HSP43220
Abstract: ASSP29
Text: Harris Semiconductor No. AN9403 Harris Digital Signal Processing November 1994 PREDICTING DATA THROUGHPUT IN THE HARRIS HSP43220 Authors: John Stauber, Picker International Perry Frogge, Harris Semiconductor Introduction Many signal processing applications require a filter which
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AN9403
HSP43220
HSP43220
ASSP29
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IEC 68-2-63
Abstract: transistors Si 6822 MIL-STD-781 transistors 6822 si MIL-STD-785 MIL-STD-721 The Japanese Transistor Manual 1981 IEC 68-2-28 AND 7411 NATIONAL SEMICONDUCTOR MARKING BM
Text: STANDARDS AND QUALITY CERTIFICATION FOR QUALITY SYSTEMS, SAFETY, ANDRELIABILITY OF SEMICONDUCTOR DEVICES VIII. STANDARDS AND QUALITY CERTIFICATION FOR QUALITY SYSTEMS, SAFETY, ANDRELIABILITY OF SEMICONDUCTOR DEVICES 1. QUALITY SYSTEM STANDARDS 1.1 INTRODUCTION TO THE ISO 9000 SERIES
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intel 2716 eprom
Abstract: intel 2816 intel 2816 eeprom EEPROM 2816 B 2716 D EEPROM intel ev 2816 INTEL D 2816 intel EPROM 2816 eprom intel 2816 eprom
Text: i n t e APPLICATION NOTE T AP-100 December 1982 C A f *T & 3r T «is0 . . i ö .w 4 T r ^ j f P | Based on presentation at 1981 International Reliability Physics Symposium, Orlando, Florida, April 7, 1981. Intel Corporation, 1962. 5-1 A P-100 INTRODUCTION
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AP-100
P-100
intel 2716 eprom
intel 2816
intel 2816 eeprom
EEPROM 2816
B 2716 D EEPROM intel
ev 2816
INTEL D 2816
intel EPROM
2816 eprom
intel 2816 eprom
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932 optocoupler
Abstract: VO3150-X001
Text: VO3150 Vishay Semiconductors Optocoupler, IGBT and MOSFET Driver FEATURES • 0.5 A minimum peak output current NC 1 8 VCC A 2 7 VO C 3 6 VO NC 4 5 VEE 19813 SHIELD 19814 • 15 kV/µs minimum common mode rejection CMR at VCM = 1500 V • 1.0 V maximum low level output voltage (VOL)
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VO3150
thdip87
VO3150
08-Apr-05
932 optocoupler
VO3150-X001
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ed28 smd diode
Abstract: hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet
Text: FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES III. FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES 1. INTRODUCTION 2. FAILURE MECHANISMS AND SCREENING 3. FAILURE MECHANISMS ATTRIBUTED TO WAFER FABRICATION PROCESS 3.1 HOT CARRIER 3.3.1.1 INTRODUCTION 3.3.1.2 HOT CARRIER MECHANISM
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ED-4701-1
C-113:
ed28 smd diode
hv 102 mos fet transistor
diagram of high frequency pvc welding machine
schematic diagram of electric cookers
Ultrasonic Cleaner schematic
engel injection machines
TEG 2423
40khz ULTRASOUND CLEANER
ultrasonic generator 40khz for cleaning
schematic of trigger 555 n-mosfet
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VO3150-X001
Abstract: optocoupler igbt 932 optocoupler VO3150 IEC68 VO3150-X017T NATIONAL IGBT
Text: VO3150 Vishay Semiconductors Optocoupler, IGBT and MOSFET Driver FEATURES • 0.5 A minimum peak output current NC 1 8 VCC A 2 7 VO C 3 6 VO NC 4 5 VEE 19813 SHIELD 19814 • 15 kV/µs minimum common mode rejection CMR at VCM = 1500 V • 1.0 V maximum low level output voltage (VOL)
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VO3150
thdip87
VO3150
18-Jul-08
VO3150-X001
optocoupler igbt
932 optocoupler
IEC68
VO3150-X017T
NATIONAL IGBT
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Untitled
Abstract: No abstract text available
Text: VO3150 Vishay Semiconductors Optocoupler, IGBT and MOSFET Driver FEATURES • 0.5 A minimum peak output current NC 1 8 VCC A 2 7 VO C 3 6 VO NC 4 5 VEE 19813 SHIELD 19814 • 15 kV/µs minimum common mode rejection CMR at VCM = 1500 V • 1.0 V maximum low level output voltage (VOL)
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thdip87
VO3150
11-Mar-11
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kc 2462
Abstract: ED36 symposium ED-36 gunn diode datasheet Betel d 1878 transistors A102
Text: ADI Reliability Handbook Table XII. 1200 ؎500 ppm 38 @ 90% C.I. ELFR FIT Rate No Failures Occurred in Other Stress Tests Conducted, e.g., HAST, T/C, etc. The ppm figure obtained in Table XII was at the time of qualification and based on a limited sample size. Recent figures based on statistically valid sample sizes indicate that the ELFR is running at less
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Untitled
