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    INTEL BGA PACKAGE TOP MARK Search Results

    INTEL BGA PACKAGE TOP MARK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    INTEL BGA PACKAGE TOP MARK Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    INTEL 28F640

    Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
    Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF 12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3

    BGA PACKAGE TOP MARK intel

    Abstract: intel BGA PACKAGE TOP MARK BGA PACKAGE TOP MARK CG-041493 Intel BGA Solder bga intel
    Text: E PRELIMINARY Mechanical Specification for Easy BGA Package March 1999 Revision: 2.0 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in


    Original     		PDF 32-Mb 64-Mb 128-Mb BGA PACKAGE TOP MARK intel intel BGA PACKAGE TOP MARK BGA PACKAGE TOP MARK CG-041493 Intel BGA Solder bga intel

    BGA PACKAGE TOP MARK intel

    Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
    Text: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF 28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK

    M25P08

    Abstract: MD2800-D08 pmc flash pm49fl004t-33jc MD2810-D08 m25p04 SDTB-128 MD2811-D32-V3 M25P08-V-MN-6-T Sandisk TSOP EPROM databook am27c256 120
    Text: SST Base Memory Cross Reference Table Silicon Storage Technology, Inc. Density Voltage Organized as x8/ x16 SST AMD ST Microelectronics Atmel Intel Winbond Flash 512K 5V 8 SST39SF512; SST29EE512 AM28F512 M29F512 AT49F512, AT29C512 - W29EE512 1M 5V 8 SST39SF010; SST29EE010


    Original     		PDF SST39SF512; SST29EE512 AM28F512 M29F512 AT49F512, AT29C512 W29EE512 SST39SF010; SST29EE010 AM29F010, M25P08 MD2800-D08 pmc flash pm49fl004t-33jc MD2810-D08 m25p04 SDTB-128 MD2811-D32-V3 M25P08-V-MN-6-T Sandisk TSOP EPROM databook am27c256 120

    SSDPAPS0004G1

    Abstract: HBM 00-07H intel nand flash pf29f32 SSDPAPS0002G1 317505-003US ssd schematic 16GB Nand flash dual channel intel nand flash memory PF29
    Text: Intel Z-P140 PATA Solid State Drive SSDPAPS0002G1, SSDPAPS0004G1 Product Manual Product Features „ „ „ „ „ „ Capacities — 2 GB extensible to 4 GB using Intel SD54B NAND Flash Memory components — 4 GB (extensible to 16 GB using Intel SD58B NAND Flash Memory components)


    Original     		PDF Z-P140 SSDPAPS0002G1, SSDPAPS0004G1 SD54B SD58B 318890-003US SSDPAPS0004G1 HBM 00-07H intel nand flash pf29f32 SSDPAPS0002G1 317505-003US ssd schematic 16GB Nand flash dual channel intel nand flash memory PF29

    Migration Guide for Intel StrataFlash Memory J

    Abstract: Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3
    Text: PRODUCT SELECTION MATRIX P Intel 1.8V Wireless Flash W18/W30 R O D Intel StrataFlash® Memory (J3) U C T S Synchronous Intel StrataFlash® Memory (K3/K18) Advanced+ Boot Block (C3) X8 Organization X16 8 Mb 16 Mb 32 Mb Density 64 Mb 128 Mb 256 Mb Burst


    Original     		PDF W18/W30) K3/K18) 128-bit Migration Guide for Intel StrataFlash Memory J Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3

    heller 1700

    Abstract: BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse
    Text: APPLICATION NOTE Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide April 1998 Order Number: 243759-001 Mobile Pentium ® II Processor Mini-Cartridge 240-Pin BGA Connector Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF 240-Pin heller 1700 BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse

    intel packaging handbook 240800

    Abstract: hot wire mass airflow sensor heat pipes intel tuflok 43537 data sheet IC 7408 drawn pin configuration of ic 7408 stamford voltage regulator 82439HX EMBMOD133
    Text: Intel Embedded Processor Module Thermal Design Guide Application Note June 1998 Order Number: 273143-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF IASK9801 NP970255 intel packaging handbook 240800 hot wire mass airflow sensor heat pipes intel tuflok 43537 data sheet IC 7408 drawn pin configuration of ic 7408 stamford voltage regulator 82439HX EMBMOD133

    intel nand flash

    Abstract: HBM 00-07H pf29f32 nand flash ONFI 3.0 DQ04-1 intel nand flash decoder 3185* Intel intel nand flash memory Z-P140 16GB Nand flash dual channel
    Text: Intel Z-P140 PATA Solid State Drive SSDPAPS0002G1, SSDPAPS0004G1 Preliminary Datasheet Product Features „ „ „ „ „ Capacities — 2 GB extensible to 8 GB using Intel SD54B NAND Flash Memory components — 4 GB (extensible to 16 GB using Intel SD58B NAND Flash Memory components)


