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    INTEL 32 LEAD PLCC Search Results

    INTEL 32 LEAD PLCC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    INTEL 32 LEAD PLCC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


    Original     		PDF A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package

    PLCC 32 intel package dimensions

    Abstract: PLCC 44 intel package dimensions
    Text: Part No. 1109342 - PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors FEATURES: • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 80C31BH, 80C51BH, 87C51, 80/83C652 80C251 80/83C652 C36000 ASTM-B16-85. MIL-P-81728 PLCC 32 intel package dimensions PLCC 44 intel package dimensions

    Untitled

    Abstract: No abstract text available
    Text: Part No. 1109342 - PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors FEATURES: • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 80C31BH, 80C51BH, 87C51, 80/83C652 80C251 80/83C652 C36000 ASTM-B16-85. MIL-T-10727

    Untitled

    Abstract: No abstract text available
    Text: Part No. 1109342 - PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors FEATURES: • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 80C31BH, 80C51BH, 87C51, 80/83C652 80C251 80/83C652 C36000 ASTM-B16-00. SAE-AMS-QQ-N-290.

    80C251

    Abstract: PLCC 32 intel package dimensions 80C31BH 80C51BH 87C51 ASTM-B16-85 MIL-T-10727 83C652 87C51 40 pin PLCC 44 intel package dimensions
    Text: Part No. 1109342 - PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors FEATURES: • Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 80C31BH, 80C51BH, 87C51, 80/83C652 80C251 80/83C652 80C251 C36000 ASTM-B16-85. MIL-T-10727 PLCC 32 intel package dimensions 80C31BH 80C51BH 87C51 ASTM-B16-85 MIL-T-10727 83C652 87C51 40 pin PLCC 44 intel package dimensions

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-80C251 DIP to PLCC Adapter for Intel 80/83C652 and 80C251 Microprocessors FEATURES: •Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors. •Allows user to switch package styles and avoid shortage problems. •Designed to plug directly into your 44 pin PLCC socket.


    Original     		PDF 97-80C251 80/83C652 80C251 QQ-B-750. MIL-T10727 QQ-N-290.

    SAE AMS-QQ-N-290

    Abstract: PLCC 32 SOCKET pinout
    Text: P/N 1111163 40-Pin DIP-to-Socketable PLCC Adapter FEATURES • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP-to-PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 40-Pin 80/83C652 80C251 44-pin C36000, B16/B16M SAE AMS-QQ-N-290 PLCC 32 SOCKET pinout

    AMS-QQ-N-290

    Abstract: SAE AMS-QQ-N-290 SOCKET p PINOUT 80c251 capacitor c652 C17200
    Text: P/N 1111163 40-Pin DIP-to-Socketable PLCC Adapter FEATURES • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP-to-PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 40-Pin 80/83C652 80C251 44-pin C36000, B16/B16M AMS-QQ-N-290 SAE AMS-QQ-N-290 SOCKET p PINOUT capacitor c652 C17200

    18026

    Abstract: 40-Pin DIP-to-Socketable PLCC Adapter SAE AMS-QQ-N-290
    Text: P/N 1111163 40-Pin DIP-to-Socketable PLCC Adapter FEATURES • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP-to-PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 40-Pin 80/83C652 80C251 44-pin C36000, B16/B16M 18026 40-Pin DIP-to-Socketable PLCC Adapter SAE AMS-QQ-N-290

    PLCC 32 SOCKET pinout

    Abstract: No abstract text available
    Text: Part No. 1111163 40 Pin DIP to Socketable PLCC Adapter FEATURES: • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 80/83C652 80C251 MIL-T-10727 MIL-P-81728 PLCC 32 SOCKET pinout

    80c251

    Abstract: 44 pin plcc socket ASTM-B16-85 C17200 PLCC 44 intel package dimensions 94v-0 board PLCC 32 SOCKET pinout
    Text: Part No. 1111163 40 Pin DIP to Socketable PLCC Adapter FEATURES: • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 80/83C652 80C251 MIL-P-81728 44 pin plcc socket ASTM-B16-85 C17200 PLCC 44 intel package dimensions 94v-0 board PLCC 32 SOCKET pinout

    Untitled

    Abstract: No abstract text available
    Text: Part No. 1111163 40 Pin DIP to Socketable PLCC Adapter FEATURES: • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 80/83C652 80C251 MIL-T-10727 MIL-P-81728

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    PLCC 32 SOCKET pinout

    Abstract: No abstract text available
    Text: Part No. 1111163 40 Pin DIP to Socketable PLCC Adapter FEATURES: • Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. • Allows user to switch package styles and avoid shortage problems.


    Original     		PDF 80/83C652 80C251 B545-97 SAE-AMS-QQ-N-29fications PLCC 32 SOCKET pinout

    pioneer PAL 007 A

    Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


    Original     		PDF

    PAL 007 pioneer

    Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


    Original     		PDF

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


    Original     		PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray

    Intel 1702 eprom

    Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
    Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC


    Original     		PDF CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


    Original     		PDF

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    d431000agw

    Abstract: D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 5252 F 1002
    Text: P o m o n a Electronics IC Test Clips Logic Scope Probe JEDEC PQFP Test Clips PomonaÕs JEDEC QFP test clips are designed to fit on surfacemounted plastic and ceramic JEDEC chips. Choose from four clip types specifically designed to give you optimum functionality and ease of use for testing, troubleshooting and


    Original     		PDF ABT16244, ACT16245 FCT16223, FCT162511 d431000agw D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 5252 F 1002

    intel 27210

    Abstract: 27210 intel
    Text: INTEL CORP MEMORY/LOGIC 20E D • 4fl5tl7b DObhlQD Q ■ in i I I^ E y f if f lO M V i n l t - v k - id -2 5 i o 27C210 T^e-iS-Z 9 1M (64K x 16) WORD-WIDE HIGH-SPEED CM OS EPROM ■ JEDEC Approved EPROM Pinouts — 40-Pln DIP -4 4 -P ln PLCC ■ Complete Upgrade to Higher Densities


    OCR Scan     		PDF 27C210 40-Pln 576-bit T-46-13-25 27C210, intel 27210 27210 intel

    wsa1w

    Abstract: microcontroller 87C251 3AD5 272783 QSC family
    Text: P^@ y f Pl^iWQEW in ie l. 8XC251SA/S B/SP/SQ HIGH-PERFORMANCE CHMOS MICROCONTROLLER Commercial/Express I Binary-code Compatible with MCS>® 51 and 8XC251 SB A-step Microcontrollers I Pin Compatible with 44-lead PLCC and 40-lead PDIP MCS 51 Sockets Register-based MCS 251 Architecture


    OCR Scan     		PDF 8XC251SA/S 8XC251 44-lead 40-lead 40-byte 32-bit 256-Kbyte 16-bit 64-Kbyte 87C251SP wsa1w microcontroller 87C251 3AD5 272783 QSC family