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    JUNCTION TO CASE TEMPERATURE OF TO-3 PACKAGE Search Results

    JUNCTION TO CASE TEMPERATURE OF TO-3 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH022BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation

    JUNCTION TO CASE TEMPERATURE OF TO-3 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    P1900ME

    Abstract: P1400AD P1500ME P1800AD P1900NE P2300ME P3100AD P6002AD
    Text: Hemar AG, Fendler 50, 5524 Nesselnbach, Tel. +41 56 6183141 Fax. +41 56 6183142 http://www.hemar.ch CATV and HFC SIDACtor Device CATV and HFC SIDACtor Device 1 3 This SIDACtor device is a 1000 A solid state protection device offered in a TO-220 package. It protects equipment located in the severe surge environment of Community Antenna TV


    Original     		PDF O-220 P1400AD 160ecay O-220 P1900ME P1400AD P1500ME P1800AD P1900NE P2300ME P3100AD P6002AD

    DIODE P31B

    Abstract: P61a p31b diode p26b p31b p482a p-8cm DIODE P31A P06C diode p35b
    Text: This section presents complete electrical specifications for Teccor’s SIDACtor solid state overvoltage protection devices. DO-214AA Package Symbolization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3


    Original     		PDF DO-214AA DO-214AA F1250T F0500T F1250T F1251T DIODE P31B P61a p31b diode p26b p31b p482a p-8cm DIODE P31A P06C diode p35b

    WEDPN8M72V-XBX

    Abstract: AN0019
    Text: AN0019 White Electronic Designs APPLICATION NOTE PBGA THERMAL RESISTANCE CORRELATION INTRODUCTION CALIBRATION, MEASUREMENTS AND MODELING The thermal resistances for the Plastic Ball Grid Array PBGA Multi Chip Packages (MCP) published in WEDC data sheets are results from thermal modeling software


    Original     		PDF AN0019 WEDPN8M72V-XBX 128Mb AN0019

    Untitled

    Abstract: No abstract text available
    Text: ATS WHITE PAPER Device Thermal Coupling on a PCB THERMAL MINUTES Device Thermal Coupling on a PCB 1 to 5 mm Gap Insulation to Board or Insulation to Package Junction Temperature Board Temperature Thermocouple Soldered to Middle Lead Figure 1. Cross Section


    Original     		PDF JESD51-2, JESD51-6,

    SPRA953A

    Abstract: Theta-JC QFP die down Theta-JC plcc Theta-JC qfp Theta-JC 28 PLCC mgmt coolant temperature sensor outline of the heat sink for Theta JC dead bug heat slugs attach QFP PACKAGE thermal resistance
    Text: Application Report SPRA953A – June 2007 IC Package Thermal Metrics Darvin Edwards. ABSTRACT Many thermal metrics exist for integrated circuit IC packages ranging from θja to Ψjt.


    Original     		PDF SPRA953A SPRA953A Theta-JC QFP die down Theta-JC plcc Theta-JC qfp Theta-JC 28 PLCC mgmt coolant temperature sensor outline of the heat sink for Theta JC dead bug heat slugs attach QFP PACKAGE thermal resistance

    Untitled

    Abstract: No abstract text available
    Text: COMMERCIAL LASERS Diode Lasers, High Brightness 0.6 to 8.5 W, 8xx nm 24xx Series Key Features • 35 – 200 µm aperatures available • High-efficiency, MOCVD quantum well design • Open heat sink packages and encapsulated devices • High reliability The 24xx series diode lasers represent a breakthrough in high continuous wave


    Original     		PDF 498-JDSU 5378-JDSU 24XXDIODELASER

    diode A26C

    Abstract: schottky barrier type rectifier 30v 3a EP05Q04 xl marking sod-123 i50112
    Text: SILICON RECTIFIER DIODE EClODSl EClODS2 EClODS4 EClODS6 lA/lOO-600V FEATURES Surface Mount Device 0 Miniature Size, thigh Surge Capability OLOW Forward Voltage Drop OLOW Reverse Leakage Current ~Packagedin 12mm Tape and Reel oNot Rolling During Assembly Dimensions


