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    LAND PATTERN FOR TSOP Search Results

    LAND PATTERN FOR TSOP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    LAND PATTERN FOR TSOP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		PDF OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100

    land pattern for TSOP

    Abstract: land pattern for TSOP 2 land pattern for TSOP 2 50 TSOP 50 Package land pattern for tsop package
    Text: Recommended Land Pattern for SST TSOP Devices Recommended Land Pattern for SST TSOP Devices Application Note October 2001 INTRODUCTION Designing in the 8mm x 14mm TSOP Package SST offers an 8mm x 14mm TSOP package for our bulk erase, Byte-Program SuperFlash MTP products and the


    Original     		PDF S72015-02-000 land pattern for TSOP land pattern for TSOP 2 land pattern for TSOP 2 50 TSOP 50 Package land pattern for tsop package

    land pattern for TSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,


    Original     		PDF OT-23 O-263 MA05A land pattern for TSOP TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100

    1206 land pattern

    Abstract: NOMCA MPMA HTRN
    Text: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin


    Original     		PDF IPC-SM-782 M/D55342 12-Jun-15 1206 land pattern NOMCA MPMA HTRN

    Untitled

    Abstract: No abstract text available
    Text: UM5304EEXF Quad Channel Low Capacitance ESD Protection Array UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 General Description UM5304EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been


    Original     		PDF UM5304EEXF UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 UM5304EEXF

    Untitled

    Abstract: No abstract text available
    Text: UM5304EEXF Quad Channel Low Capacitance ESD Protection Array UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 General Description UM5304EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been


    Original     		PDF UM5304EEXF UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 UM5304EEXF

    Untitled

    Abstract: No abstract text available
    Text: UM5204EEXF Quad Channel Low Capacitance ESD Protection Array UM5204EEAF UM5204EEBF UM5204EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 General Description UM5204EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been


    Original     		PDF UM5204EEXF UM5204EEAF UM5204EEBF UM5204EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 UM5204EEXF

    land pattern for TSOP

    Abstract: 7402 DATA SHEET 7402 land pattern for TSOP 2
    Text: TSOP 1 LAND PATTERN DIMENSIONS CONDITIONAL TERMINAL : LENGTH OF SOLDERED PART (Lp) I2 β1 MID HD+2 β 2 Lp β2 b b2 Dimension Parameter e 0.50 β1 β2 γ 0.20 0.20 0.25 e b2 L1 MID A3=0.25 HD D I2 GDMIN. =HDMIN. −2Lp MAX. MID=GDMIN. −2 β 1 I2 (HDMAX. +2 β 2 −MID)/2


    Original     		PDF ED-7402-3 land pattern for TSOP 7402 DATA SHEET 7402 land pattern for TSOP 2

    land pattern for TSOP

    Abstract: 7402 ED-7402 DATA SHEET 7402 7402 data sheet ed 012GL 2008 land pattern for TSOP 2
    Text: TSOP 1 LAND PATTERN DIMENSIONS CONDITIONAL TERMINAL : LENGTH OF SOLDERED PART (L) HD D I2 β1 MID HD+2 β 2 β2 L b b2 Dimension Parameter e 0.50 β1 β2 γ 0.20 0.20 0.25 b2 e L1 MID I2 GDMIN. =HDMIN. −2LMAX. MID=GDMIN. −2 β 1 I2 (HDMAX. +2 β 2−MID)/2


    Original     		PDF ED-7402-3 land pattern for TSOP 7402 ED-7402 DATA SHEET 7402 7402 data sheet ed 012GL 2008 land pattern for TSOP 2

    land pattern for TSOP

    Abstract: land pattern for TSOP 2
    Text: TSOP 2 LAND PATTERN DIMENSIONS CONDITIONAL TERMINAL : LENGTH OF SOLDERED PART (L) HE E I2 β1 MIE HE+2 β 2 L β2 b b2 Dimension Parameter e 1.27 0.80 β1 β2 γ 0.20 0.20 0.30 to 0.57 0.20 0.20 0.30 b2 e L1 MIE I2 GEMIN. =HEMIN. −2LMAX. MIE=GEMIN. −2β 1


