Untitled
Abstract: No abstract text available
Text: DATA SHEET SMP1345-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 2 Ω maximum @ 10 mA • Low total capacitance: 0.2 pF maximum @ 5 V • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1345-087LF:
J-STD-020)
SMP1345-087LF
201546E
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56QN50T18080
Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages
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SCEA032
56-Pin
56-terminal
MO-220,
56QN50T18080
Senju
MO-220-compliant
Theta JA of 64-pin BGA
56RGQ
senju solder paste
MO-220
SN74SSTV16859
IPC-9701
qfn jc jb
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1325-087LF:
J-STD-020)
SMP1325-087LF
201607D
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SE2432L
Abstract: No abstract text available
Text: DATA SHEET • Small QFN 24-pin, 3 x 4 mm package (MSL1, 260 °C per JEDEC-J-STD-020) Skyworks Green products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number
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SE2432L:
24-pin,
JEDEC-J-STD-020)
SQ04-0074.
201696E
SE2432L
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PDF
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Untitled
Abstract: No abstract text available
Text: DATA SHEET • SMP1371-087LF DIODE DATA SHEET SMP1371-087LF: Surface Mount PIN Diode Applications • Switches Features • Low-series resistance: 0.5 Ω maximum @ 10 mA • Low total capacitance: 1.2 pF maximum @ 20 V • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1371-087LF
SMP1371-087LF:
J-STD-020)
201289B
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PDF
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Solder bar of Senju M705
Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold
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SCBA017D
14/16/20-terminal
MO-241,
Solder bar of Senju M705
senju M31 GRN360
Senju
senju m31
JESD
Senju 7100 reflow profile
16QN50T23030
JESD 51-7, ambient measurement
qfn 32 land pattern
Senju paste 7100
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PDF
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SE2611T: 2.4 GHz High Efficiency Wireless LAN/BT Front End Applications • Simultaneous WLAN and Bluetooth receive mode Direct connection to battery with 3.3 V nominal supply Lead-free, halogen-free, ROHS compliant QFN 20-pin, 3 3 0.6 mm package (MSL1, 260 C per JEDEC J-STD020)
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SE2611T:
IEEE802
20-pin,
J-STD020)
SE2611T
202404B
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SMP1345-087
Abstract: SKY1345-087LF SMP1345-087LF
Text: DATA SHEET SMP1345-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 2 Ω maximum @ 10 mA • Low total capacitance: 0.2 pF maximum @ 5 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1345-087LF:
J-STD-020)
SMP1345-087LF
201546C
SMP1345-087
SKY1345-087LF
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PDF
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smp1345-087lf
Abstract: No abstract text available
Text: DATA SHEET SMP1345-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 2 Ω maximum @ 10 mA • Low total capacitance: 0.2 pF maximum @ 5 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1345-087LF:
J-STD-020)
SMP1345-087LF
201546B
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PDF
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pin diode application
Abstract: No abstract text available
Text: DATA SHEET SMP1324-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.75 Ω maximum @ 50 mA • Low total capacitance: 1.5 pF maximum @ 30 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1324-087LF:
J-STD-020)
SMP1324-087LF
SMP1324-087LF
201288B
pin diode application
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RS10
Abstract: RS100 SMP1325-087LF
Text: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1325-087LF:
J-STD-020)
SMP1325-087LF
SMP1325-087LF
01607A
RS10
RS100
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PDF
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1325-087LF:
J-STD-020)
SMP1325-087LF
201607B
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PDF
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SMP1325-087LF
Abstract: No abstract text available
Text: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 13.6 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1325-087LF:
J-STD-020)
SMP1325-087LF
201607C
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PDF
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SMP1324-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.75 Ω maximum @ 50 mA • Low total capacitance: 1.5 pF maximum @ 30 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1324-087LF:
J-STD-020)
SMP1324-087LF
201288C
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PDF
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smp1345-087lf
Abstract: No abstract text available