    Original     		PDF Z-P140 SSDPAPS0002G1, SSDPAPS0004G1 SD54B SD58B 318890-001US intel nand flash HBM 00-07H pf29f32 nand flash ONFI 3.0 DQ04-1 intel nand flash decoder 3185* Intel intel nand flash memory 16GB Nand flash dual channel

    strataflash 512 p30

    Abstract: Spansion Intel StrataFlash Memory j3 Spansion S29GL256N Intel J3 memory TSOP 56 SPANSION Intel SCSP S29GL-N S29GL-A S29GL-M
    Text: Migrating to the Spansion S29GL-N Flash Family from Intel StrataFlash Memory J3 /Embedded Memory (P30) Devices Application Note Introduction This application note provides conversion guidelines to Spansion™ S29GL-N Flash Family devices from Intel StrataFlash® Memory (J3) and Intel StrataFlash® Embedded Memory (P30) devices.


    Original     		PDF S29GL-N S29GL-N J3/P30 strataflash 512 p30 Spansion Intel StrataFlash Memory j3 Spansion S29GL256N Intel J3 memory TSOP 56 SPANSION Intel SCSP S29GL-A S29GL-M

    intel packaging handbook 240800

    Abstract: heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759
    Text: A AP-759 APPLICATION NOTE Intel Embedded Processor Module EMBMOD133 Thermal Design Guide December, 1997 Order Number: 273143-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF AP-759 EMBMOD133) Inte31 intel packaging handbook 240800 heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759

    298161

    Abstract: 28F160C3 28F320C3 28F640C3 28F800C3 TE28F320C3TA100 TE28F320C3TC70
    Text: Migrating from 0.25µm to 0.18µm Advanced+ Boot Block Flash Memory Application Note 730 February 2001 Order Number: 292278-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF AP-730 28F800C3, 28F160C3, 28F320C3, 28F640C3 298161 28F160C3 28F320C3 28F800C3 TE28F320C3TA100 TE28F320C3TC70

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF

    PPGA-B615

    Abstract: CKDM66-M Intel Mobile Celeron Processor BGA
    Text: MOBILE INTEL CELERON® PROCESSOR IN MICRO-PGA AND BGA PACKAGES AT 466 MHZ, 433 MHZ, 400 MHZ, 366 MHZ, 300 MHZ, AND 266 MHZ DATASHEET + Available at 266 MHz, 266 MHz at low voltage, 300 MHz, 333 MHz, 366 MHz, 400 MHz, 433 MHz, and 466 MHz + Supports Intel Architecture with


    Original     		PDF 16-Kbyte 128Kbyte) PPGA-B615 CKDM66-M Intel Mobile Celeron Processor BGA

    82801DB

    Abstract: ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability
    Text: R Intel 82801DB I/O Controller Hub 4 ICH4 Design Guide Intel® 82801DB ICH4 Thermal and Mechanical Design Guidelines October 2002 Document Number: 298651-002 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF 82801DB ICH4 intel 82801DB thermal specifications ICH4 Datasheet 82870P2 ATA-33 P64H2 82870P2 64-bit Hub 2 bga thermal cycling reliability

    J-STD-013

    Abstract: AP-399 pad DIAGRAM for RJ45 on pc board Pulse bob smith termination electrical fast transient testing 82559 printed circuit board AD30 H1012 A5829-01 82559based
    Text: 82559 Printed Circuit Board PCB Design Application Note (AP-399) Revision 1.0 January 1999 Order Number: 739073-001 Revision History Revision Date Revision Description Jan. 1999 1.0 First Release Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF AP-399) J-STD-013 AP-399 pad DIAGRAM for RJ45 on pc board Pulse bob smith termination electrical fast transient testing 82559 printed circuit board AD30 H1012 A5829-01 82559based

    443BX

    Abstract: 041H 245112 Intel Celeron D43 M4 DIODE V001000
    Text: MOBILE CELERON PROCESSOR IN BGA PACKAGE AT 300 MHZ AND 266 MHZ DATASHEET + + + + Available at 266 MHz and 300 MHz Supports the Intel Architecture with Dynamic Execution Integrated primary 16-Kbyte instruction cache and 16-Kbyte write back data cache + Integrated second level cache 128-Kbyte


