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    JEDEC FBGA 12 19 Search Results

    JEDEC FBGA 12 19 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CYD18S18V18-167BBAXC Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    CYD18S18V18-167BBAXI Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    TMP139AIYAHR Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    SN74SSQEA32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQE32882ZALR Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments

    JEDEC FBGA 12 19 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    transistor 6c

    Abstract: 6c s transistor y1
    Text: Mounting Pad Packing JEDEC Tray Name FBGA 19x19×1.46 304 pin FBGA 19 × 19 A W S B B B 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D AA W U R N L J G E C A AB Y V T P M K H F D B P Index mark Q W S A J I Y1 S H R S K S F L E φM M G S A B


    Original     		PDF S304S1-6C transistor 6c 6c s transistor y1

    Untitled

    Abstract: No abstract text available
    Text: 199F7F 199pin 13✕13mm body FBGA EIAJ Package Code – JEDEC Code – 13TYP 12.6 Weight(g) Under Development 0.8✕14=11.2 0.20 C A 0.35±0.05 0.8TYP 0.20 C B 0.8TYP 0.8✕14=11.2 0.1 C (12.6) 13TYP A R P N M L K J H G F E D C B A B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15


    Original     		PDF 199F7F 199pin 13TYP

    255PIN

    Abstract: No abstract text available
    Text: 255F7F EIAJ Package Code – 255pin 17✕17mm body FBGA JEDEC Code – 17TYP 16.6 Weight(g) Under Development 0.8✕19=15.2 0.20 C A 0.35±0.05 0.8TYP 0.20 C B ✕4 0.2 0.8TYP 0.8✕19=15.2 0.1 C (16.6) 17TYP A Y W V U T R P N M L K J H G F E D C B A B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


    Original     		PDF 255F7F 255pin 17TYP

    Untitled

    Abstract: No abstract text available
    Text: 299F7F 299pin 17✕17mm body FBGA EIAJ Package Code – JEDEC Code – 17TYP Under Development 0.8✕19=15.2 0.20 C A 0.1 C 0.20 C B 0.8TYP 0.8✕19=15.2 0.35±0.05 16.6 17TYP (16.6) Weight(g) 0.8TYP A Y W V U T R P N M L K J H G F E D C B A B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


    Original     		PDF 299F7F 299pin 17TYP

    FBGA16

    Abstract: 393 NEC
    Text: TRAY CONTAINER UNIT : mm 6x16=96 135°C MAX. 19.20 16.30 7 NEC 107.0 21.40 FBGA16×16ESP A' 14.45 16.30 13.50 288.0 315.0 322.6 Section A – A' 16.30 (5.62) (6.09) 16.00 7.62 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA16×16ESP 224-pin Plastic FBGA (16×16)


    Original     		PDF FBGA16 16ESP 224-pin 240-pin 241-pin 303-pin 393-pin 697-pin 393 NEC

    AMD reflow soldering profile BGA

    Abstract: Theta JC of FBGA AM29LV800B thermal resistance solder paste 63sn alpha metal fbga thermal resistance fbga 12 x 12 thermal resistance smd codes marking A21 AMD thermal design retention mechanism FR4 substrate fiberglass AMD K6
    Text: 5/11/99 Version 2.3 1999 Advanced Micro Devices, Inc. Advanced Micro Devices reserves the right to make changes in its products without notice in order to improve design or performance characteristics. This publication neither states nor implies any warranty of any kind, including but not limited to implied warrants of


    Original     		PDF 22247F AMD reflow soldering profile BGA Theta JC of FBGA AM29LV800B thermal resistance solder paste 63sn alpha metal fbga thermal resistance fbga 12 x 12 thermal resistance smd codes marking A21 AMD thermal design retention mechanism FR4 substrate fiberglass AMD K6

    JEDEC FBGA 12 19

    Abstract: MS-034 JEDEC OUTLINE
    Text: Altera Device Package Information 324-Pin Non-Thermally Enhanced FineLine Ball-Grid Array FBGA • ■ ■ All dimensions and tolerances conform to ANSI Y14.5M – 1994. Controlling dimension is in millimeters. M is the maximum solder ball matrix size. Package Information


    Original     		PDF 324-Pin MS-034 JEDEC FBGA 12 19 MS-034 JEDEC OUTLINE

    THGBM1G5D2EBAI7

    Abstract: THGBM1G8D8EBAI2 THGBM1G4D1EBAI7 THGBM THGVS4G5D2EBAI4 THGVS4G8D8EBAI2 169ball THGVS4G3D1EBAI8 THGBM1G6D4EBAI4 THGBM1G7D4EBAI2
    Text: 8 eye 東芝半導体情報誌アイ 2008 年 8 月号 Volume 192 CONTENTS 新製品情報 業界最大32ギガバイトの 組込み式ＮＡＮＤ型フラッシュメモリ 2 5Mbpsロジック出力ICカプラ： TLP105/TLP108 3 パワーMOSFET U-MOS V-H MOSBDシリーズ：


