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    JEDEC FBGA 11 Search Results

    JEDEC FBGA 11 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CYD18S18V18-167BBAXC Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    CYD18S18V18-167BBAXI Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    TMP139AIYAHR Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments

    JEDEC FBGA 11 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    K4W1G1646E

    Abstract: samsung K4W1G1646E-HC11
    Text: 1Gb gDDR3 SDRAM K4W1G1646E 1Gb gDDR3 SDRAM E-die 96 FBGA with Lead-Free & Halogen-Free RoHS Compliant CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.


    Original     		PDF K4W1G1646E K4W1G1646E samsung K4W1G1646E-HC11

    K4W1G1646D-EC15

    Abstract: K4W1G1646D
    Text: 1Gb gDDR3 SDRAM K4W1G1646D 1Gb gDDR3 SGRAM D-die 100 FBGA with Lead-Free & Halogen-Free RoHS Compliant CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.


    Original     		PDF K4W1G1646D K4W1G1646D-EC15 K4W1G1646D

    Untitled

    Abstract: No abstract text available
    Text: 1Gb DDR3 SDRAM K4B1G04 08/16 46D 1Gb D-die DDR3 SDRAM Specification 82 / 100 FBGA with Pb-free & Halogen-Free (RoHS Compliant) CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress.


    Original     		PDF K4B1G04

    Untitled

    Abstract: No abstract text available
    Text: V826765G24SA 1GB 200-PIN DDR UNBUFFERED SODIMM 128M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 134,217,728 x 64 bit organization. ■ Utilizes High Performance 64M x 8 DDR SDRAM in FBGA Packages


    Original     		PDF V826765G24SA 200-PIN DDR400 PC400B)

    ddr4

    Abstract: No abstract text available
    Text: V826765G24SB 1GB 200-PIN DDR UNBUFFERED SODIMM 128M x 64 Features Description • JEDEC 200 Pin DDR Unbuffered Small-Outline, Dual In-Line memory module SODIMM ; 134,217,728 x 64 bit organization. ■ Utilizes High Performance 64M x 8 DDR SDRAM in FBGA Packages


    Original     		PDF V826765G24SB 200-PIN DDR400 PC400B) ddr4

    DRAM 2164

    Abstract: pc133 SDRAM DIMM PC133 registered reference design 168-PIN Registered FBGA SDRAM
    Text: 512MB/1GB x72, ECC 168-PIN REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE MT36LSDF6472G - 512MB MT36LSDF12872G - 1GB For the latest data sheet, please refer to the Micron Web site: www.micron.com/datasheets FEATURES 168-Pin DIMM • JEDEC-standard, 168-pin, dual in-line memory


    Original     		PDF 512MB/1GB 168-PIN MT36LSDF6472G 512MB MT36LSDF12872G 168-pin, PC100 PC133 SDF36C64 DRAM 2164 pc133 SDRAM DIMM PC133 registered reference design 168-PIN Registered FBGA SDRAM

    PC133 registered reference design

    Abstract: No abstract text available
    Text: ADVANCE 64 MEG x 72 REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE MT36LSDF6472 For the latest data sheet, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html PIN ASSIGNMENT Front View 168-Pin DIMM FEATURES • JEDEC-standard, 168-pin, dual in-line memory


    Original     		PDF 168-pin, PC100- PC133* 512MB* PC133 registered reference design

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY‡ 512MB/1GB x72, ECC 168-PIN REGISTERED FBGA SDRAM DIMM SYNCHRONOUS DRAM MODULE MT36LSDF6472G - 512MB MT36LSDF12872G - 1GB For the latest data sheet, please refer to the Micron Web site: www.micron.com/datasheets FEATURES 168-Pin DIMM • JEDEC-standard, 168-pin, dual in-line memory


    Original     		PDF 512MB/1GB 168-PIN MT36LSDF6472G 512MB MT36LSDF12872G 168-pin, PC100 PC133 SDF36C64

    MO-205

    Abstract: No abstract text available
    Text: Revised June 2001 BGA114A 114-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide Package Number BGA114A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.


