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    INTEL PLCC 68 DIMENSIONS TAPE & REEL Search Results

    INTEL PLCC 68 DIMENSIONS TAPE & REEL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    EN80C188XL-12 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    EN80C188XL-20 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    MD82C288-10/R Rochester Electronics LLC Replacement for Intel part number MD82C288-10. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    MD87C51/BQA Rochester Electronics LLC Replacement for Intel part number 5962-8768401QA. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy
    MG87C196KC/B Rochester Electronics LLC Replacement for Intel part number MG87C196KC. Buy from authorized manufacturer Rochester Electronics. Visit Rochester Electronics LLC Buy

    INTEL PLCC 68 DIMENSIONS TAPE & REEL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


    Original     		PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


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    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


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    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


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    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    pioneer PAL 007 A

    Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    PAL 007 pioneer

    Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    SMD CODE 9Z

    Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
    Text: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2


    Original     		PDF 300mm SMD CODE 9Z 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products

    pick and place robot

    Abstract: land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY
    Text: 2 7 Surface Mount Technology 1/16/97 5:04 PM CH07WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 7 SURFACE MOUNT TECHNOLOGY 7.1. INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately


    Original     		PDF CH07WIP pick and place robot land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY

    BA6869

    Abstract: KA3525A lb1838 KA7500B application note ba5938 ka7632 KA7500B LM4136 ba6296 SMPS KA3525A
    Text: Analog and Mixed Signal Products Table of Contents Selection Guide Digital Video. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2


    Original     		PDF O-263 BA6869 KA3525A lb1838 KA7500B application note ba5938 ka7632 KA7500B LM4136 ba6296 SMPS KA3525A

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


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    programming smt machine

    Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and


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    Motorola transistor 7144

    Abstract: t187 4558 dd data 7144 transistor equivalent DT 7130 IC T182 T85 mechanical timer module 4558 C equivalent transistor t222 f 4558 pins
    Text: MC68160 Enhanced Ethernet Transceiver The MC68160 Enhanced Ethernet Interface Circuit is a BiCMOS device which supports both IEEE 802.3 Access Unit Interface AUI and 10BASE–T Twisted Pair (TP) Interface media connections through external isolation transformers. It encodes NRZ data to Manchester data and supplies the


    Original     		PDF MC68160 10BASE MC68360 Motorola transistor 7144 t187 4558 dd data 7144 transistor equivalent DT 7130 IC T182 T85 mechanical timer module 4558 C equivalent transistor t222 f 4558 pins

    manual FW82801BA motherboard

    Abstract: intel chipset 845 motherboard repair circuit Intel 815 FW82815 motherboard review INTEL FW82801BA motherboard INTEL FW82801BA microtek inverter service manual National SG 250w audio amplifier circuit diagram lcd power board schematic hp 1502 rg82855gme Msi 533 845gv Motherboard
    Text: NOTE: PLEASE ADJUST SPINE TO PROPER WIDTH Europe Intel Corporation UK Ltd. Pipers Way Swindon Wiltshire SN3 1RJ UK Phone: England (44) 1793 403 000 France (33) 1 4694 7171 Germany (49) 89 99143 0 Italy (39) 02 575 441 Israel (972) 2 589 7111 Netherlands (31) 20 659 1800


    Original     		PDF USA/2004/10K/MD/HP manual FW82801BA motherboard intel chipset 845 motherboard repair circuit Intel 815 FW82815 motherboard review INTEL FW82801BA motherboard INTEL FW82801BA microtek inverter service manual National SG 250w audio amplifier circuit diagram lcd power board schematic hp 1502 rg82855gme Msi 533 845gv Motherboard

    TLC7528

    Abstract: No abstract text available
    Text: TLC7528C, TLC7528E, TLC7528I DUAL 8ĆBIT MULTIPLYING DIGITALĆTOĆANALOG CONVERTERS SLAS062D − JANUARY 1987 − REVISED JUNE 2007 D Easily Interfaced to Microprocessors D On-Chip Data Latches D Monotonic Over the Entire A/D Conversion D D D D Range Interchangeable With Analog Devices


    Original     		PDF TLC7528C, TLC7528E, TLC7528I SLAS062D AD7528 PM-7528 TMS320 100ns 20pplication TLC7528

    Untitled

    Abstract: No abstract text available
    Text: TLC7528C, TLC7528E, TLC7528I DUAL 8ĆBIT MULTIPLYING DIGITALĆTOĆANALOG CONVERTERS SLAS062D − JANUARY 1987 − REVISED JUNE 2007 D Easily Interfaced to Microprocessors D On-Chip Data Latches D Monotonic Over the Entire A/D Conversion D D D D Range Interchangeable With Analog Devices


    Original     		PDF TLC7528C, TLC7528E, TLC7528I SLAS062D AD7528 PM-7528 TMS320 100ns 20Timers

    Untitled

    Abstract: No abstract text available
    Text: TLC7528C, TLC7528E, TLC7528I DUAL 8ĆBIT MULTIPLYING DIGITALĆTOĆANALOG CONVERTERS SLAS062D − JANUARY 1987 − REVISED JUNE 2007 D Easily Interfaced to Microprocessors D On-Chip Data Latches D Monotonic Over the Entire A/D Conversion D D D D Range Interchangeable With Analog Devices


    Original     		PDF TLC7528C, TLC7528E, TLC7528I SLAS062D AD7528 PM-7528 TMS320 100ns 20pplication

    Untitled

    Abstract: No abstract text available
    Text: TLC7528C, TLC7528E, TLC7528I DUAL 8ĆBIT MULTIPLYING DIGITALĆTOĆANALOG CONVERTERS SLAS062D − JANUARY 1987 − REVISED JUNE 2007 D Easily Interfaced to Microprocessors D On-Chip Data Latches D Monotonic Over the Entire A/D Conversion D D D D Range Interchangeable With Analog Devices


    Original     		PDF TLC7528C, TLC7528E, TLC7528I SLAS062D AD7528 PM-7528 TMS320 100ns