    Original     		PDF TLP105/TLP108 TPCA8A04-H TPC8A04-H 32SDA 595TYP THGBM1G5D2EBAI7 THGBM1G8D8EBAI2 THGBM1G4D1EBAI7 THGBM THGVS4G5D2EBAI4 THGVS4G8D8EBAI2 169ball THGVS4G3D1EBAI8 THGBM1G6D4EBAI4 THGBM1G7D4EBAI2

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    FBGA 152

    Abstract: 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484
    Text: 10. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values


    Original     		PDF SII52010-4 EP2S15 EP2S30 EP2S60 FBGA 152 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484

    MS-034

    Abstract: JEDEC FBGA 11 JEDEC MS-034-AAJ-1
    Text: Altera Device Package Information 400-Pin Wirebond FineLine Ball-Grid Array FBGA • ■ ■ All dimensions and tolerances conform to ANSI Y14.5M – 1994. Controlling dimension is in millimeters. M is the maximum solder ball matrix size. Package Information


    Original     		PDF 400-Pin MS-034 MS-034 JEDEC FBGA 11 JEDEC MS-034-AAJ-1

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    THGBM1G8D8EBAI2

    Abstract: THGBM1G4D1EBAI7 THGBM THGVS4G3D1EBAI8 THGBM1G TLP108 TLP105 THGBM1G7D4EBAI2 THGBM1G4D1EBAI THGBM1G5D2EBAI7
    Text: 8 eye 東芝半導体情報誌アイ 2008 年 8 月号 Volume 192 CONTENTS 新製品情報 業界最大32ギガバイトの 組込み式ＮＡＮＤ型フラッシュメモリ 2 5Mbpsロジック出力ICカプラ： TLP105/TLP108 3 パワーMOSFET U-MOS V-H MOSBDシリーズ：


    Original     		PDF TLP105/TLP108 TPCA8A04-H TPC8A04-H 32SDA THGBM1G8D8EBAI2 THGBM1G4D1EBAI7 THGBM THGVS4G3D1EBAI8 THGBM1G TLP108 TLP105 THGBM1G7D4EBAI2 THGBM1G4D1EBAI THGBM1G5D2EBAI7

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    BT 1610

    Abstract: 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: 16. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values


    Original     		PDF SII52010-4 EP2S15 EP2S30 EP2S60 BT 1610 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90

    BT 1610

    Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		PDF

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    electronique package

    Abstract: electronique cdx3 fujitsu Flash Memory Miniature Card AMD PCMCIA linear Flash Memory Card 2M - FLASH PCMCIA linear card MB98A81183-15 1M - FLASH PCMCIA linear card PCMCIA SRAM Memory Card 512k 5v eeprom Memory 32Mbit
    Text: FLASH OVERVIEW 16 18/9/98 4:12 pm Page 1 PRODUCT OVERVIEW FLASH MEMORY Fujitsu Flash Memories The Complete Package FLASH OVERVIEW 16 18/9/98 4:12 pm Page 2 Flash Memory Copyright 1998 Fujitsu Limited Tokyo, Japan, Fujitsu Mikroelektronik GmbH, Fujitsu Microelectronics Ltd and Fujitsu


    Original     		PDF D-85737 S-19268 FEDE-FLASH-0998 electronique package electronique cdx3 fujitsu Flash Memory Miniature Card AMD PCMCIA linear Flash Memory Card 2M - FLASH PCMCIA linear card MB98A81183-15 1M - FLASH PCMCIA linear card PCMCIA SRAM Memory Card 512k 5v eeprom Memory 32Mbit

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    micro fineline BGA

    Abstract: EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z
    Text: 7. Package Information MII51007-2.1 Introduction This chapter provides package information for Altera’s MAX II devices, and includes these sections: • “Board Decoupling Guidelines” on page 7–1 ■ “Device and Package Cross Reference” on page 7–1


    Original     		PDF MII51007-2 144-Pin 68-Pin 144Pin 100-pin micro fineline BGA EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z

    fbga Substrate design guidelines

    Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
    Text: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		PDF

    pin information ep3c10

    Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55
    Text: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.


    Original     		PDF EP3C25 EP3C10 pin information ep3c10 EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55

    FBGA 152

    Abstract: JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA
    Text: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC A' 13.40 16.15 12.15 13.40 16.00 11.95 FBGA13×13ESP 135°C MAX. 135.9 PPE A 290.7 315.0 322.6 SECTION A – A' 13.40 (5.95) (5.62) 7.62 13.00 Applied Package 144-pin Plastic FBGA (13×13) 160-pin Plastic FBGA (13×13)


    Original     		PDF FBGA13 13ESP 144-pin 160-pin 161-pin 180-pin 197-pin 212-pin 225-pin 249-pin FBGA 152 JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA