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    JESD22-B111 DROP Search Results

    JESD22-B111 DROP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCR5RG28A Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 2.8 V, 500 mA, WCSP4F Visit Toshiba Electronic Devices & Storage Corporation
    TCR3DM18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 300 mA, DFN4 Visit Toshiba Electronic Devices & Storage Corporation
    TCR3DG18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 300 mA, WCSP4E Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR3RM28A Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 2.8 V, 300 mA, DFN4C Visit Toshiba Electronic Devices & Storage Corporation

    JESD22-B111 DROP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    JESD22-B117

    Abstract: Latch up test JESD78 JESD22-B111 DTS04169EN DTS04193EN JEDEC JESD22-B117 dts04193 QLT POWER IEC-68-2-21 JESD78
    Text: RF6280 Qualification Report Page 1 of 2 QLT-01087, Revision B Product Description A multi-functional power management unit DC‐DC converter Package Type WLCSP, 2 x 2 x 0.65 mm Process Technology Si Qualification # 06‐QUAL‐752 Date Issued


    Original     		PDF RF6280 QLT-01087, 06QUAL752 JESD22A108, JESD22A101, JESD22A114 QAL-04-1049 JESD22 JESD22-B117 Latch up test JESD78 JESD22-B111 DTS04169EN DTS04193EN JEDEC JESD22-B117 dts04193 QLT POWER IEC-68-2-21 JESD78

    JESD22-B111

    Abstract: ALIVH national semiconductor pb-free marking AN-1412 B111 JESD22 JESD22B111 400um ALIVH PCB
    Text: National Semiconductor Application Note 1412 June 2007 Table of Contents Introduction . Package Construction .


    Original     		PDF AN-1412 JESD22-B111 ALIVH national semiconductor pb-free marking AN-1412 B111 JESD22 JESD22B111 400um ALIVH PCB

    ALIVH

    Abstract: JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement
    Text: National Semiconductor Application Note 1412 June 9, 2009 Table of Contents Introduction . Package Construction .


    Original     		PDF AN-1412 ALIVH JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement

    IPC-6012

    Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel


    Original     		PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525

    IPC-6011

    Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications


    Original     		PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6011 IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222

    Untitled

    Abstract: No abstract text available
    Text: Product Qualification Package CGD944C 870 MHz, 25 dB Gain power doubler amplifier Rev. 02 — December 29, 2009 Document information Info Content Keywords Product Qualification Package Abstract This document presents the characteristics of CGD944C power doubler


    Original     		PDF CGD944C CGD944C

    JESD22-B111

    Abstract: LLP48 JESD22B111 AA36 multicore solder paste SN50A AA100 AA-36 super mole heraeus
    Text: Reliability of Chip Scale Packages under Mechanical Shock Loading T. T. Mattila1, P. Marjamäki1, L. Nguyen2, and J. K. Kivilahti1 1 Laboratory of Electronics Production Technology Helsinki University of Technology P.O. Box 3000, 02150 Espoo, Finland 2 National Semiconductor Corporation


    Original     		PDF JESD22-B111 100-bumps 36-bumps 48-leads gov/div898/handbook/, gov/div853/lead 20free/part1 LLP48 JESD22B111 AA36 multicore solder paste SN50A AA100 AA-36 super mole heraeus