lqfp 64 Shipping Trays
Abstract: DS310H
Text: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging
|
Original
|
|
PDF
|
DUAL ROW QFN leadframe
Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This
|
Original
|
|
PDF
|
QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Materials Declaration Data Sheet ASDM_ASDMB QFN 2.5 x 2.0 mm 12.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating
|
Original
|
NEX-130CT
8200T
Q3-6646)
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Materials Declaration Data Sheet ASFLM,ASFLMB QFN 5.0 x 3.2 mm 37.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating
|
Original
|
NEX-130CT
8200T
Q3-6646)
|
PDF
|
Q3-6646
Abstract: No abstract text available
Text: Materials Declaration Data Sheet ASEM_ASEMB QFN 3.2 x 2.5 mm 19.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating
|
Original
|
NEX-130CT
8200T
Q3-6646)
Q3-6646
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Materials Declaration Data Sheet ASVM_ASVMB-Series QFN 7.0 x 5.0 mm 85.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating
|
Original
|
190Weight
NEX-130CT
8200T
Q3-6646)
|
PDF
|
LD128
Abstract: PPF leadframe
Text: LEADFRAME data sheet SOIC Features Small Outline IC Package SOIC : SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package runs in very high volume and
|
Original
|
MS-013
MO-119
LD128
PPF leadframe
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Data Sheet LEADFRAME SOT-223 Test Services ● Program generation/conversion ● Wafer probe ● Burn-in ● -55°C to +165°C test available ● Strip test available Small Outline Transistor SOT-223 SOT-223 is a leadframe based, plastic encapsulated package
|
Original
|
OT-223
OT-223)
OT-223
DS582B
|
PDF
|
JEDEC MO-153
Abstract: 78 mo 5 MO-153 tip55 JEDEC MO-187
Text: LEADFRAME data sheet TSSOP/MSOP Features Thin Shrink Small Outline Package, Micro Small Outline Package TSSOP/MSOP : TSSOP and MSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height.
|
Original
|
DS351)
MO-153
MO-194
JEDEC MO-153
78 mo 5
tip55
JEDEC MO-187
|
PDF
|
JEDEC MO-187
Abstract: JEDEC MO-153
Text: LEADFRAME Data Sheet TSSOP/MSOP/VSSOP Thermal Performance Forced Convection, Single-layer PCB Pkg Thin Shrink Small Outline Package, Micro Small Outline Package, Very-Thin Shrink Small Outline Package TSSOP/MSOP/ VSSOP TSSOP, MSOP and VSSOP are leadframe based, plastic
|
Original
|
DS350N
JEDEC MO-187
JEDEC MO-153
|
PDF
|
Untitled
Abstract: No abstract text available
Text: InnovativeInnov Innovative VCSEL Solutions . Delivered Advanced Optical Components Photoreflective Sensor Leadframe packaging Preliminary HVS6003-002 Key Features: VCSEL and phototransistor in industry standard leadframe packaging Optical plastics block visible wavelength for better ambient light rejection
|
Original
|
HVS6003-002
HVS6003-002
1-866-MY-VCSEL
1-866-MY-VCSEL
|
PDF
|
texas instruments packing label
Abstract: SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64
Text: TEXAS INSTRUMENTS Notification for the Qualification of the S-Pad Leadframe Conversion for Certain TQFP Packages October 17, 1995 Abstract Texas Instruments Advanced System Logic ASL is converting conventionally designed leadframes to the newly designed Small Pad (S-Pad) leadframe. This breakthrough in device packaging will make
|
Original
|
7150M
CDC582
CDC586
CDC2582
CDC2586
SN250056
SN74ACT2235-XX
SN74ACT7807-XX
SN74ACT7808-XX
SN10067
texas instruments packing label
SPAD
Eftec 64t
PZT144
CDC582
TEXAS INSTRUMENTS, Mold Compound
EN-4085S2K3
eftec 45
EN-4085S2
eftec+64
|
PDF
|
E03100
Abstract: AES chips 323ag
Text: Materials Declaration Package Body Size LeadCount Option SOIC 300 mils 18 Pb Free Molding Compound % of Compound Weight g 10 3.54 E-02 85 3.01 E-01 3 1.06 E-02 1.5 5.31 E-03 0.5 1.77 E-03 PPM 69857 593786 20957 10479 3493 Cu Fe P Zn Leadframe % of Leadframe
|
Original
|
|
PDF
|
|
|
amkor
Abstract: amkor exposed pad
Text: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a
|
Original
|
|
PDF
|
TO 92 leadframe
Abstract: No abstract text available
Text: Data Sheet LEADFRAME TO-92 Test Services ● Program generation/conversion ● Wafer probe ● Burn-in ● -55°C to +165°C test available ● Strip test available Transistor Outline TO-92 TO-92 is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum
|
Original
|
DS583A
TO 92 leadframe
|
PDF
|
amkor exposed pad
Abstract: exposed QFP 128 amkor exposed QFP 144
Text: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small
|
Original
|
|
PDF
|
Ablestik 8290
Abstract: C194 G600 MS-013 Amkor Wafer level mold compound PPF leadframe
Text: LEADFRAME data sheet SOIC Features: Small Outline IC Packages: Amkor has a broad portfolio of Small Outline ICs SOIC packages, including .150", .208" and .300" body sizes. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best
|
Original
|
MS-013
MS-019
Ablestik 8290
C194
G600
MS-013
Amkor Wafer level mold compound
PPF leadframe
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)
|
Original
|
DS571J
|
PDF
|
Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARSL Package Weight mg 2000 Product Group Type No. ARS50AL – ARS50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation
|
Original
|
ARS50AL
ARS50JL
2011/65/EU.
|
PDF
|
Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARL Package Weight mg 2200 Product Group Type No. AR50AL – AR50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation
|
Original
|
AR50AL
AR50JL
2011/65/EU.
|
PDF
|
MO-166
Abstract: PPF leadframe MO166 MS-013 tip 142
Text: LEADFRAME data sheet PowerSOP 2&3 Features: Thermal Resistance: PowerSOP® Packages: PSOP This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC packages. The PowerSOP (PSOP) improves
|
Original
|
MO-166.
MS-012
MO-166
PPF leadframe
MO166
MS-013
tip 142
|
PDF
|
LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
|
Original
|
|
PDF
|
TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
|
Original
|
|
PDF
|
