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    LAND PATTERN PQFP 48 Search Results

    LAND PATTERN PQFP 48 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HSDC-EXTMOD03B-DB Renesas Electronics Corporation Digital Pattern Generation board for High-speed JESD204B DACs Visit Renesas Electronics Corporation
    R7FS5D57A2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    R7FS5D57C2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    UPA2371T1P-E1-A Renesas Electronics Corporation Nch Dual Power Mosfet 24V 6A 20Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
    UPA2351T1P-E4-A Renesas Electronics Corporation Nch Dual Power Mosfet 30V 5.7A 40Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation

    LAND PATTERN PQFP 48 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    land pattern for TSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,


    Original     		OT-23 O-263 MA05A land pattern for TSOP TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100 PDF

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100 PDF

    44-pin plcc pcb mount footprint

    Abstract: PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X
    Text: 7 Logic Analyzers and Accessories 7 Logic Analyzers and Accessories Logic Analyzers and Accessories Logic Analyzers and Accessories DS00104F-page 7-1  2001 Microchip Technology Inc. Logic Analyzers and Accessories Section 7 Logic Analyzers and Accessories


    Original     		DS00104F-page PIC12CXXX, PIC14C000, PIC16CXXX PIC17CXXX 28C64ASO 28C64AK PIC16C55SW W9711 44-pin plcc pcb mount footprint PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X PDF

    mp3 usb fm circuit with remote

    Abstract: lqfp pcb LAYOUT sanyo DA11 sanyo DA11 circuit diagram mmc cARD PCB FOOTPRINT usb mp3 lcd fm land pattern PQFP 208 ES4810SAA samsung lcd panel circuit diagram free servo control PCB diagram
    Text: ES4810SAA Digital Audio Processor Product Brief PRELIMINARY ESS Technology, Inc. DESCRIPTION FEATURES The ES4810SAA Digital Audio Processor DAP 3 is an SOC chip designed for automotive audio applications. It integrates a servo controller, RF amplifier, servo DSP,


    Original     		ES4810SAA ES4810SAA ES4810 ISO9660, FAT32. SAM0660-080406 mp3 usb fm circuit with remote lqfp pcb LAYOUT sanyo DA11 sanyo DA11 circuit diagram mmc cARD PCB FOOTPRINT usb mp3 lcd fm land pattern PQFP 208 samsung lcd panel circuit diagram free servo control PCB diagram PDF

    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


    Original     		PDF

    Ablebond 8380

    Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716
    Text: Advanced Package Applications: Tape Carrier Package 12.1 12 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is


    Original     		ANSI/J-STD-001, Ablebond 8380 X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716 PDF

    Ablebond 8380

    Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide
    Text: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These


    Original     		PDF

    Ablebond 8380

    Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
    Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that


    Original     		CH12WIP Ablebond 8380 smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping PDF

    ablebond 8380

    Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
    Text: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized


    Original     		IPC-SM-782A J-STD-001 ablebond 8380 land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING PDF

    1190E

    Abstract: IPC-SM-782 MS-016 23-12J
    Text: All Package Diagrams Š Š 3DFNDJH GLDJUDPV 3ODVWLF GXDO LQOLQH SDFNDJH 3',3 20-pin 300 mil Min Max A 0.175 A1 0.010 B 0.046 0.054 b 0.018 0.024 c 0.008 0.014 D 0.980 E 0.290 0.310 E1 0.263 0.293 e 0.100 BSC eA 0.310 0.350 L 0.110 0.130 α 0° 15° S 0.040


    Original     		20-pin 28-pin 32-pin 1190E IPC-SM-782 MS-016 23-12J PDF

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


    Original     		PDF

    programming smt machine

    Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and


    Original     		PDF

    D2863-77

    Abstract: Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208
    Text: GENERAL INFORMATION Packages INTRODUCTION P lastic surface-mount package designs were developed in the late 1970s in answer to the demand for costeffective solutions to achieving greater board density without sacriÞcing reliability or functionality. Recent developments in these


    Original     		1970s D2863-77 Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208 PDF

    Intel reflow soldering profile BGA

    Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
    Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.


    Original     		conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment PDF

    land pattern for TSOP 2 54 pin

    Abstract: land pattern for TSOP 56 pin TSOP 54 land pattern 40013A land pattern for TSOP
    Text: n H igh p e rfo rm a n c e 1 M X 8 /5 1 2 K X 1 6 2.2V CMOS Flash EEPROM AS29LL8ÜÖ II 1 M X 8 / 5 1 2 K X 1 6 CMOS Flash EPROM Advance information Features •O rganization: 1M x 8/512K x 16 • Sector architecture - • Low power consumption - 8 mA typical read current


    OCR Scan     		AS29LL8Ü 8/512K 48-pin land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin TSOP 54 land pattern 40013A land pattern for TSOP PDF

    TQFP 14X20 land

    Abstract: land pattern for TSOP 2 54 pin 64KX32 SOJ 44 PCB land TSOP 1826 land pattern tsop 66
    Text: High performance 6 4 K x 52 CMOS SRAM » AS7CÌ643 2 II A 6 4 K x 3 2 Synchronous burst S R A M Features • F low -th rou gh o p tio n • Fast clock in g speed: 1 0 0 / 8 3 / 6 6 MHz • Fast clock to data access: 5 / 6 / 7 ns • S elf-tim ed w rite cycle


