LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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Original
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
MIL-M-38510
MIL-STD-883
LGA 1156 PIN OUT diagram
QSJ-44403
LGA 1150 Socket PIN diagram
LGA 1155 Socket PIN diagram
IC107-26035-20-G
LGA 1151 PIN diagram
REFLOW lga socket 1155
IC107-3204-G
TB 2929 H alternative
LGA 1155 pin diagram
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PDF
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LEAD FRAME SURFACE MOUNT
Abstract: ic package Cu Alloy 42 TO-220F JEDEC transistor outline package 3 lead frame led lead frame SIP SOT 23
Text: Package Characteristics External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Full name Symbol External outline Frame IC Package Description Pitch Lead type TO-92 Transistor Outline
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Original
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O-220F
OT-89
O-252
LEAD FRAME SURFACE MOUNT
ic package
Cu Alloy 42
TO-220F JEDEC
transistor outline package 3
lead frame
led lead frame
SIP SOT 23
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PDF
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MF202
Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical
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Original
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16-pin
MF202
160P6)
152P6T)
135S8)
42Alloy)
leadframe materials
QFP PACKAGE thermal resistance
POWER QFP
MITSUBISHI INTEGRATED CIRCUIT PACKAGES
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PDF
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ic package
Abstract: Cu Alloy 42 transistor outline package 3
Text: PACKAGE CHARACTERISTICS External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Symbol Full name External outline IC Package Description Frame Pitch TO-92 Transistor Outline Package
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Original
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O-220F
OT-89
O-252
ic package
Cu Alloy 42
transistor outline package 3
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PDF
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LEAD FRAME SURFACE MOUNT
Abstract: Alloy 42 Cu Alloy 42 lead frame led lead frame
Text: PACKAGE CHARACTERISTICS External figure, flame material, lead pitch, lead type of each package are shown in the following chart. < Lead Insertion Type > Name Symbol Full name IC Package Description External outline Frame Pitch TO-220F Transistor Outline Package
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Original
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O-220F
OT-89
O-252
778mm
LEAD FRAME SURFACE MOUNT
Alloy 42
Cu Alloy 42
lead frame
led lead frame
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PDF
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QFP64-P-1414
Abstract: No abstract text available
Text: QFP64-P1414-0.80-BK 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 5/Sept.21,1999
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Original
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QFP64-P1414-0
80-BK
QFP64-P-1414
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PDF
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QFP128-P-2828-0
Abstract: No abstract text available
Text: QFP128-P-2828-0.80-DK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.95 TYP. 4/Nov. 28, 1996
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Original
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QFP128-P-2828-0
80-DK
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PDF
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QFP100-P-1420-0
Abstract: No abstract text available
Text: QFP100-P-1420-0.65-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.29 TYP. 4/Nov. 28, 1996
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Original
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QFP100-P-1420-0
65-BK
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PDF
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QFP80-P
Abstract: No abstract text available
Text: QFP80-P-1414-0.65-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.85 TYP. 3/Nov. 28, 1996
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Original
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QFP80-P-1414-0
QFP80-P
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PDF
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QFP208-P-2828-0
Abstract: QFP208-P
Text: QFP208-P-2828-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 5.65 TYP. 2/Nov. 28, 1996
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Original
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QFP208-P-2828-0
50-BK4
QFP208-P
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PDF
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QFP56-P
Abstract: No abstract text available
Text: QFP56-P-910-0.65-2K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.43 TYP. 4/Nov. 28, 1996
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Original
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QFP56-P-910-0
65-2K
QFP56-P
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PDF
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QFP160-P-2828-0
Abstract: No abstract text available
Text: QFP160-P-2828-0.65-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.74 TYP. 2/Nov. 28, 1996
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Original
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QFP160-P-2828-0
65-BK4
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PDF
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QFP160-P-2828-0
Abstract: No abstract text available
Text: QFP160-P-2828-0.65-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.74 TYP. 2/Nov. 28, 1996
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Original
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QFP160-P-2828-0
65-BK
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PDF
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QFP44-P-910-0
Abstract: No abstract text available
Text: QFP44-P-910-0.80-2K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.41 TYP. 4/Nov. 28, 1996
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Original
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QFP44-P-910-0
80-2K
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PDF
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|
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QFP128-P-2828-0
Abstract: QFP128-P
Text: QFP128-P-2828-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 5.58 TYP. 3/Nov. 28, 1996
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Original
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QFP128-P-2828-0
80-BK
QFP128-P
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PDF
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Untitled
Abstract: No abstract text available
Text: QFP64-P-1414-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 6/Feb. 23, 2001
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Original
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QFP64-P-1414-0
80-BK
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PDF
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BK-4
Abstract: qfp304 QFP304-P-4040-0
Text: QFP304-P-4040-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 12.37 TYP. 2/Nov. 28, 1996
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Original
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QFP304-P-4040-0
50-BK4
BK-4
qfp304
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PDF
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QFP128-P-1420-0
Abstract: qfp128p
Text: QFP128-P-1420-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.19 TYP. 4/Nov. 28, 1996
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Original
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QFP128-P-1420-0
qfp128p
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PDF
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QFP80-P-1420-0
Abstract: No abstract text available
Text: QFP80-P-1420-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.27 TYP. 4/Nov. 28, 1996
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Original
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QFP80-P-1420-0
80-BK
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PDF
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QFP100-P-1420-0
Abstract: No abstract text available
Text: QFP100-P-1420-0.65-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.54 TYP. 4/Nov. 28, 1996
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Original
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QFP100-P-1420-0
65-BK4
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PDF
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QFP272-P-3636-0
Abstract: No abstract text available
Text: QFP272-P-3636-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 9.96 TYP. 2/Nov. 28, 1996
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Original
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QFP272-P-3636-0
50-BK4
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PDF
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QFP240-P-3232-0
Abstract: No abstract text available
Text: QFP240-P-3232-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 7.82 TYP. 2/Nov. 28, 1996
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Original
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QFP240-P-3232-0
50-BK4
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PDF
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QFP208-P-2828-0
Abstract: No abstract text available
Text: QFP208-P-2828-0.50-EK4 Built-in PCB Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 6.35 TYP. 3/Nov. 28, 1996
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Original
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QFP208-P-2828-0
50-EK4
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PDF
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QFP208-P-2828-0
Abstract: No abstract text available
Text: QFP208-P-2828-0.50-CK4 Built-in heat spreader Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 6.70 TYP. 4/Nov. 28, 1996
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Original
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QFP208-P-2828-0
50-CK4
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PDF
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