G9230-01
Abstract: KIRD1055E02 SE-171
Text: PHOTODIODE InGaAs PIN photodiode G9230-01 Uses small package with no wire Features Applications l Easy to handle since there are no wires on chip AnSn eutectic bonding Optical fibers can be brought closer to the chip l Miniature package: 2 x 2 × 1 mm l High sensitivity: 0.95 A/W Typ. (λ=1.55 µm)
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Original
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G9230-01
SE-171
KIRD1055E02
G9230-01
KIRD1055E02
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PDF
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InGaas PIN photodiode chip back illuminated
Abstract: G9230-01 KIRD1055E02 SE-171
Text: PHOTODIODE InGaAs PIN photodiode G9230-01 Back-illuminated type, uses package with no wire Features Applications l Back-illuminated type l Easy to handle since there are no wires on chip AnSn eutectic bonding Optical fibers can be brought closer to the chip
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Original
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G9230-01
SE-171
KIRD1055E02
InGaas PIN photodiode chip back illuminated
G9230-01
KIRD1055E02
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PDF
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Untitled
Abstract: No abstract text available
Text: PHOTODIODE InGaAs PIN photodiode G9230-01 Back-illuminated type, uses package with no wire Features Applications l Back-illuminated type l Easy to handle since there are no wires on chip AnSn eutectic bonding Optical fibers can be brought closer to the chip
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Original
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G9230-01
Spectr8152-3750,
SE-171
KIRD1055E02
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PDF
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Untitled
Abstract: No abstract text available
Text: PHOTODIODE InGaAs PIN photodiode G9230-01 Back-illuminated type, uses package with no wire Features Applications l Back-illuminated type l Easy to handle since there are no wires on chip AnSn eutectic bonding Optical fibers can be brought closer to the chip
|
Original
|
G9230-01
Spectr8152-3750,
SE-171
KIRD1055E02
|
PDF
|
Untitled
Abstract: No abstract text available
Text: PHOTODIODE InGaAs PIN photodiode G9230-01 Back-illuminated type, uses package with no wire Features Applications l Back-illuminated type l Easy to handle since there are no wires on chip AnSn eutectic bonding Optical fibers can be brought closer to the chip
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Original
|
G9230-01
SE-171
KIRD1055E02
|
PDF
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