    OCR Scan     		64Kx5 64Kx32 1-10007-A. T00344C] TQFP 14X20 land land pattern for TSOP 2 54 pin SOJ 44 PCB land TSOP 1826 land pattern tsop 66 PDF

    AS7C36432-7QC

    Abstract: 2227S
    Text: Features 1 A sy n c h ro n o u s o u tp u t e n a b le c o n tro l • O rg a n iz a tio n : 6 5 ,5 3 6 w o r d s x 32 b its ADSP, ADSC, ADV, M O DE b u rst c o n tro l p in s • Fully s y n c h ro n o u s p ip e lin e d o p e ra tio n • F lo w -th ro u g h o p tio n


    OCR Scan     		AS7C36432 512KB W57C36432-6QC \S7C36432-6TQ AS7C36432-7QC AS7C36432-7TQC 1-20001-A. 2227S PDF

    3232F-7

    Abstract: PQFP dimension intel MI-003 pqfp 14x20 100pin
    Text: H igh Perform ance 32KX32 CM O S SRAM AS7C33232F 3 2 K X 3 2 Synchronous burst SRA M Preliminary information Features • • • • • • • • Organization: 32,768 words x 32 bits Fully synchronous pipelined operation Flow-through or pipelined Fast clocking speed: 1 0 0 /7 5 /6 6 MHz


    OCR Scan     		32KX32 AS7C33232F AS7C3323 256KB 512KB AS7C33232F 2321-6QC 3232F-7QC 3232F-7 PQFP dimension intel MI-003 pqfp 14x20 100pin PDF

    as7c36432-6qc

    Abstract: 64KX32 tqfp 64 pcb land pattern TQFP 14X20 land
    Text: H ig h P e rfo rm a n c e 64K X 32 C M O S SRAM « II J J i A S7C 36432 6 4 K X 3 2 Synchronous burst SRAM Preliminary information Features • • • * * * * • Organization: 65,536 words x 32 bits Fully synchronous pipelined operation Flow-through option


    OCR Scan     		AS7C36432 64KX32 7C36432-S S12KB AS7C36432 AS7C36432-5QC AS7C36432-6QC AS7C3643 as7c36432-6qc tqfp 64 pcb land pattern TQFP 14X20 land PDF

    Untitled

    Abstract: No abstract text available
    Text: II High p e rfo rm an c e 6 4 K x 52 » A S7CÌ643 2 CM O S SRAM A 6 4 K x 3 2 Synchronous burst S R A M Features • F low -th rou gh op tion • Fast clo ckin g sp e ed : 1 0 0 / 8 3 / 6 6 M H z • Fast clock to d ata access: 5 / 6 / 7 ns • Self-tim ed w rite cycle


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: H ig h P e rf o rm a n c e 32K x32 C M O S SRA M •■ A S7C 33232F II 3 2 K x 3 2 Synchronous bu rst SRAM Prelim inary information • O rganization: 32,768 w ords x 32 bits • Fully synchronous pipelined operation • F low -through o r pipelined • Fast clocking speed: 1 0 0 /7 5 /6 6 MHz


    OCR Scan     		33232F S7C33232F 256KB 512KB i003M4, 33232F 3232F PDF

    Untitled

    Abstract: No abstract text available
    Text: H igh Perform ance lMx4 CMOS DRAM |B AS4C14405 A ! M x 4 CMOS EDO DRAM Preliminary information Features • O r g a n iz a t io n : 1 , 0 4 8 , 5 7 6 w o r d s x 4 b its • 1 0 2 4 r e f r e s h c y c le s , 1 6 m s r e f r e s h in t e r v a l • H ig h sp e ed


    OCR Scan     		AS4C14405 PDF

    land pattern for TSOP 2 54 pin

    Abstract: TSOP 54 land pattern AS7C1024 AS7C31024 land pattern for TSOP 2 44 PIN
    Text: H igh P erfo rm an ce •■ 128Kx8 A S7C 1024 A S7C 31024 H CMOS SRAM 1 2 8 K X 8 CM O S SRAM C o m m o n I / O Features • O rg a n iz a tio n : 1 3 1 ,0 7 2 w o rd s x 8 b its • H ig h sp e ed - 3 0 0 m il PDIP a n d SOJ - 1 0 / 1 2 / 1 5 / 2 0 n s ad d ress access tim e


    OCR Scan     		AS7C1024 128Kx8 AS7C31024 32-pin 7C512 64Kx8) 2S6/272 1-10007-A. T00344C] land pattern for TSOP 2 54 pin TSOP 54 land pattern land pattern for TSOP 2 44 PIN PDF

    Untitled

    Abstract: No abstract text available
    Text: H ig h P e r f o r m a n c e 64K X 32 C M O S SRA M n II A S7C 36432 6 4 K X 3 2 Synchronous burst SRAM Preliminary information • O r g a n iz a tio n : 6 5 , 5 3 6 w o r d s x 3 2 b its • A s y n c h r o n o u s o u t p u t e n a b le c o n tr o l • F u lly s y n c h r o n o u s p ip e lin e d o p e r a tio n


    OCR Scan     		c1DD344c 0fic13 S7C36432 AS7C36432 AS7C36432-5QC AS7C36432-6QC AS7C36 32-7QC AS7C36432-STQC AS7C36432-6TQC PDF