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    LAYOUTS AND PIN COUNTS Search Results

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    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    LAYOUTS AND PIN COUNTS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    177-140H

    Abstract: MIL-DTL-24308 "D-Subminiature Connector" 26 Pin High Density MS3143 MS3114 Ms3449 MS27476 MS27469 MS3440 MS27478
    Text: INDEX Hermetic Connectors Product Index PRODUCT INDEX MIL-DTL-38999 Series I, II, III and IV Type Hermetic Connectors MIL-DTL-38999 Hermetic Connector Product Features B-1 MIL-DTL-38999 Series I, II, III and IV Hermetic Class Insert Arrangements B-2 MIL-DTL-38999 Series I, II, III and IV Hermetic Class Layouts and Pin Counts


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    MIL-DTL-38999 MS27469 231-100-H0 177-140H MIL-DTL-24308 "D-Subminiature Connector" 26 Pin High Density MS3143 MS3114 Ms3449 MS27476 MS3440 MS27478 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-212 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material:


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    F-212 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material:


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    F-211 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-212 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see


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    F-212 charge69 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-210-1 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material:


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    F-210-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material:


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    F-211 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see


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    F-211 charg69 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211-1 LPAF–20–03.5–L–06–2 LPAF–20–03.5–L–04–2 1,27mm .050" TM LPAF SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAF Insulator Material:


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    F-211-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see


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    F-211 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-212 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see


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    F-212 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211-1 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material:


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    F-211-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-212 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material:


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    F-212 PDF

    LPAF

    Abstract: No abstract text available
    Text: F-210-1 LPAM–20–01.5–L–06–2 1,27mm .050" LPAM–20–01.5–L–04–2 TM LPAM SERIES Low Profile Array HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material:


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    F-210-1 LPAF PDF

    Untitled

    Abstract: No abstract text available
    Text: SEAF8–30–05.0–S–06–2–K SEAF8–30–05.0–S–04–2–K 0,80 mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 ™ For complete specifications and recommended PCB layouts see


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    d38999 22d

    Abstract: D38999 5D-18 D38999 series I II d38999 d97 D3899
    Text: D38999 QPL Hermetics MIL-DTL-38999 Series I, II, III, and IV Hermetic Class Connectors Layouts and Pin Counts Shell Size and Insert Arrangements MS Series I B MS Series II 9-35 9-98 11-2 11-4 11-5 11-35 11-98 11-99 13-4 13-8 13-35 13-98 15-5 15-15 15-18 15-19


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    D38999 MIL-DTL-38999 d38999 22d 5D-18 D38999 series I II d38999 d97 D3899 PDF

    SEAM8

    Abstract: SEAM8-30-S02 Seaf SEAF8
    Text: F-210-1 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see


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    F-210-1 SEAM8 SEAM8-30-S02 Seaf SEAF8 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211-1 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see


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    F-211-1 PDF

    Seaf

    Abstract: SEAM8 SEAF8
    Text: F-210-1 SEAF8–30–05.0–L–06–2 SEAF8–30–05.0–L–04–2 0,80mm .0315" SEAF8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAM8 For complete specifications and recommended PCB layouts see


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    F-210-1 Seaf SEAM8 SEAF8 PDF

    Untitled

    Abstract: No abstract text available
    Text: F-211-1 SEAM8–30–S02.0–L–06–2 SEAM8–30–S05.0–L–04–2 0,80mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Signal Integrity optimized Edge Rate contact Mates with: SEAF8 For complete specifications and recommended PCB layouts see


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    F-211-1 cha69 PDF

    Untitled

    Abstract: No abstract text available
    Text: F213 Rev 8AUG13 SEAM8–30–S02.0–S–06–2–K SEAM8–30–S05.0–S–04–2–K (0,80 mm) .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Mates with: SEAF8 Up to 180 I/Os 4 and 6 row For complete specifications and recommended PCB layouts see


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    8AUG13) PDF

    Layouts and Pin Counts

    Abstract: No abstract text available
    Text: D38999 QPL Hermetics MIL-DTL-38999 Series I, II, III, and IV Hermetic Class Connectors Layouts and Pin Counts Shell Size and Insert Arrangements MS Series I B MS Series II 9-35 9-98 11-2 11-4 11-5 11-35 11-98 11-99 13-4 13-8 13-35 13-98 15-5 15-15 15-18 15-19


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    D38999 MIL-DTL-38999 Layouts and Pin Counts PDF

    Untitled

    Abstract: No abstract text available
    Text: SEAM8–30–S02.0–S–06–2–K SEAM8–30–S05.0–S–04–2–K 0,80 mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Up to 500 I/Os Mates with: SEAF8 7 mm and 10 mm Stack Heights For complete specifications and recommended PCB layouts see


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: F-213 SEAM8–30–S02.0–S–06–2–K–TR SEAM8–30–S05.0–S–04–2–K–TR 0,80 mm .0315" SEAM8 SERIES ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS Mates with: SEAF8 Up to 180 I/Os 4 and 6 row For complete specifications and recommended PCB layouts see


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    F-213 PDF

    Untitled

    Abstract: No abstract text available
    Text: HIGH SPEED LOW PROFILE OPEN PIN FIELD SPECIFICATIONS M ates with: LPAF For complete specifications and recommended PCB layouts see www.samtec.com?LPAM Insulator Material: Black LCP 4 or 6 row Terminal Material: Copper Alloy Plating: Au or Sn over 50p“ 1,27pm Ni


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