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    IPC 2221 Search Results

    IPC 2221 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    U77F11172001 Amphenol Communications Solutions 1X1 SFP IPC CAGE Visit Amphenol Communications Solutions
    XEL4012-221NEB Coilcraft Inc General Purpose Inductor, Visit Coilcraft Inc
    XFL3012-221MEB Coilcraft Inc General Purpose Inductor, 0.22uH, 20%, 1 Element, Composite-Core, SMD, 1212, CHIP, 1212, HALOGEN FREE AND ROHS COMPLIANT Visit Coilcraft Inc
    XFL3012-221MEC Coilcraft Inc General Purpose Inductor, 0.22uH, 20%, 1 Element, Composite-Core, SMD, 1212, CHIP, 1212, HALOGEN FREE AND ROHS COMPLIANT Visit Coilcraft Inc
    MLC7532-221MEC Coilcraft Inc General Purpose Inductor, Visit Coilcraft Inc

    IPC 2221 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    2225 capacitor footprint dimension

    Abstract: ipc-SM-782 IPC-SM-782 0805 2211 size footprint 0603 footprint IPC 1206 footprint IPC ceramic capacitor footprint 0402 dimension 1825 footprint dimension 3530 novacap 0402 capacitor ipc-SM-782
    Text: Ceramic Surface Mount Mounting Pad Dimensions and Considerations The objective of this document is to introduce the IPC-SM-782 methodology for solder reflow land patterns. The methodology will be extended to all NOVACAP standard and non-standard part sizes including assumptions for pick & place


    Original     		IPC-SM-782 2225 capacitor footprint dimension IPC-SM-782 0805 2211 size footprint 0603 footprint IPC 1206 footprint IPC ceramic capacitor footprint 0402 dimension 1825 footprint dimension 3530 novacap 0402 capacitor ipc-SM-782 PDF

    BURN GI CONDUIT

    Abstract: T4F8R10K9 PR4410-18A dynamic braking unit schematic diagram DRIVES-IN001A-EN-P T10F4R5K36 rockwell inverter T4F8R19K2 PF3F3R21K4 PF9F2R1K20
    Text: AK DBU Dynamic Braking Unit 600/690 VAC User Manual Important User Information Solid state equipment has operational characteristics differing from those of electromechanical equipment. “Safety Guidelines for the Application, Installation and Maintenance of Solid State Controls” Publication SGI-1.1 available from


    Original     		D-50858 AKDBU-UM001A-EN-P BURN GI CONDUIT T4F8R10K9 PR4410-18A dynamic braking unit schematic diagram DRIVES-IN001A-EN-P T10F4R5K36 rockwell inverter T4F8R19K2 PF3F3R21K4 PF9F2R1K20 PDF

    IPC 2221

    Abstract: IPC 7721 megatest tester IPC-2221 J994 diode smd 2d ipc 610 megatest tester datasheet teradyne J994 IPC-7711
    Text: Circuit Card Capabilities At A Glance Design and Layout Simulation Capabilities • • • • • • • • Sigrity – 2D/3D FEA SiSoft – Signal Integrity Software Hyperlynx – PCB baseline analysis CF Design – Flow and Thermal Analysis Mentor Graphics PADS


    Original     		J-STD-001C, IPC 2221 IPC 7721 megatest tester IPC-2221 J994 diode smd 2d ipc 610 megatest tester datasheet teradyne J994 IPC-7711 PDF

    IPC-2221

    Abstract: ASME-14 hyperlynx IPC 2221 ipc 610 megatest tester datasheet X-RAY INSPECTION J-STD-001C smd NE Teradyne
    Text: Keep Your Design – Change Your Perspective Comprehensive Circuit Card Assembly Services for Mission-Critical Applications WEDC’s circuit card manufacturing capability is specifically targeted for the development of high-mix boards in low-to-medium volumes for the defense and aerospace industries.


    Original     		PDF

    teradyne J994

    Abstract: IPC-A-600 ASME-14 IPC 7721 megatest tester datasheet J-STD-001C AGILENT 3070 hyperlynx understand electronic component megatest tester
    Text: Keep Your Design – Change Your Perspective Comprehensive Circuit Card Assembly Services for Mission Critical Applications Defense design and development engineers constantly face the challenge of creating smaller, more dense, faster, complex circuit boards for highefficiency applications such as missiles, ordnance and secure communications


    Original     		CCA003 teradyne J994 IPC-A-600 ASME-14 IPC 7721 megatest tester datasheet J-STD-001C AGILENT 3070 hyperlynx understand electronic component megatest tester PDF

    420495

    Abstract: AN2738 DOT MATRIX PRINTER SERVICE MANUAL AN2666 AN2736 AN2739 MPC7447 MPC7450 Discovery II
    Text: Freescale Semiconductor Application Note AN2743 Rev. 0.1, 08/2004 Software Analysis on Genesi Pegasos II Using PMON and AltiVec by Maurie Ommerman and Sergei Larin CPD Applications Freescale Semiconductor, Inc. Austin, TX This application note is the sixth in a series describing the Genesi