    Original     		PDF lA/lOO-600V EC15QS03 EC15QS04 diode A26C schottky barrier type rectifier 30v 3a EP05Q04 xl marking sod-123 i50112

    p30b diode

    Abstract: p31b diode DIODE P31B Teccor P0080SC MC marking code DIODE P31A P06C diode p31b suppressor P3000AA61 p31b P31c
    Text: This section presents complete electrical specifications for Teccor’s SIDACtor solid state overvoltage protection devices. DO-214AA Package Symbolization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3


    Original     		PDF DO-214AA DO-214AA F1250T F0500T F1250T F1251T p30b diode p31b diode DIODE P31B Teccor P0080SC MC marking code DIODE P31A P06C diode p31b suppressor P3000AA61 p31b P31c

    jdsu optic switch

    Abstract: 808 nm 100 mw 2445-G1 laser diode for free space communication TO56 package Laser Diode 808 nm 5w CW laser diode 808 nm 2400150 TO-56 package laser diode 2455-G1
    Text: COMMERCIAL LASERS Diode Lasers, High Brightness 0.6 to 8.5 W, 8xx nm 24xx Series Key Features • 35 – 200 µm aperatures available • High-efficiency, MOCVD quantum well design • Open heat sink packages and encapsulated devices • High reliability The 24xx series diode lasers represent a breakthrough in high continuous wave


    Original     		PDF 498-JDSU 5378-JDSU 24XXDIODELASER jdsu optic switch 808 nm 100 mw 2445-G1 laser diode for free space communication TO56 package Laser Diode 808 nm 5w CW laser diode 808 nm 2400150 TO-56 package laser diode 2455-G1

    to56

    Abstract: No abstract text available
    Text: COMMERCIAL LASERS Diode Lasers, High Brightness 0.6 to 8.5 W, 8xx nm 24xx Series Key Features • 35 – 200 µm aperatures available • High-efficiency, MOCVD quantum well design • Open heat sink packages and encapsulated devices • High reliability The 24xx series diode lasers represent a breakthrough in high continuous wave


    Original     		PDF 498-JDSU 5378-JDSU 24XXDIODELASER to56

    heatsink design

    Abstract: pulse load calculation formula pulse load calculation formula for single pulse SC18
    Text: DISCTETE SEMICONDUCTORS DATA SHEET Chapter 5 Thermal considerations Discrete Semiconductor Packages File under Disctete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Thermal considerations Chapter 5 INTRODUCTION The perfect power switch is not yet available. All power


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: CHAPTER 5 THERMAL CONSIDERATIONS page Introduction 5-2 Part one: Thermal properties 5-2 Part two: Worked examples 5-7 Part three: Heat dissipation 5 - 15 Philips Semiconductors Discrete Semiconductor Packages Thermal considerations Chapter 5 INTRODUCTION The perfect power switch is not yet available. All power


    Original     		PDF

    AN1232

    Abstract: QFP PACKAGE thermal resistance micromechanical
    Text: MOTOROLA Order this document by AN1232/D SEMICONDUCTOR TECHNICAL DATA AN1232 Thermal Performance of Plastic Ball Grid Array PBGA Packages for Next Generation FSRAM Devices Prepared by: Shailesh Mulgaonker (APDC, Phoenix, AZ) and Bennett Joiner (APDPL, Austin, TX)


    Original     		PDF AN1232/D AN1232 AN1232/D* AN1232 QFP PACKAGE thermal resistance micromechanical

    diagram 3 phase heater

    Abstract: CR8CM-12A CR8CM-12A-A8 PRSS0004AA-A
    Text: CR8CM-12A Thyristor Medium Power Use REJ03G1707-0100 Rev.1.00 Jul 03, 2008 Features • IT AV : 8 A • VDRM : 600 V • IGT : 15 mA • Non-Insulated Type • Planar Passivation Type Outline RENESAS Package code: PRSS0004AA-A (Package name: TO-220) 4 2, 4


    Original     		PDF CR8CM-12A REJ03G1707-0100 PRSS0004AA-A O-220) diagram 3 phase heater CR8CM-12A CR8CM-12A-A8 PRSS0004AA-A