Abstract: No abstract text available
Text: Microelectronics Reliability 46 2006 713–730 www.elsevier.com/locate/microrel Introductory Invited Paper Reliability and performance limitations in SiC power devices Ranbir Singh * GeneSiC Semiconductor Inc., 42652 Jolly Lane, South Riding, VA 20152, United States
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htcc 102 capacitor
Abstract: Hughes Microelectronics JESD-A101 LTCC
Text: LTCC-Bringing Functional Integration to RF & Microwave Products Raymond Brown National Semiconductor Corporation Wireless Communications Santa Clara, California The development of LTCC for microelectronics Projected increases in interconnect density and requirements for higher clock rates for digital and
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SRF 1063
Abstract: Passive filters used in wireless lans W. HUGHES TEST POINTS JESD-A101 capacitor huang Hughes Microelectronics W. HUGHES microstripline htcc 102 capacitor hitachi SAW Filter
Text: LTCC-Bringing Functional Integration to RF & Microwave Products Raymond Brown National Semiconductor Corporation Wireless Communications Santa Clara, California The development of LTCC for microelectronics Projected increases in interconnect density and requirements for higher clock rates for digital and
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dot matrix printer circuit diagram datasheet
Abstract: IEEE 1284 CONNECTOR DB25 FOOTPRINT PCB IEEE 1284 Peripheral Interface Controller "IEEE 1284" peripheral component interconnect 386SL 74LVX161284 74VHC161284 IEEE1284
Text: IEEE1284 transceivers aid in successful implementation of the IEEE1284 standard Claudia Innes Product Marketing Manager Fairchild Semiconductor The Evolution of peripheral communications Peripheral communications have gone through several distinct technology and design phases to progress to today’s level.
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IEEE1284
dot matrix printer circuit diagram datasheet
IEEE 1284 CONNECTOR
DB25 FOOTPRINT PCB
IEEE 1284 Peripheral Interface Controller
"IEEE 1284"
peripheral component interconnect
386SL
74LVX161284
74VHC161284
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ecg semiconductors master replacement guide
Abstract: transistor SMD marked RNW th 20594 TRANSISTOR si 6822 MIL-STD-202F-201A CT 1975 sam transistors br 6822 sun hold ras 2410 relay TRANSISTOR SMD MARKING CODE jg Mist Ultrasonic Humidifier
Text: RELIABILITY OF SEMICONDUCTOR DEVICES I. RELIABILITY OF SEMICONDUCTOR DEVICES 1. OUR PHILOSOPHY OF QUALITY 2. SEMICONDUCTOR RELIABILITY RELIABILITY OF SEMICONDUCTOR DEVICES I. RELIABILITY OF SEMICONDUCTOR DEVICES 1. OUR PHILOSOPHY OF QUALITY Since its foundation, Mitsubishi Electric has been seeking a philosophy of extending the business and contributing the society with high
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PowerPC 601 interface circuit
Abstract: 620t hotwire anemometer powerpc 620 advanced information
Text: Freescale Semiconductor, Inc. Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604™ RISC Microprocessors Gary B. Kromann Freescale Semiconductor, Inc. Advanced Packaging Technology Semiconductor Products Sector
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603TM
604TM
21x21
133MHz
PowerPC 601 interface circuit
620t
hotwire anemometer
powerpc 620 advanced information
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Untitled
Abstract: No abstract text available
Text: PRESS RELEASE CYPRESS SEMICONDUCTOR AND ROCHESTER ELECTRONICS SIGN DISCONTINUED PRODUCTS AGREEMENT SAN JOSE, California.March 5, 1998 - Cypress Semiconductor Corporation [NYSE: CY] and Rochester Electronics announced today a contract under which Rochester will distribute discontinued
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frequency division multiplexing circuit diagram
Abstract: 450MHz CDMA Handset Circuit Diagram automatic change over switch circuit diagram APC back UPS RS 800 power and battery cabinet ericsson MTAS ericsson 800MHz CDMA Handset complete Circuit Diagram UPS APC CIRCUIT frequency division multiplexing circuits ericsson bbs
Text: Harris Semiconductor No. AN9640.1 Harris Communications December 1996 Glossary of Communication Terms Authors: Mark Amarandos and Don LaFontaine Introduction BSS † BTA C-NETz C/I CAD † CAGR CAI CAM † CAP CAP HDSL CBEMA † The following glossary of communication terms is provided
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AN9640
