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    JEDEC PACKAGE PLCC 32 Search Results

    JEDEC PACKAGE PLCC 32 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    JEDEC PACKAGE PLCC 32 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: A Sockets for IC-PLCC SMD sockets for PLCC - low profile housing B These sockets conform to EIA/JEDEC "A" package requirements for leaded plastic chip carriers. B ±0,2 D ±0,2 A C ±0,2 C Q 1,27 A 0,5 4 1,27 art. no. PLCC PLCC PLCC PLCC PLCC PLCC PLCC 20


    Original     		PDF

    84 Pin PLCC Socket DIP

    Abstract: plcc thru hole socket 32 PLCC
    Text: WINSLOW ADAPTICs WAxx127DSAJT PLCC TO PGA ADAPTER This is a complete range of Adapters which convert a PLCC package to a PGA male thru hole footprint. This range of adapters are supplied with PLCC production sockets mounted for ease of device insertion. Sockets are to JEDEC standard PLCC dimensions.


    Original     		PDF WAxx127DSAJT 84 Pin PLCC Socket DIP plcc thru hole socket 32 PLCC

    Untitled

    Abstract: No abstract text available
    Text: MP1000VS32JC 1M x 32 Fast SRAM PLCC Issue 1.0 December 2005 General Description Features The MP1000VS32JC device is a 1M x 32 SRAM module housed in a 68 Jleaded package which complies with the JEDEC 68 PLCC standard. Access times of 12, 15 or 20 ns are available. The 3V device is


    Original     		PDF MP1000VS32JC MP1000VS32JC 435mton

    D0-D31

    Abstract: No abstract text available
    Text: MP512S32JC 512K x 32 Fast SRAM PLCC Issue 1.1 December 2007 General Description Features The MP512S32JC device is a 512K x 32 SRAM module housed in a 68 Jleaded package which complies with the JEDEC 68 PLCC standard. Access times of 15, 20 or 25 ns are available. The 5V device is


    Original     		PDF MP512S32JC MP512S32JC D0-D31

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PDF PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN

    augat tyco

    Abstract: PCS-044A-1 Augat PCS-032A-1 PCS-068A-1 PCS-084A-1 1-822473-6 AUGAT SOCKET 1-822473-3 1571539-2
    Text: Introducing. AUGAT PLCC Sockets Thru-Hole PCS Series PRODUCT FACTS • The RoHS Compliant PCS Series Chip Carrier socket accepts Jedec Type "A" plastic leaded chip carriers on 1.27 centres. These dependable sockets combine positive retention of the package with high normal force


    Original     		PDF

    MS-016

    Abstract: MS-016 plcc32 PLCC32
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PLCC 32 CASE 776AK−01 ISSUE O DATE 19 DEC 2008 PIN#1 IDENTIFICATION E1 E E2 D1 A2 D A3 TOP VIEW END VIEW b1 b e D2 SIDE VIEW Notes: 1 All dimensions are in millimeters. (2) Complies with JEDEC MS-016. DOCUMENT NUMBER:


    Original     		PDF 776AK-01 98AON34227E MS-016. 776AK MS-016 MS-016 plcc32 PLCC32

    PCS-068A-1

    Abstract: Augat, PCS Series PCS-020A-1 PCS-044A-1 MO-047 MO-052 PCS-028A-1 PCS020A1 PCS068A-1 PCS068A1
    Text: PCS Series Sockets for PLCC Packages C PCS-068A-1 FEATURES: PERFORMANCE SPECIFICATIONS: The Augat PCS Series Chip Carrier sockets accepts Jedec Type "A" plastic leaded chip carriers on .050" 1.27 centers. These dependable sockets combine positive retention of the package with high normal force to


    Original     		PDF PCS-068A-1 MIL-STD-1344, PCS-032A-1 PCS-068A-1 Augat, PCS Series PCS-020A-1 PCS-044A-1 MO-047 MO-052 PCS-028A-1 PCS020A1 PCS068A-1 PCS068A1

    23C4096-12

    Abstract: MX23C4096 MX23C4096PC-10 MX23C4096PC-12 MX23C4096PC-15 MX23C4096PC-20 N 690
    Text: Introduction Selection Guide MX23C4096 4M-BIT 256K x 16 CMOS MASK ROM FEATURES • • • • • • Operating current: 60mA • Standby current: 100µA • Package - 40 pin DIP(600 mil) - 44 pin PLCC 256Kx16 organization(JEDEC pin out) Single +5V power supply


    Original     		PDF MX23C4096 256Kx16 100/120/150/200ns MX23C4096 150/200ns. 23C4096-12 MX23C4096PC-10 MX23C4096PC-12 MX23C4096PC-15 MX23C4096PC-20 N 690

