abstract text available
    Text: PA SERIES The PA series fixed, chip inductor provides a cubed shape which is easily handied by automatic equipment for assembly into thick or thin film circuitry. Other unique features are also offered by this series. An edge plating is provided for forming a solder fillet. The


    OCR Scan
    PDF MIL-STD-202,

    Untitled

    Abstract: No abstract text available
    Text: PA SERIES The PA series fixed, chip inductor provides a cubed shape which is easily handied by automatic equipment for assembly into thick or thin film circuitry. Other unique features are also offered by this series. An edge plating is provided for forming a solder fillet. The


    OCR Scan
    PDF