    Original     		PDF ED-7402-4A land pattern for TSOP land pattern for TSOP 2

    land pattern for TSOP

    Abstract: land pattern for TSOP 2
    Text: TSOP 2 LAND PATTERN DIMENSIONS CONDITIONAL TERMINAL : LENGTH OF SOLDERED PART (Lp) I2 β1 MIE HE+2 β 2 Lp β2 b b2 Dimension Parameter e 1.27 0.80 β1 β2 γ 0.20 0.20 0.30 to 0.57 0.20 0.20 0.30 e b2 L1 MIE A3=0.25 HE E I2 GEMIN. =HEMIN. −2Lp MAX. MIE=GEMIN. −2 β 1


    Original     		PDF ED-7402-4A land pattern for TSOP land pattern for TSOP 2

    LPC2468 reflow solder profile

    Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,


    Original     		PDF AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross

    PCB layout guidelines for NXP MCUs in BGA packages

    Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,


    Original     		PDF AN10778 LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, PCB layout guidelines for NXP MCUs in BGA packages LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern

    land pattern for TSOP

    Abstract: land pattern for TSOP 2 SO32-S-L-01 SO32B
    Text: 17.78 [0.700"] 1 Top View 0.5 [0.020"] 32 1.27 [0.050"] 0.64 [0.025"] 0.3 [0.012"] 17 16 9.22 [0.363"] 1.59 [0.063"] 13 [0.512"] 24.13 [0.950"] 1 6.39 [0.252"] Front View 2 1 16 17 9.65 [0.380"] 6.61 [0.260"] Side View 1 32 7.88 [0.310"] Bottom View Description: SOIC TSOP II to SOIC (TSOP I) Package Converter


    Original     		PDF SO32B) SO32E) PC-SO/SO32-S-L-01 com121 SO32-S-L-01 FR4/G10 land pattern for TSOP land pattern for TSOP 2 SO32B

    land pattern for TSSOP-8

    Abstract: PowerPAK 1212-8 tssop8 thermal performance land pattern for TSSOP land pattern for ppak land pattern for TSOP TSSOP-8 footprint TSOP 48 thermal resistance so-8 vishay weight PowerPAK SO-8
    Text: AN822 Vishay Siliconix PowerPAK 1212 Mounting and Thermal Considerations Johnson Zhao MOSFETs for switching applications are now available with die on resistances around 1 mΩ and with the capability to handle 85 A. While these die capabilities represent a major advance over what was available


    Original     		PDF AN822 i212-8 03-Mar-06 land pattern for TSSOP-8 PowerPAK 1212-8 tssop8 thermal performance land pattern for TSSOP land pattern for ppak land pattern for TSOP TSSOP-8 footprint TSOP 48 thermal resistance so-8 vishay weight PowerPAK SO-8

    TK12A10K3

    Abstract: tk12a10k TK33A60V TPCA*8065 TK40E10K3 SSM6K407TU TPCA*8064 tk6a65d equivalent TPCA*8036 TK100G10N1
    Text: Semiconductor Catalog 2012-3 MOSFETs SEMICONDUCTOR & STORAGE PRODUCTS http://www.semicon.toshiba.co.jp/eng C O N T E N T S 1 Features and Structures . 3 2 Toshiba’s MOSFET Product Lines and Part Numbering Schemes. 4


    Original     		PDF

    INTEL application notes

    Abstract: land pattern BGA 0.75 PCB design for very fine pitch csp package land pattern for TSOP 2 1mm pitch BGA socket land pattern for TSOP BGA reflow guide pcb thermal Design guide trace theta layout micro pitch BGA socket s1 SOLDER PROFILE
    Text: 5.0 5.1 5.2.1 MANUFACTURING CONSIDERATIONS SMT Process Many factors contribute to a high yielding assembly process. A few of the key focus areas and their contributing factors are highlighted in Table 7. 5.2 PCB Design Guidelines One of the key efforts in implementing the