    Original     		AN2743 420495 AN2738 DOT MATRIX PRINTER SERVICE MANUAL AN2666 AN2736 AN2739 MPC7447 MPC7450 Discovery II PDF

    transistor bf 175

    Abstract: era 555 MOTOROLA
    Text: Concerto F28M35x Technical Reference Manual Literature Number: SPRUH22F April 2012 – Revised December 2013 Contents . 84


    Original     		F28M35x SPRUH22F transistor bf 175 era 555 MOTOROLA PDF

    fuse smd code ud

    Abstract: kc-1206 EB smd code marking tantalum capacitor cf750 2824 footprint dimension JK-110 CAP SMD 2.2uF 50V 10 CERAMIC X7R 0603 TANTALUM smd capacitor 685 35K 1808 footprint IPC Commercial "L", SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
    Text: Surface Mount Multilayer Ceramic Chip Capacitors Commercial Grade Surface Mount Multilayer Ceramic Chip Capacitors One world. One KEMET. Surface Mount Multilayer Ceramic Chip Capacitors Commercial Grade Table of Contents Page Why Choose KEMET. 4


    Original     		15bis fuse smd code ud kc-1206 EB smd code marking tantalum capacitor cf750 2824 footprint dimension JK-110 CAP SMD 2.2uF 50V 10 CERAMIC X7R 0603 TANTALUM smd capacitor 685 35K 1808 footprint IPC Commercial "L", SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) PDF

    Iontophoresis

    Abstract: ASME-14 HF RFID loop antenna design injection molding military switch automobile drawings Calculator Keypad cheetah wedc reballing membrane key
    Text: Electronic Keypads and System Integration About White Electronic Designs Corporation WEDC White Electronic Designs Corporation (NASDAQ: WEDC) provides advanced technology solutions that help our customers leverage the evolution of technology. Each product and service within our diverse


    Original     		IED001 Iontophoresis ASME-14 HF RFID loop antenna design injection molding military switch automobile drawings Calculator Keypad cheetah wedc reballing membrane key PDF

    LTS 6-NP

    Abstract: LTS 15-NP CAS 6-NP LTSR 15-NP LTSR 6-NP ch-1228 cksr6-np LTSR 25-NP CASR50-NP 743 LEM
    Text: Technical Information CAS / CASR / CKSR series Current Transducers Insulated Highly Accurate Measurements from 1.5 to 50 ARMS CAS / CASR / CKSR series Current Transducers Future precision. Future performances. Now available. CAS / CASR / CKSR series Current Transducers


    Original     		RS-159 CH-1228 LTS 6-NP LTS 15-NP CAS 6-NP LTSR 15-NP LTSR 6-NP cksr6-np LTSR 25-NP CASR50-NP 743 LEM PDF

    SPRS836D

    Abstract: No abstract text available
    Text: TCI6638K2K SPRS836D—February 2012—Revised October 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 TCI6638K2K Features and Description 1.1 Features • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point DSP Core


    Original     		TCI6638K2K SPRS836Dâ TCI6638K2K TMS320C66xâ 1024K SPRS836D PDF

    Untitled

    Abstract: No abstract text available
    Text: TCI6636K2H SPRS835F—February 2012—Revised October 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 TCI6636K2H Features and Description 1.1 Features • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point DSP Core


    Original     		TCI6636K2H SPRS835Fâ TCI6636K2H TMS320C66xâ 1024K PDF

    Untitled

    Abstract: No abstract text available
    Text: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x


    Original     		66AK2H14/12/06 SPRS866Eâ 66AK2H14/12/06 66AK2H14/12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15 PDF

    Untitled

    Abstract: No abstract text available
    Text: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x


    Original     		66AK2H14/12/06 SPRS866Eâ 66AK2H14/12/06 66AK2H14/12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15 PDF

    Untitled

    Abstract: No abstract text available
    Text: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x


    Original     		66AK2H14/12/06 SPRS866Eâ 66AK2H14/12/06 66AK2H14/12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15 PDF

    Untitled

    Abstract: No abstract text available
    Text: 66AK2H12/06 SPRS866D—November 2012—Revised October 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H12/06 Features and Description 1.1 Features • Eight (66AK2H12) or Four (66AK2H06) TMS320C66x


    Original     		66AK2H12/06 SPRS866Dâ 66AK2H12/06 66AK2H12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15 PDF

    Untitled

    Abstract: No abstract text available
    Text: 66AK2H14/12/06 SPRS866E—November 2012—Revised November 2013 Multicore DSP+ARM KeyStone II System-on-Chip SoC Check for Evaluation Modules (EVM): EVMK2H 1 66AK2H14/12/06 Features and Description 1.1 Features • Eight (66AK2H14/12) or Four (66AK2H06) TMS320C66x


    Original     		66AK2H14/12/06 SPRS866Eâ 66AK2H14/12/06 66AK2H14/12) 66AK2H06) TMS320C66xâ 1024K Cortex-A15 PDF

