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    LGA 388 Search Results

    LGA 388 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    R7FS5D57A2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    R7FS5D57C2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    UPA2371T1P-E1-A Renesas Electronics Corporation Nch Dual Power Mosfet 24V 6A 20Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
    UPA2351T1P-E4-A Renesas Electronics Corporation Nch Dual Power Mosfet 30V 5.7A 40Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
    UPA2350T1P-E4-A Renesas Electronics Corporation Nch Dual Power Mosfet 20V 6.0A 35Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
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    LGA 388 Price and Stock

    Vishay Vitramon TRU050GALGA-38.880/19.440MHZ

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    Bristol Electronics TRU050GALGA-38.880/19.440MHZ 4
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    LGA 388 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-3000K and i7-3000 Processor Series for the LGA-2011 Socket


    Original     		PDF LGA-2011 i7-3960X i7-3000K i7-3000

    X-RAY INSPECTION

    Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
    Text: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as


    Original     		PDF AN2265/D 26mm-0 X-RAY INSPECTION LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance

    LGA20C-00SADJJ

    Abstract: J-STD-002B Lga10c LGA03C-00SADJJ LGA10C-00S lga20c-01sadjj LGA06C00SADJJ LGA10
    Text: Embedded Power for Business-Critical Continuity SXX06E Rev. 08.01.06 Page 1 of 2 Rev. 12.15.09 LGA C SERIES 1 of 4 LGA C Series 15-100 Watts Total Power: 15-100 Watts No. of Outputs: Single Electrical Specifications Output Special Features • 3,6,10 and 20 A output


    Original     		PDF SXX06E LGA20C-00SADJJ J-STD-002B Lga10c LGA03C-00SADJJ LGA10C-00S lga20c-01sadjj LGA06C00SADJJ LGA10

    J-STD-002B

    Abstract: LGA03C-00SADJJ
    Text: Embedded Power for Business-Critical Continuity SXX06E Rev. 08.01.06 Page 1 of 2 Rev. 11.02.09 LGA C SERIES 1 of 4 LGA C Series 15-100 Watts Total Power: 15-100 Watts No. of Outputs: Single Electrical Specifications Output Special Features • 3,6,10 and 20 A output


    Original     		PDF SXX06E J-STD-002B LGA03C-00SADJJ

    LGA10

    Abstract: LGA06 LGA20 J-STD-002B LGA10C-00SADJJ LGA10C-00S lga20c-01sadjj lga06c-00sadjj Lga10c LGA20C-00SADJJ
    Text: Embedded Power for Business-Critical Continuity SXX06E Rev. 08.01.06 Page 1 of 2 Rev. 04.27.09 LGA C SERIES 1 of 4 LGA C Series 15-100 Watts Total Power: 15-100 Watts No. of Outputs: Single Electrical Specifications Output Special Features • 3,6,10 and 20 A output


    Original     		PDF SXX06E LGA10 LGA06 LGA20 J-STD-002B LGA10C-00SADJJ LGA10C-00S lga20c-01sadjj lga06c-00sadjj Lga10c LGA20C-00SADJJ

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    pogo pins

    Abstract: IC274-084344 bga 1296 lga 388 IC274-036274 IC274-048278 IC274-056310 IC274-073158 IC274-080305 IC274-11901
    Text: IC274 Series Test Contactor SMT Pogo Pins (LGA, BGA, CSP - 0.50 to 1.50mm Pitch) Part Number (Details) Specifications 1MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 200m Ω max. at 10mA/20mV max.


    Original     		PDF IC274 10mA/20mV pogo pins IC274-084344 bga 1296 lga 388 IC274-036274 IC274-048278 IC274-056310 IC274-073158 IC274-080305 IC274-11901

    Untitled

    Abstract: No abstract text available
    Text: Embedded Power for Business-Critical Continuity SXX06E Rev. 08.01.06 Page 1 of 2 Rev. 10.25.11 LGA3-20C SERIES 1 of 4 LGA C Series 15-100 Watts Total Power: 15-100 Watts No. of Outputs: Single Electrical Specifications Output Special Features • 3,6,10 and 20 A output


    Original     		PDF SXX06E LGA3-20C

    930015

    Abstract: LGA10
    Text: Embedded Power for Business-Critical Continuity SXX06E Rev. 08.01.06 Page 1 of 2 Rev. 10.25.11 LGA3-20C SERIES 1 of 4 LGA C Series 15-100 Watts Total Power: 15-100 Watts No. of Outputs: Single Electrical Specifications Output Special Features • 3,6,10,15 and 20 A output


    Original     		PDF SXX06E LGA3-20C 930015 LGA10

    56 pin BGA IC Socket

    Abstract: bga 1296 yamaichi IC 120 Test Socket 176325 bga 529 54427 IC274-036274 IC274-048278 IC274-054360 IC274-056310
    Text: IC274 Series Test Contactor SMT - Spring Probe Contact Style Part Number (Details) Specifications 1MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 200m Ω max. at 10mA/20mV max. Operating Temperature Range: –40°C to +100°C


    Original     		PDF IC274 10mA/20mV 56 pin BGA IC Socket bga 1296 yamaichi IC 120 Test Socket 176325 bga 529 54427 IC274-036274 IC274-048278 IC274-054360 IC274-056310

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		PDF Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"

