lchb
Abstract: transistor smd marking NA sot-23 smd marking laya SMD c3
Text: LP2985LV LP2985LV Micropower 150 mA Low-Noise Low-Dropout Regulator in SOT-23 and micro SMD packages for Applications with Output Voltages 2.0V Designed for Use with Very Low EESR Output Capacitors Literature Number: SNOS510O LP2985LV Micropower 150 mA Low-Noise Low-Dropout Regulator in
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LP2985LV
LP2985LV
OT-23
SNOS510O
lchb
transistor smd marking NA sot-23
smd marking laya
SMD c3
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Abstract: No abstract text available
Text: _diode2014-02.ec9 Page:18 Date: 2014/01/30 Thu 16:49:51 Si ngl eZenerDi ode PowerZenerDi ode •外観図 ST02120F1 OUTLI NE Package：1F 120V t ：mm Uni 特 長 煙１ Wクラス 煙小型 SMD 煙車載用途も対応可能 U1 00 00 ① 品名略号 Type No.
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diode2014-02
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Text: 信昌電子陶瓷股份有限公司 Prosperity Dielectrics Co., Ltd. No. 148, Chang-An Road, Sec 1,Lu-Tsu Shiang, Taoyuan, Taiwan, ROC. Tel.：886-3-3224471 Fax：886-3-3212216 SPECIFICATION FOR APPROVAL DATE: CUSTOMER: PART NAME: LIMITED COMPANY Lead Free High Voltage Power Chip Resistors
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C5201-1
1000MÎ
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Abstract: No abstract text available
Text: LP2985LV Micropower SOT, 150 mA Low-Noise Low-Dropout Regulator for Applications with Output Voltages < 2V Designed for Use with Very Low ESR Output Capacitors General Description Features The LP2985LV is a 150 mA, fixed-output voltage regulator designed to providehigh performance and low noise in applications requiring output voltages < 2V.
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LP2985LV
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smd marking laya
Abstract: No abstract text available
Text: LP2985LV Micropower 150 mA Low-Noise Low-Dropout Regulator in SOT-23 and micro SMD packages for Applications with Output Voltages ≤ 2.3V Designed for Use with Very Low ESR Output Capacitors General Description Features The LP2985LV is a 150 mA, fixed-output voltage regulator
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LP2985LV
OT-23
smd marking laya
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Abstract: No abstract text available
Text: Page:42 Date: 2011/02/17 Thu 14:01:45 Si ngl eZenerDi ode PowerZenerDi ode OUTLI NE ST0433F1 Uni tmm Package 1F カソードマーク Cathode mark ① W SMD TB 00 00 33V400W 品名略号 Type No. ② ロット記号 （例） Date code Feat ur e ２.５ Title:diode-A.ec9
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Text: Page:42 Date: 2011/02/17 Thu 14:01:45 Si ngl eZenerDi ode PowerZenerDi ode •外観図 ST0433F1 OUTLI NE Package：1F t ：mm Uni カソードマーク Cathode mark 特 長 ① 煙１ Wクラス 煙小型 SMD 煙車載用途も対応可能 TB 00 00 33V400W
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Text: 4,15 \ _ I ' T Tape on Reel Packaging V e r p a c k t in G u r tv e rp a c k u n g - Verpacljungseinheit: 4 2 0 Stück - Packaging unit• 420 pcs CO m ' — 32,5 Abspuirichtunq - Reel o ff Direction Le ite rp la tte n -La yo u t / P C B -Layaut Information
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Abstract: No abstract text available
Text: 5,85 4 ,6 Tape on Reel Packaging V E r p Q c k t in G u r tv e rp a c k u n g - V erp ackungseinheit: 4 2 0 Stück - Packaging unit: 42 0 pcs 0,15 3 2 ,5 AbspuLrichtunq - Reel o ff Direction L Le ite rp latte n -Layau t / n1 PC B -Layaut 11 3 x 3 = 9 / Copper pads for connector standoffs
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lv 86A
Abstract: No abstract text available
Text: SIEMENS CtIPNTSi û 2 3 b 3 S b QQOMbTô 4 9 1 S I E X 44E D OPTO SIEM ENS RM-86A Mask-Diffused GaAsP Monolithic LED PART NO. 2680-0114 P i/-? ? — P-metal anode Diffusion Barrier Epitaxial Layar Substrate N-metal (cathode) DESCRIPTION TYPICAL DEVICE PARAMETERS
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RM-86A
lv 86A
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Untitled
Abstract: No abstract text available
Text: 5,5 4,15 26,55 xxxx Verpackt in Gurtverpackung - Tape an Reel Packaging Verpackungseinheit: 260 Stück - Packaging unit: 260 pcs ER Nl P O fl i'* R i'* \D ate Cade Ident-Nr. / 44,5 -Cj}- O -0- -0- o I \ J IL / Tre I I Leiterplatten-Layaut / PCB-Layout I I
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2768-m
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Untitled
Abstract: No abstract text available
Text: 5,5 V e rp o ckt in Gurtverpackung Verpackungseinheit: 300 Stück 4.15 Tape on Reel Packaging - Packaging unit• 300 pcs - 32,5 Abspulrichtunq - Reel o ff Direction Le ite rpLatte n-La you t / PC B -Layaut Information Anforderungsstufe 1 Performance Level 1
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OOQ59539
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Untitled
Abstract: No abstract text available
Text: 4,15 \ ' Tape on Reel Packaging V e r p a c k t in G u r tv e rp a c k u n g - Verpacljungseinheit: 4 2 0 Stück - Packaging unit• 420 pcs _ I T oo m ' P 32,5 Abspuirichtunq - Reel o ff Direction Le ite rp la tte n -La yo u t / P C B -Layaut 11 3 x 3 = 9