    Original     		PDF BGA114A 114-Ball MO-205, BGA114ArevE MO-205

    DDR2 DIMM 240 pinout

    Abstract: 1G DDR2 667 DDR DIMM SPD JEDEC KVR667D2S8F5
    Text: Memory Module Specifications KVR667D2S8F5/1G 1GB 128M x 72-Bit PC2-5300 CL5 ECC 240-Pin FBDIMM DESCRIPTION SPECIFICATIONS This document describes ValueRAM’s 1GB 128M x 72-bit FBDIMM Module 240-pin JEDEC Standard R/C A nine 128M x 8-bit 667MHz DDR2 FBGA components. The mod-


    Original     		PDF KVR667D2S8F5/1G 72-Bit PC2-5300 240-Pin 72-bit) 667MHz VALUERAM0804-001 DDR2 DIMM 240 pinout 1G DDR2 667 DDR DIMM SPD JEDEC KVR667D2S8F5

    MO-205

    Abstract: BGA54A
    Text: Revised June 2001 BGA54A 54-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide Package Number BGA54A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.


    Original     		PDF BGA54A 54-Ball MO-205, BGA54ArevD MO-205 BGA54A

    MO-205

    Abstract: BGA96A
    Text: Revised June 2001 BGA96A 96-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide Package Number BGA96A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.


    Original     		PDF BGA96A 96-Ball MO-205, BGA96ArevE MO-205 BGA96A

    Untitled

    Abstract: No abstract text available
    Text: Memory Module Specification T E C H N O L O G Y KHX13000D3LL/1G 1GB 128M x 64-Bit PC3-13000 CL7 240-Pin DIMM DESCRIPTION: This document describes Kingston's 128M x 64-bit 1GB 1024MB DDR3-1625 CL7 SDRAM (Synchronous DRAM) memory module, based on eight 128M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR31625MHz at a low latency timing of 7-7-7 at 1.9V. The SPD is programmed to JEDEC standard latency DDR3-1066Mhz


    Original     		PDF KHX13000D3LL/1G 64-Bit PC3-13000 240-Pin 1024MB) DDR3-1625 DDR31625MHz DDR3-1066Mhz

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    JEDEC TRAY DIMENSIONS FBGA

    Abstract: 529-Pin
    Text: TRAY CONTAINER A' 14.65 7 135°C MAX 18.35 A FBGA14x14ESP 12.90 NEC 110.1 135.9 PPE 7×18=126 UNIT : mm 14.65 17.10 290.7 12.15 315.0 322.6 SECTION A – A' 14.65 (5.85) (5.62) 7.62 14.00 Applied Package Quantity (pcs) FBGA 14×14 ESP Tray 157-pin Plastic FBGA (14×14)


    Original     		PDF FBGA14 14ESP 157-pin 257-pin 321-pin 352-pin 421-pin 529-pin SSD-A-H7103-2 JEDEC TRAY DIMENSIONS FBGA

    JEDEC FBGA

    Abstract: 196-PIN 181-pin
    Text: TRAY CONTAINER UNIT : mm 11x29=319 NEC 7 8.20 296.8 315.0 322.6 8.20 Section A – A' 8.00 (5.62) 7.62 11.65 135°C MAX. 8.20 10.60 9.10 (6.04) 116.5 A' FBGA8×8ESP 9.70 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA8×8ESP Material Carbon PPE 121-pin PLASTIC FBGA (8×8)


    Original     		PDF 121-pin 165-pin 73-pin 169-pin 180-pin 181-pin 196-pin SSD-A-H7193-2 200ONTAINER JEDEC FBGA

    JEDEC tray standard 13

    Abstract: c 129 transistor JEDEC FBGA 144PIN JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 13 x 32=416 118.2 135° C MAX. NEC FBGA7 × 7ESP 7.35 8.85 9.85 A' 7.35 9.60 297.6 315.0 322.6 8.70 7.35 Section A – A' (5.62) (5.77) 7.00 7.62 135.9 PPE A Applied Package Quantity (pcs) 48-pin Plastic FBGA (7×7) 109-pin Tape FBGA (7×7)


    Original     		PDF 144-pin 109-pin 48-pin 129-pin SSD-A-H7655-2 JEDEC tray standard 13 c 129 transistor JEDEC FBGA 144PIN JEDEC TRAY DIMENSIONS FBGA

    SSD-A-H7391-2

    Abstract: FBGA 152 JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC 135°C MAX. A' 16.15 13.40 16.00 FBGA13×13ESP 13.40 12.15 290.7 315.0 322.6 Section A – A' 13.40 (5.62) (5.82) 12.70 7.62 11.95 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 13×13 ESP 381-pin Plastic FBGA (12.7×12.7)