    CR6CM-12A

    Abstract: diagram 3 phase heater CR6CM-12A-A8 PRSS0004AA-A
    Text: CR6CM-12A Thyristor Medium Power Use REJ03G1706-0100 Rev.1.00 Jul 03, 2008 Features • IT AV : 6 A • VDRM : 600 V • IGT : 10 mA • Non-Insulated Type • Planar Passivation Type Outline RENESAS Package code: PRSS0004AA-A (Package name: TO-220) 4 2, 4


    Original     		PDF CR6CM-12A REJ03G1706-0100 PRSS0004AA-A O-220) CR6CM-12A diagram 3 phase heater CR6CM-12A-A8 PRSS0004AA-A

    IRK E78996 701819-303ac

    Abstract: IR E78996 105 IRK E78996 p432 I27900 TO-240AA weight
    Text: Bulletin I27140 rev. E 10/02 IRK.56, .71 SERIES ADD-A-pakTM GEN V Power Modules STANDARD DIODES Features Benefits High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage


    Original     		PDF I27140 E78996 3500VRMS O-240AA Al203 IRK E78996 701819-303ac IR E78996 105 IRK E78996 p432 I27900 TO-240AA weight

    QFP PACKAGE thermal resistance

    Abstract: SPRA953 Theta-JC plcc qfp132
    Text: Application Report SPRA953 − December 2003 IC Package Thermal Metrics SC Packaging Development ABSTRACT Many thermal metrics exist for IC packages ranging from θja to Ψjt. Often, these thermal metrics are misapplied by customers who try to use them to estimate junction temperatures


    Original     		PDF SPRA953 QFP PACKAGE thermal resistance Theta-JC plcc qfp132

    CECC00802

    Abstract: THCA
    Text: VISHAY Vishay Semiconductors Assembly Instructions General Vishay offers a wide product selection of optocouplers and solid state relays in a variety of packages. This document provides instructions on mounting for the different types of packages, specifically on the different methods of soldering. For DIP packages, they


    Original     		PDF 10-Dec-03 CECC00802 THCA

    MC33275

    Abstract: MC33275D 27533 27550 27533G 27550G 27525G MC33275DT-5.0G 27530G sot-223 body marking D K Q F
    Text: MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount packages. These devices feature a very low quiescent current and are


    Original     		PDF MC33275, NCV33275 MC33275 OT-223, MC33275/D MC33275D 27533 27550 27533G 27550G 27525G MC33275DT-5.0G 27530G sot-223 body marking D K Q F

    marking 27530

    Abstract: 27533
    Text: MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount packages. These devices feature a very low quiescent current and are


    Original     		PDF MC33275, NCV33275 MC33275 MC33275/D marking 27530 27533

    27533G

    Abstract: 27550G 27525G 27530G 27550 27533 27530 marking 27550 MC33275 NCV33275
    Text: MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount packages. These devices feature a very low quiescent current and are


    Original     		PDF MC33275, NCV33275 MC33275 OT-223, MC33275/D 27533G 27550G 27525G 27530G 27550 27533 27530 marking 27550 NCV33275

    marking 27533

    Abstract: marking 27550 27533 27533G 27550G 27550 27525g MC33275
    Text: MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK, and DFN 4x4 surface mount packages. These devices feature a very low quiescent current and are


    Original     		PDF MC33275, NCV33275 MC33275 OT-223, MC33275/D marking 27533 marking 27550 27533 27533G 27550G 27550 27525g

    27533

    Abstract: marking 37525 37525 QFN8 37530 marking 27550 MC3327DT-3
    Text: MC33275, MC33375, NCV33275 Product Preview 300 mA, Low Dropout Voltage Regulator http://onsemi.com The MC33275 and MC33375 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT−223, SOP−8, DPAK and QFN−8, 4x4 surface


    Original     		PDF MC33275, MC33375, NCV33275 MC33275 MC33375 OT-223, BRD8011/D. 27533 marking 37525 37525 QFN8 37530 marking 27550 MC3327DT-3

    7834a

    Abstract: No abstract text available
    Text: Tem ic S e m i c o n d u c t o r s Taping of SMD Couplers TEMIC couplers in SMD packages are available in an anti­ static 12 mm blister tape in accordance with DIN IEC 286-3 for automatic component insertion. The blister tape is a plastic strip with impressed component


    OCR Scan     		PDF TCMT1020GS12. 7834a