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OOQ59B51
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SMCQ 26 M AB
Abstract: No abstract text available
Text: Leiterplatten-Layout Vorschlag für SMT PCB-Layaut Proposal fa r SMT 1.2 01.6 .□ • □ 0,8 - 0 ,0 3 Tape on Reet Packaging V e r p a c k t in G u r t v e r p a c k u n g - V e r p a c k u n g s e in h e it: 56 0 Stück - Packaging unit: 560 pcs 0.3 a13
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26-SMD-BA7-03
26-SMD-type7-03
SMCQ 26 M AB
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Text: V e rp o ckt in Gurtverpackung Verpackungseinheit: 300 Stück 5, 5 V15 Tape on Reel Packaging - Packaging unit• 300 pcs - 3 2 ,5 Abspulrichtunq - Reel o ff Direction Le ite rpLatte n-La you t / PC B -Layaut 11 3 x 3 = 9 0,8 5 0 0 ,7 lllll ■ ■ OC o \
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0Q059537
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T325
Abstract: No abstract text available
Text: 5,85 V e r p a c k t in G u rtv e rp a c k u n g Verpackungseinheit: 4 2 0 Stück 4,6 I «n y - Tape on Peel Packaging - Packaging unit• 4 20 pcs ’l y j T ’T 32,5 Abspu lrich tu n q - Peel aff Direction LEiterplattEn-Layaut / PCB-Layüut 11 KupferfLache für A b sta n d sb o lz e n
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4X2A
Abstract: No abstract text available
Text: 5,85 4,6 - Tape on Reel Packaging - Packaging unit: 420 pcs V e rp ac kt in Gurtverpackung Verpackungseinheit: 4 2 0 Stück 0,15 32,5 Abspulrichtunq - Reel o ff Direction n1 L Le ite rp latte n -Layau t / 1ft PC B -La ya u t 11 3x3=9 / K u p f E rt L a c h E für A b s t a n d s b o l z e n
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Abstract: No abstract text available
Text: Verpackt in Gurtverpackung Tape on Reel Packaging Verpackungseinheit: 260 Stück - Packaging unit: 260 pcs 5,5 26 ,55 - 4,15 6,5 M ont a qe hau b e xxxx 44,5 CD \ Le ite rp La tte n -LQ yo u t / C D C D C D C D I J IL CD / I P C B -Layaut 26 X 0 .8 5 1 3 = 24
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2768-m
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Untitled
Abstract: No abstract text available
Text: 5,5 V e r p o c k t in G u rtv e rp a c k u n g V erp ac ku n g se in h e it: 300 Stück V15 I. Tape on Reel Packaging - Packaging unit• 300 pcs - .1 32,5 A b s p u lrich tu n q LeiterpLatten-Layout / - Reel o ff Direction P C B -Layaut 11 3 x 3 = 9 0,85
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Q00595A1
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Untitled
Abstract: No abstract text available
Text: Verpnckt in Gurtverpnckung - Tapp on Real Packaging Verpackungseinheit: 280 Stuck - Packaging unit: 280 pcs 36.3 m q ±o 03 vJD CO 4,2 Anforderungsstufe 1 Performance Level 1 Kontaktbereich vergoldet Mating Area gold plating Leiterplatten-Layaut Vorschlag fur SMT
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M0082
0650SA
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Untitled
Abstract: No abstract text available
Text: ?fi5 5 Verpackt in Gurtverpackung Verpackungseinheit: 400 Stück 4/15 . * s ? S| V, J 1' CO i_ n '' - p Tape on Reel Packaging Packaging unit: 400 pcs - 44,5 CD \ Leiterplatten-Layout / PCB-Layaut C D C D C D C D i J 1L CD / 1 0.851 X 26 3 = 24 -h 0.8 0 0 ,7 .
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2768-m
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Untitled
Abstract: No abstract text available
Text: 5, 5 4,15 Tape on Reel Packaging V e r p a c k t in G u r tv e rp a c k u n g - Verpacljungseinheit: 4 2 0 Stück - Packaging unit• 420 pcs 32,5 Abspuirichtunq - Reel o ff Direction Le ite rp la tte n -La yo u t / P C B -Layaut 11 3 x 3 = 9 0 ,8 5 0 0 ,7
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Q0059533
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Untitled
Abstract: No abstract text available
Text: 4,15 s_ f T Tape on Reel Packaging V e r p a c k t in G u r tv e rp a c k u n g - Verpacljungseinheit: 4 2 0 Stück - Packaging unit• 420 pcs / CO i_ n ” u - 32,5 Abspuirichtunq - Reel o ff Direction Le ite rp la tte n -La yo u t / P C B -Layaut
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OOQ59535
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cal e6c
Abstract: IC free bu 2508 af equivalent cx 2601 SF.C 2805 EC norma installation tester xe 2sa 5200 power amp EM3870 relay TRK 1703 YE EI- 33C
Text: M6SMD0S3 D2 > JUNE 1979 E XO Rdisk I I/I11 Operating S y s t e m User's Guide The i n format ion in this document has been careful ly checked; and is believed to be entirely reliable. No res^tonsibi1ity> however, is assumed for inaccuracies. Furthermore,
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I/I11
12MNU?
RQK77
cal e6c
IC free
bu 2508 af equivalent
cx 2601
SF.C 2805 EC
norma installation tester xe
2sa 5200 power amp
EM3870
relay TRK 1703
YE EI- 33C
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