Text: DATA SHEET SMP1345-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 2 Ω maximum @ 10 mA • Low total capacitance: 0.2 pF maximum @ 5 V • Excellent thermal resistance: 75 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1345-087LF:
J-STD-020)
SMP1345-087LF
201546D
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PDF
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SMP1325-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.55 Ω maximum @ 100 mA • Low total capacitance: 0.6 pF maximum @ 20 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1325-087LF:
J-STD-020)
SMP1325-087LF
SMP1325-087LF
201607B
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PDF
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SMP1324-087LF: Surface Mount PIN Diode Applications • Switches • Attenuators Features • Low-series resistance: 0.75 Ω maximum @ 50 mA • Low total capacitance: 1.5 pF maximum @ 30 V • Excellent thermal resistance: 40 °C/W typical • QFN 2 x 2 mm package (MSL1, 260 °C per JEDEC J-STD-020)
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SMP1324-087LF:
J-STD-020)
SMP1324-087LF
201288D
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PDF
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16L-QFN
Abstract: 263 qfn EIA 481 QFN ALF sot-23-5
Text: REV: 0909-0707-01 Part Ⅰ Package Outline Drawing Part Ⅱ Carrier Tape Outline Drawing Part Ⅲ Reel Outline Drawing 1 Table of Contents Part Ⅰ - Package Outline Drawing DIPDIP-8 PACKAGE OUTLINE DRAWING - Ⅰ-1
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09-07REV:
-----------------------------------DIP-14
-----------------------------------DIP-16
-----------------------------------DIP-18
16L-QFN
263 qfn
EIA 481 QFN
ALF sot-23-5
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QFN "100 pin" PACKAGE
Abstract: JEDEC qfn tape QFN 3x4 SOT23 JEDEC standard orientation MP transistor SOIC16 SOIC24 SOIC28 TSSOP16 TSSOP28
Text: Tape & Reel Packaging for Automated Handling The Future of Analog IC Technology General Overview Surface mount products are available in Tape & Reel packaging. Below is a table of standard Tape & Reel configurations. These packages conform to EIA-481-1/2/3 and JEDEC standards. All products are lead
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EIA-481-1/2/3
TSOT23
QFN "100 pin" PACKAGE
JEDEC qfn tape
QFN 3x4
SOT23 JEDEC standard orientation
MP transistor
SOIC16
SOIC24
SOIC28
TSSOP16
TSSOP28
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EL5825
Abstract: EL5825IL EL5825IL-T13 EL5825IL-T7 EL5825ILZ EL5825ILZ-T13 EL5825ILZ-T7 EL5825IR QFN-24 lcd G42-88
Text: EL5825 Data Sheet June 24, 2005 • Rail-to-rail capability • Pb-Free plus anneal available RoHS compliant Applications • TFT-LCD drive circuits • Reference voltage generators Pinouts 2 SDO ENA 23 3 OSC OUTA 22 TAPE & REEL PKG. DWG. # EL5825IL 24-Pin QFN
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EL5825
24-PIN
EL5825IL
MDP0046
EL5825IL-T7
EL5825
EL5825IL
EL5825IL-T13
EL5825IL-T7
EL5825ILZ
EL5825ILZ-T13
EL5825ILZ-T7
EL5825IR
QFN-24 lcd
G42-88
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PDF
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ATMEL 740
Abstract: atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode
Text: Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ’s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer
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JESD97.
4845C
ATMEL 740
atmel 830
ATMEL Tape and Reel drawing
LQFP-44
ATMEL shipping label
atmel 0635
ATMEL Tape and Reel QFN-64
QFN-64
atmel 1030
pj 54 diode
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PDF
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AX5488
Abstract: MAX5488EUD T
Text: 19-3478; Rev 3; 1/07 KIT ATION EVALU E L B AVAILA Dual, 256-Tap, Nonvolatile, SPI-Interface, Linear-Taper Digital Potentiometers Features The MAX5487/MAX5488/MAX5489 dual, linear-taper, digital potentiometers function as mechanical potentiometers with a simple 3-wire SPI -compatible digital
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256-Tap,
MAX5487/MAX5488/MAX5489
MAX5487
MAX5488
MAX5489
35ppm/
AX5488
MAX5488EUD T
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PDF
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EL5825
Abstract: EL5825IL EL5825IL-T13 EL5825IL-T7 EL5825IR EL5825IR-T13 EL5825IR-T7
Text: EL5825 Data Sheet • Digital supply 3.3V to 5V • Low supply current of 8mA • Rail-to-rail capability Applications • TFT-LCD drive circuits • Reference voltage generators Pinouts ENA 23 3 OSC OUTA 22 TAPE & REEL PKG. NO. 4 VSD OUTB 21 EL5825IL 24-Pin QFN
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EL5825
24-PIN
EL5825
24-pin
EL5825IL
EL5825IL-T13
EL5825IL-T7
EL5825IR
EL5825IR-T13
EL5825IR-T7
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PDF
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jedec footprint MO-220 VHHD-2
Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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