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Si7818DN Vishay Siliconix N-Channel 150-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 150 ID (A) 0.135 at VGS = 10 V 3.4 0.142 at VGS = 6 V 3.3 Qg (Typ.) 20 nC • Halogen-free According to IEC 61249-2-21 Available • PWM-Optimized TrenchFET Power MOSFET


    Original     		PDF Si7818DN Si7818DN-T1-E3 Si7818DN-T1-GE3 11-Mar-11

    Untitled

    Abstract: No abstract text available
    Text: Si7913DN Vishay Siliconix Dual P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) (Ω) ID (A) 0.037 at VGS = - 4.5 V - 7.4 - 20 0.048 at VGS = - 2.5 V - 6.5 0.066 at VGS = - 1.8 V - 55 • Halogen-free According to IEC 61249-2-21 Available


    Original     		PDF Si7913DN Si7913DN-T1-E3 Si7913DN-T1-GE3 11-Mar-11

    Untitled

    Abstract: No abstract text available
    Text: Si7900AEDN Vishay Siliconix Dual N-Channel 20-V D-S MOSFET, Common Drain FEATURES PRODUCT SUMMARY VDS (V) RDS(on) (Ω) ID (A) 0.026 at VGS = 4.5 V 8.5 20 0.030 at VGS = 2.5 V 8 0.036 at VGS = 1.8 V 7 • Halogen-free Option Available • TrenchFET Power MOSFET: 1.8 V Rated


    Original     		PDF Si7900AEDN Si7900AEDN-T1-E3 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    Untitled

    Abstract: No abstract text available
    Text: Si7414DN Vishay Siliconix N-Channel 60-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) 60 RDS(on) (Ω) ID (A) 0.025 at VGS = 10 V 8.7 0.036 at VGS = 4.5 V 7.3 • Halogen-free According to IEC 61249-2-21 Available • TrenchFET Power MOSFET • PWM Optimized


    Original     		PDF Si7414DN Si7414DN-T1-E3 Si7414DN-T1-GE3 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12

    Untitled

    Abstract: No abstract text available
    Text: Si7415DN Vishay Siliconix P-Channel 60-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) (Ω) - 60 ID (A) 0.065 at VGS = - 10 V - 5.7 0.110 at VGS = - 4.5 V - 4.4 • Halogen-free According to IEC 61249-2-21 Available • TrenchFET Power MOSFET • Fast Switching


    Original     		PDF Si7415DN Si7415DN-T1-E3 Si7415DN-T1-GE3 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    Untitled

    Abstract: No abstract text available
    Text: Si7820DN Vishay Siliconix N-Channel 200 V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) 200 RDS(on) () ID (A) 0.240 at VGS = 10 V 2.6 0.250 at VGS = 6 V 2.5 Qg (Typ.) 12.1 PowerPAK 1212-8 APPLICATIONS S 3.30 mm • Primary Side Switch - Telecom Power Supplies


    Original     		PDF Si7820DN 2002/95/EC Si7820DN-T1-E3 Si7820DN-T1-GE3 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    land pattern for PSOP

    Abstract: No abstract text available
    Text: Plastic dual in-line package PDIP 20 pin 300 mil Min A Al B b c D E El c tA L a S 0.010 0.046 0.018 0.008 28 pin 300 mil Max 0.175 0.054 0.024 0.014 0.980 0.310 0.290 0.263 0.293 0.100 BSC 0.310 0.3S0 0.130 0.110 0° 15° 0.040 Min 0.010 0.0.58 0.016 C.008


    OCR Scan     		PDF MS-016 1-10007-A. land pattern for PSOP