1-800-4-HARRIS
frequency division multiplexing circuit diagram
450MHz CDMA Handset Circuit Diagram
automatic change over switch circuit diagram
APC back UPS RS 800
power and battery cabinet ericsson
MTAS ericsson
800MHz CDMA Handset complete Circuit Diagram
UPS APC CIRCUIT
frequency division multiplexing circuits
ericsson bbs
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Plasma Etch Induced Surface Damage and Its Impacts on GaAs Schottky Diodes
Abstract: No abstract text available
Text: PLASMA ETCH INDUCED SURFACE DAMAGE AND ITS IMPACTS ON GaAs SCHOTTKY DIODES Hong Shen*, Peter Dai, and Ravi Ramanathan Skyworks Solutions, Inc., 2427 Hillcrest Drive, Newbury Park, CA 91320 Email: hong.shen@skyworksinc.com Telephone: 805 480-4481 Keywords: GaAs, Schottky diode, dry etch, barrier height, plasma, damage
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device1000
Plasma Etch Induced Surface Damage and Its Impacts on GaAs Schottky Diodes
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Untitled
Abstract: No abstract text available
Text: Characterization of atomic layer deposition HfO2, Al2O3, and plasmaenhanced chemical vapor deposition Si3N4 as metal–insulator–metal capacitor dielectric for GaAs HBT technology Jiro Yota,a Hong Shen, and Ravi Ramanathan Skyworks Solutions, Inc., 2427 W. Hillcrest Drive, Newbury Park, California 91320
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TP3110
Abstract: TP3056 TP3120 ME32 AN-316 C1995 TP3051 slot map
Text: National Semiconductor Application Note 316 James W Smith August 1982 Abstract This note describes a set of integrated circuit components that together form a major portion of a complete subscriber line card subsystem At the center of this unique configuration is the digital line interface controller
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Theory of Modern Electronic Semiconductor fuses
Abstract: pwm inverter circuit DC Rated Square- Body Fuses ferraz pspice high frequency igbt igbt control circuit for induction heating
Text: Effect of Harmonic Currents on Semiconductor Fuse Ratings R Wilkins J. F. de Palma C. Mulertt Consultant Overdee, Rocky Lane Heswall, Wirral, CH60 0BZ, UK Ferraz Shawmut 374 Merrimac Street Newburyport, MA 01950, USA Ferraz Shawmut 1, Rue Novel FR-69100 Villeurbane, France
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FR-69100
Theory of Modern Electronic Semiconductor fuses
pwm inverter circuit
DC Rated Square- Body Fuses ferraz
pspice high frequency igbt
igbt control circuit for induction heating
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VOLTERRA
Abstract: free all transistor equivalent book Precision Monolithics DISCONTINUED Teledyne Semiconductor toyota engineering standard toshiba OPTICAL PICK-UP dvd laser DVD laser pickup assembly
Text: X UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-K Mark One x Annual Report Pursuant to Section 13 or 15(d) of the Securities Exchange Act of 1934 for the Fiscal Year Ended October 3, 1999. OR Transition Report Pursuant to Section 13 or 15(d) of the Securities Exchange Act of
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Emosyn
Abstract: yamaha SERVICE MANUAL certified management accountant pd good ark foundry LED-GE 24 yamaha ic yamaha ts-s X3100 furniture computer industrial Stanford Telecommunications
Text: X I C O R I N C A N N U A L R E P O R T 1 9 9 9 Business Model Customer Benefits New Products New Markets Relationships Focus on Strategy CO R P O R AT E P R O F I L E Xicor’s product line includes digitally controlled “analog” potentiometers XDCPs , analog products which utilize
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16V8
Abstract: 20V8
Text: PRESS RELEASE CYPRESS OFFERS SUPPORT FOR PROGRAMMABLE LOGIC DESIGN WITH MENTOR GRAPHICS SOFTWARE “Bolt-in Kit” Gives Seamless Integration of Mentor Graphics Tools with Warp Software SAN JOSE, Calif., March 10, 1997 - Cypress Semiconductor Corp. NYSE:CY today
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FLASH370i
16V8
20V8
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TSAL6400
Abstract: TSHF5400 TSOP5700
Text: TSOP5700 Vishay Semiconductors IR Receiver for High Data Rate PCM at 455 kHz Description The TSOP5700 is a miniaturized SMD IR receiver for infrared remote control and IR data transmission. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.
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08-Apr-05
TSAL6400
TSHF5400
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