    Original     		PDF 16-Kbyte 128-Kbyte) USA/96/POD/PMG 443BX 041H 245112 Intel Celeron D43 M4 DIODE V001000

    pin diagram i3 processor

    Abstract: basics of intel i3 processor capacitor 2200 micro M pin configuration of i3 processor 400 mhz filter intel core i3 processor intel i3 intel pentium IV microprocessor pin diagram jtag mhz pentium II
    Text: MOBILE PENTIUM II PROCESSOR IN Micro-PGA AND BGA PACKAGES AT 400 MHz, 366 MHz, 333 MHz, 300PE MHz, AND 266PE MHz      Available at 400 MHz, 366 MHz, 333 MHz, 300PE MHz, and 266PE MHz  Fully compatible with previous Intel microprocessors — Binary compatible with all applications


    Original     		PDF 300PE 266PE 16-Kbyte 256-Kbyte) pin diagram i3 processor basics of intel i3 processor capacitor 2200 micro M pin configuration of i3 processor 400 mhz filter intel core i3 processor intel i3 intel pentium IV microprocessor pin diagram jtag mhz pentium II

    Intel Mobile Celeron Processor BGA

    Abstract: ink cartridge chip Sensor Cement Capacitor 041H 440MX DIODE t42 82
    Text: MOBILE CELERON PROCESSOR IN BGA PACKAGE AT 333MHz, 300 MHz AND 266 MHz DATASHEET + + + Available at 266 MHz, 300 MHz, and 333MHz + Supports the Intel Architecture with Dynamic Execution Integrated primary 16-Kbyte instruction cache and 16-Kbyte write back data cache


    Original     		PDF 333MHz, 333MHz 16-Kbyte 128-Kbyte) Intel Mobile Celeron Processor BGA ink cartridge chip Sensor Cement Capacitor 041H 440MX DIODE t42 82

    443BX

    Abstract: 245103 pbga-b615
    Text: MOBILE PENTIUM II PROCESSOR IN BGA PACKAGE AT 366 MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ + + + Available at 266PE MHz, 300PE MHz, 333 MHz and 366 MHz + — Binary compatible with all applications Supports the Intel Architecture with Dynamic Execution Integrated primary 16-Kbyte instruction


    Original     		PDF 300PE 266PE 16-Kbyte 256-Kbyte) 443BX 245103 pbga-b615

    400 mhz filter

    Abstract: diode t40 041H 440M 440MX 443BX pbga-b615 L-11117 245112 Mini-Cartridge
    Text: MOBILE CELERON PROCESSOR IN MICRO-PGA AND BGA PACKAGES AT 466 MHZ, 433 MHZ, 400 MHZ, 366 MHZ, 300 MHZ, AND 266 MHZ DATASHEET      Available at 266 MHz, 266 MHz at low voltage, 300 MHz, 333 MHz, 366 MHz, 400 MHz, 433 MHz, and 466 MHz Supports Intel Architecture with Dynamic


    Original     		PDF 16-Kbyte 128-Kbyte) 400 mhz filter diode t40 041H 440M 440MX 443BX pbga-b615 L-11117 245112 Mini-Cartridge

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    Intel 82801EB MOTHERBOARD

    Abstract: Intel 82801EB 82801EB ICH5R 82801ER 82801eb ich5 intel 875P chipset motherboard geometric 298643 252516
    Text: R Intel 82801EB I/O Controller Hub 5 ICH5 and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide April 2003 Document Number: 252673-001 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF 82801EB 82801ER 82801EB/82801ER Intel 82801EB MOTHERBOARD Intel 82801EB ICH5R 82801ER 82801eb ich5 intel 875P chipset motherboard geometric 298643 252516

    Intel Mobile Celeron Processor BGA

    Abstract: ink cartridge chip block diagram of pentium D capacitor AA8 pentium II Sensor Cement Capacitor Swatch Group 443BX V0027-00
    Text: MOBILE PENTIUM II PROCESSOR IN BGA PACKAGE AT 366 MHz, 333 MHz, 300PE MHz, AND 266PE MHz + + + + Available at 266PE MHz, 300PE MHz, 333 MHz and 366 MHz — Binary compatible with all applications Supports the Intel Architecture with Dynamic Execution Integrated primary 16-Kbyte instruction


    Original     		PDF 300PE 266PE 16-Kbyte 256-Kbyte) Intel Mobile Celeron Processor BGA ink cartridge chip block diagram of pentium D capacitor AA8 pentium II Sensor Cement Capacitor Swatch Group 443BX V0027-00