Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    KOSTAT TRAY 2 X 2.5 Search Results

    KOSTAT TRAY 2 X 2.5 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation

    KOSTAT TRAY 2 X 2.5 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    KS-886H

    Abstract: Kostat tray
    Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive


    Original     		PDF AN-657-1 KS-886H Kostat tray

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    IC TRAY DATASHEETS KOSTAT

    Abstract: Voice-Direct-364 Kostat Kostat tray SPEECH DIALER SD 2000 IC TRAY KOSTAT JEDEC Kostat Speech Recognition IC block diagram of speech recognition 24C65
    Text: Voice Direct 364 Data Book  Sensory, Inc. P/N 80-0179-F Table of Contents Copyright  Copyright 2000, Sensory, Inc. You may not copy, modify, or translate this document or any part of this document. Nor can you reduce any part of it to any machine-readable form.


    Original     		PDF 80-0179-F 1N4148 IC TRAY DATASHEETS KOSTAT Voice-Direct-364 Kostat Kostat tray SPEECH DIALER SD 2000 IC TRAY KOSTAT JEDEC Kostat Speech Recognition IC block diagram of speech recognition 24C65

    Kostat tray

    Abstract: JEDEC Kostat Kostat KS-6100 package tray design dwg kostat 6 x 6 Kostat KS-6110 ks 1060 88051 Kostat KS-6120
    Text: KOSTAT 7.62 322.6±0.5 m 315.0 6.35 |«>| 0.20 H |A I X | DETAILV 1.” DETAILf t H I'i he l'Ë i'i hi IEhi I-E YE I '”I hi i. m 1 . “ I1;: -L m m |<H 0.20 ® 92,1 |A I X @ | EHHEHHEH jijj • ■m mg i m î-U 311.66 a s 135.9 m m m* B U S H S Ë ÎS s iH


    OCR Scan     		PDF 00x15EA 30DETAIL Kostat tray JEDEC Kostat Kostat KS-6100 package tray design dwg kostat 6 x 6 Kostat KS-6110 ks 1060 88051 Kostat KS-6120

    Kostat tray

    Abstract: Kostat kostat 6 x 6 Kostat KS-6120 KS-87063 Kostat tray 2 X 2.5 shipping tray MSC-4901 Kostat 87063 MSA-3032
    Text: REVISIONS REV 02 03 D ESC RIP TIO N DATE CHANGE TO 140 deq C TRAY ADDED NEW PACKAGE - LG/LGG 64 APPROVED KK Thee KK Thee 03/28/08 05/20/09 7.62 6.35 DETAIL "F" V - œ i 4x2-R2.54 i T7- EEH 1 £ 7 0.76 - A - TRAY STACKING DETAIL LGA 9.0mm x 9.0mm KS - 87063


    OCR Scan     		PDF MSC17011 MSC-4901 Kostat tray Kostat kostat 6 x 6 Kostat KS-6120 KS-87063 Kostat tray 2 X 2.5 shipping tray MSC-4901 Kostat 87063 MSA-3032