    Original     		PDF FBGA13 13ESP 381-pin 384-pin 481-pin 509-pin 525-pin SSD-A-H7391-2 SSD-A-H7391-2 FBGA 152 JEDEC TRAY DIMENSIONS FBGA

    FBGA

    Abstract: 361 pin FLGA JEDEC FBGA 11 FBGA11
    Text: TRAY CONTAINER NEC 114.0 7 A' 11.74 14.25 10.95 FBGA11x11 ESP A 135°C MAX 135.9 PPE 9×22=198 UNIT : mm 11.74 294.0 14.00 10.50 315.0 322.6 (5.91) 11.74 11.00 (5.62) 7.62 SECTION A – A' Applied Package Quantity (pcs) FBGA 11×11 ESP Tray 108-pin Plastic FBGA (11×11)


    Original     		PDF FBGA11 108-pin 109-pin 168-pin 192-pin 225-pin 361-pin SSD-A-H6795-5 FBGA 361 pin FLGA JEDEC FBGA 11

    FBGA 63

    Abstract: JEDEC FBGA 61PIN JEDEC TRAY DIMENSIONS
    Text: NEC 119.6 8.15 9.20 A' 5.30 8.80 5.30 135° C MAX. FBGA5 x 5A A 299.2 315.0 322.6 7.90 5.30 Section A – A' (5.62) (5.79) 5.00 7.62 135.9 PPE 14 × 35=490 TRAY CONTAINER Applied Package Tray FBGA 5×5A 61-pin Plastic FBGA (5×5) Material Carbon PPE 61-pin Tape FBGA (5×5)


    Original     		PDF 61-pin 63-pin 97-pin SSD-A-H7519-2 FBGA 63 JEDEC FBGA 61PIN JEDEC TRAY DIMENSIONS

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard fBGA package tray 129-pin JEDEC TRAY DIMENSIONS FBGA FBGA FBGA tray JEDEC FBGA fBGA 80 package
    Text: TRAY CONTAINER UNIT : mm 10x26=260 9.30 12.80 9.30 11.80 295.0 10.00 315.0 322.6 SECTION A – A' 9.30 Applied Package (5.89) (5.62) 9.00 7.62 10.35 135°CMAX. 7 NEC 115.2 FBGA9×9ESP 135.9 PPE A' A Quantity (pcs) 73-pin Plastic FBGA (9×9) 80-pin Plastic FBGA (9×9)


    Original     		PDF 73-pin 80-pin 129-pin 141-pin SSD-A-H7113-2 JEDEC TRAY DIMENSIONS JEDEC tray standard fBGA package tray JEDEC TRAY DIMENSIONS FBGA FBGA FBGA tray JEDEC FBGA fBGA 80 package

    JEDEC tray standard

    Abstract: JEDEC TRAY DIMENSIONS FBGA 97PIN TRAY DIMENSIONS fBGA package tray 12
    Text: TRAY CONTAINER NEC 119.6 8.80 6.50 299.2 315.0 322.6 7.90 6.50 6.00 (5.62) (6.16) Section A – A' 7.62 6.50 135° CMAX. FBGA6 x 6C A' A 8.15 9.20 135.9 PPE 14 × 35=490 UNIT : mm Applied Package Quantity (pcs) 64-pin Plastic FBGA (6×6) 65-pin Plastic FBGA (6×6)


    Original     		PDF 65-pin 490MAX. 64-pin 85-pin 97-pin SSD-A-H7469-3 JEDEC tray standard JEDEC TRAY DIMENSIONS FBGA 97PIN TRAY DIMENSIONS fBGA package tray 12

    JEDEC tray standard 490

    Abstract: FBGA
    Text: TRAY CONTAINER NEC 119.6 135°C MAX. A' A 4.25 9.20 FBGA4x4ESP 8.15 4.25 8.80 7.90 299.2 315.0 322.6 SECTION A-A' 4.25 (6.11) 7.62 4.00 (5.62) 135.9 PPE 14×35=490 UNIT : mm Applied Package 49-pin Plastic FBGA (4×4) 64-pin Plastic FBGA (4×4) Quantity (pcs)


    Original     		PDF 49-pin 64-pin SSD-A-H7393-1 JEDEC tray standard 490 FBGA