    MX23C2048

    Abstract: No abstract text available
    Text: Introduction Selection Guide MX23C2048 2M-BIT 128K x 16 CMOS MASK ROM FEATURES • • • • • • Operating current: 60mA • Standby current: 100µA • Package - 40 pin DIP(600 mil) - 44 pin PLCC 128Kx16 organization(JEDEC pin out) Single +5V power supply


    Original     		PDF MX23C2048 128Kx16 120/150/200ns MX23C2048 200ns. MX23C204at

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    rh 115-2

    Abstract: MS-018 MS-016 amkor
    Text: LEADFRAME data sheet PLCC Features: Plastic Leaded Chip Carrier PLCC Packages: Amkor's PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead. All PLCC products are offered with and without


    Original     		PDF Appli18 MS-018 MS-016 rh 115-2 MS-018 MS-016 amkor

    MS-018

    Abstract: MS-016 MS-018 PLCC 68 MS016
    Text: LEADFRAME data sheet PLCC Features: Plastic Leaded Chip Carrier PLCC Packages: Amkor’s PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead. All PLCC


    Original     		PDF set018 MS-016 MS-018 MS-016 MS-018 PLCC 68 MS016

    Untitled

    Abstract: No abstract text available
    Text: • DISTINCTIVE CHARACTERISTICS * Single 5.0 V read, write and erase Minimizes system level power requirements * Compatible with JEDEC-standard commands Uses same software commands as E2PRO!\/ls a -ym 1 Compatible with JEDEC-standard byte-wide pinoutjm 32-pin PLCC Package suffix: PD


    OCR Scan     		PDF 32-pin P9604

    Untitled

    Abstract: No abstract text available
    Text: PLCC Socket - 709-2000 Series / The new range of CAMBION PLCC sockets offers a high quality product at extremely competitive prices. Available in the full range of standard jedec package configurations, with Phosphor Bronze contacts and UL94V-0 PBT body material the


    OCR Scan     		PDF UL94V-0 UL94V-0

    Untitled

    Abstract: No abstract text available
    Text: The new range of CAMBION PLCC sockets offers a high quality product at extremely competitive prices. Available in the full range of standard jedec package configurations, with Phosphor Bronze contacts and UL94V-0 PBT body material the PLCC socket complements CAMBION’s other


    OCR Scan     		PDF UL94V-0 UL94V-0

    Untitled

    Abstract: No abstract text available
    Text: The new range of CAMBION PLCC sockets offers a high quality product at extremely competitive prices. Available in the full range of standard jedec package configurations, with Phosphor Bronze contacts and UL94V-0 PBT body material the PLCC socket complements CAMBION's other


    OCR Scan     		PDF UL94V-0 UL94V-0

    Untitled

    Abstract: No abstract text available
    Text: Siptos IsemIconductor AP29F040 PRELIMINARY 512K x 8 CMOS Flash EPROM Features • Low Vc c write inhibit < 3.2 V • Packaged in: 32-Pin PLCC and TSOP • 5 V ± 10% program and erase for low power consumption and simplified system design • JEDEC-standard software commands, pinout and package


    OCR Scan     		PDF AP29F040 32-Pin AP29F040-70JC AP29F040-70TC AP29F040-90JC AP29F040-90TC AP29F040-120JC AP29F040-120TC AP29F040-150JC AP29F040-150TC

    Untitled

    Abstract: No abstract text available
    Text: m A MX23C4Q96 MACftONIX. INC. 4M-BIT 258K x 18 CMOS MASK ROM FEATURES • • • • • Operating current: 60mA Standby current: 100(iA Package - 40 pin DIP(600 mil) - 44 pin PLCC 256Kx16 organization(JEDEC pin out) Single +5V power supply Fast access time: 100/120/150/200ns


    OCR Scan     		PDF MX23C4Q96 256Kx16 100/120/150/200ns MX23C4096 150/200ns. MX23C4096PC-10 MX23C4096PC-12 MX23C4096PC-15

    Untitled

    Abstract: No abstract text available
    Text: R I A MX23C1Q24 MACRONIX, INC. 1 M-BIT 64K x 1 B CMOS MASK ROM FEATURES • • • • • Operating current: 60mA Standby current: lOO^A Package - 40 pin DIP(600 mil) •44 pin PLCC 64Kx16 organization(JEDEC pin out) Single +5V power supply Fast access time: 120/150/200ns


    OCR Scan     		PDF MX23C1Q24 64Kx16 120/150/200ns MX23C1024 MX23C1024PC-12 MX23C1024PC-15 MX23C1024PC-20 MX23C1024QC-12 MX23C1024QC-15 MX23C1024QC-20