    Untitled

    Abstract: No abstract text available
    Text: TCI6630K2L SPRS893B—June 2013—Revised March 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 TCI6630K2L Features and Description 1.1 Features • ARM CorePac – Two ARM Cortex -A15 MPCore™ Processors at Up To 1.4 GHz – 1MB L2 Cache Memory Shared by Two ARM Cores


    Original     		TCI6630K2L SPRS893Bâ TCI6630K2L PDF

    r2kl

    Abstract: tea 1601 t NEC 2561 80286 address decoder tea 1601 block diagram of mri machine 82C206 82c206 ipc 82C631 CS6221
    Text: glîü S {9 ¡1 c n » HH* PRELIM INARY r ^ . CS8221 NEW ENHANCED AT NEAT " DATA BOOK 8 2 C 2 1 1 /8 2 C 2 1 2 /8 2 C 2 1 5 /8 2 C 2 0 6 (IPC) CHIPSet | • 100% IBM™ PC/AT Compatible New Enhanced CHIPSet™ for 12MHz to 16MHz systems ■ Software Configurable Command Delays,


    OCR Scan     		CS8221 82C211 /82C212/82C215/82C206 12MHz 16MHz 16MHz 100ns 150ns r2kl tea 1601 t NEC 2561 80286 address decoder tea 1601 block diagram of mri machine 82C206 82c206 ipc 82C631 CS6221 PDF

    acer adapter circuit diagram

    Abstract: cs8221 neat CHIPS TECHNOLOGIES CHIPset for 80286 neat chipset 80286 chipset 82C206 interfacing of memory devices with 80286 rtl 8111 82C212
    Text: CHIPS & TEC HN OL OG IE S INC Tû DE I SOTflllti ODDlOfiD fl T -5 Z -3 3 -0 5 CHIPS PRELIM INARY CS8221 NEW ENHANCED AT NEAT DATA BOOK 8 2 C 2 1 1 /8 2 C 2 1 2 /8 2 C 2 1 5 /8 2 C 2 0 6 (IPC) CHIPSet” Software Configurable Command Delays, Wait states and Memory Organization


    OCR Scan     		T-SZ-33-05 CS8221 82C211 /82C212/82C215/82C206 12MHz 16MHz 100ns 150ns acer adapter circuit diagram cs8221 neat CHIPS TECHNOLOGIES CHIPset for 80286 neat chipset 80286 chipset 82C206 interfacing of memory devices with 80286 rtl 8111 82C212 PDF

    82C211

    Abstract: 82c206 ipc P82C211 CS8221 82C206 E4000-H AT-286 S2-221-B CHIPset for 80286 82C215
    Text: CHIP S & T E C H N O L O G I E S INC Tû CHÏPS DE I SOTflllti ODDlOfiD fl T - 5Z-3 3 -0 5 PRELIMINARY CS8221 NEW ENHANCED AT NEAT DATA BOOK 82C211/8 2 C 2 1 2 /8 2 C 2 1 5 /8 2 C 2 0 6 (IPC) CHIPSet™ • 100% IBM7“ PC/AT Compatible New .En­ hanced CHIPSet™ tor 12MHz to 16MHz


    OCR Scan     		CS8221 82C211 /82C212/82C215/82C206 12MHz 16MHz 100ns 150ns 82c206 ipc P82C211 82C206 E4000-H AT-286 S2-221-B CHIPset for 80286 82C215 PDF

    Untitled

    Abstract: No abstract text available
    Text: ¿a Pulse 1' Electronics www.pulseelectronics.com U N LESS OTHERWISE SPEC IFIED THIS IS A RoHS COMPLIANT COMPONENT/PRODUCT. ALL ENGINEERING CHANGES MUST HAVE PRIOR APPROVAL BY THE DESIGN CENTER. 1 .1 1 0 @ Pulse 2. PLASTIC: THERMOSET PLASTIC MATERIAL WITH


    OCR Scan     		J-STD-003A TX1514FNL 40PIN PDF

    Untitled

    Abstract: No abstract text available
    Text: NOTES: UNLESS OTHERWISE SPECIFIED 1. NOTICE: RoHS V / 2 . 3. 4. 5. 6. 7. THIS IS A RoHS COMPLIANT COMPONENT/PRODUCT. ALL ENGINEERING CHANGES MUST HAVE PRIOR APPROVAL BY THE DESIGN CENTER. 1.110±.010 [28.19±0.25] PLASTIC: THERMOSET PLASTIC MATERIAL WITH FLAMMABILITY RATING UL 9 4 V - 0 OR BETTER.


    OCR Scan     		J-STD-003A TX1514QNL 40PIN PDF

    Untitled

    Abstract: No abstract text available
    Text: Pulse Electronics www.pulseelectronics.com NOTES: UNLESS OTHERWISE SPECIFIED ELECTRICAL CHARACTERISTICS AT +25’C 1. 2. 3. 4. 5. 6. NO. THIS IS A RoHS COMPLIANT COMPONENT/PRODUCT. ALL ENGINEERING CHANGES MUST HAVE PRIOR APPROVAL BY THE DESIGN CENTER. SPECIFICATIONS


    OCR Scan     		-003A 1267Q 40-PIN TX1267QNL PDF