    QAD-00046

    Abstract: SE5503A 5503A JESD22-A114 P802 S211 S2132 SE5503A-R QAD-00047 LGA land pattern
    Text: SE5503A Dual Band 802.11a/b/g/n Wireless LAN Front End Preliminary Information Applications ƒ ƒ ƒ ƒ ƒ Product Description The SE5503A is a complete 802.11a/b/g/n WLAN RF front-end module providing all the functionality of the power amplifiers, filtering, power detector, T/R switch,


    Original     		PDF SE5503A 11a/b/g/n SE5503A IEEE802 DST-00320 QAD-00046 5503A JESD22-A114 P802 S211 S2132 SE5503A-R QAD-00047 LGA land pattern

    LGA-24 land pattern

    Abstract: No abstract text available
    Text: DATA SHEET SE5503A: Dual-Band 802.11a/b/g/n Wireless LAN Front-End Preliminary Information Applications Product Description • •    The SE5503A is a complete 802.11a/b/g/n WLAN RF front-end module providing all the functionality of the power amplifiers, filtering, power detector, T/R switch,


    Original     		PDF SE5503A: 11a/b/g/n IEEE802 SE5503A LGA-24 land pattern

    LGA rework

    Abstract: No abstract text available
    Text: DATA SHEET SE5503A:Dual Band 802.11a/b/g/n Wireless LAN Front-End Applications Product Description • •    The SE5503A is a complete 802.11a/b/g/n WLAN RF front-end module providing all the functionality of the power amplifiers, filtering, power detector, T/R switch,


    Original     		PDF SE5503A 11a/b/g/n IEEE802 LGA rework

    SIGe2548a

    Abstract: sige 2548A
    Text: SE2548A Dual Band 802.11a/b/g/n Wireless LAN Front End Preliminary Information Applications ƒ ƒ ƒ ƒ ƒ Product Description The SE2548A is a complete 802.11a/b/g/n WLAN RF front-end module providing all the functionality of the power amplifiers, filtering, power detector, T/R switch,


    Original     		PDF SE2548A 11a/b/g/n IEEE802 SE2548A SIGe2548a sige 2548A

    SE5503A

    Abstract: No abstract text available
    Text: DATA SHEET SE5503A:Dual Band 802.11a/b/g/n Wireless LAN Front End Applications • •    Product Description The SE5503A is a complete 802.11a/b/g/n WLAN RF front-end module providing all the functionality of the power amplifiers, filtering, power detector, T/R switch,


    Original     		PDF SE5503A 11a/b/g/n IEEE802

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET SE5503A:Dual Band 802.11a/b/g/n Wireless LAN Front End Applications Product Description • •    The SE5503A is a complete 802.11a/b/g/n WLAN RF front-end module providing all the functionality of the power amplifiers, filtering, power detector, T/R switch,


    Original     		PDF SE5503A 11a/b/g/n SE5503A IEEE802 DST-00320

    GCLR

    Abstract: 676P Axcelerator Family FPGAs
    Text: v2.4 Axcelerator Family FPGAs u e Leading-Edge Performance • • • • – 350+ MHz System Performance 500+ MHz Internal Performance High-Performance Embedded FIFOs 700 Mb/s LVDS Capable I/Os Specifications • • • • • Up to 2 Million Equivalent System Gates


    Original     		PDF

    AF4 din 74

    Abstract: AF2.5 din 74 diode t25 4 g8 Axcelerator Family FPGAs
    Text: v2.5 Axcelerator Family FPGAs u e Leading-Edge Performance • • • • – 350+ MHz System Performance 500+ MHz Internal Performance High-Performance Embedded FIFOs 700 Mb/s LVDS Capable I/Os Specifications • • • • • Up to 2 Million Equivalent System Gates


    Original     		PDF

    896-Pin

    Abstract: smartpower IO290 Axcelerator Family FPGAs
    Text: v2.2 Axcelerator Family FPGAs u e Leading-Edge Performance • • • • – 350+ MHz System Performance 500+ MHz Internal Performance High-Performance Embedded FIFOs 700 Mb/s LVDS Capable I/Os Specifications • • • • • Up to 2 Million Equivalent System Gates


    Original     		PDF

    MA 6013

    Abstract: No abstract text available
    Text: v2.5 Axcelerator Family FPGAs u e Leading-Edge Performance • • • • – 350+ MHz System Performance 500+ MHz Internal Performance High-Performance Embedded FIFOs 700 Mb/s LVDS Capable I/Os Specifications • • • • • Up to 2 Million Equivalent System Gates


    Original     		PDF

    IO191

    Abstract: Axcelerator Family FPGAs
    Text: v2.3 Axcelerator Family FPGAs u e Leading-Edge Performance • • • • – 350+ MHz System Performance 500+ MHz Internal Performance High-Performance Embedded FIFOs 700 Mb/s LVDS Capable I/Os Specifications • • • • • Up to 2 Million Equivalent System Gates


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET SE2548A: Dual Band 802.11a/b/g/n Wireless LAN Front End Preliminary Information Applications Product Description • •    The SE2548A is a complete 802.11a/b/g/n WLAN RF front-end module providing all the functionality of the power amplifiers, filtering, power detector, T/R switch,


    Original     		PDF SE2548A: 11a/b/g/n SE2548A SE2548A IEEE802 DST-00092

    202422A

    Abstract: SIGe2548a sige 2548A
    Text: DATA SHEET SE2548A: Dual-Band 802.11a/b/g/n Wireless LAN Front-End Preliminary Information Applications Product Description • •    The SE2548A is a complete 802.11a/b/g/n WLAN RF front-end module providing all the functionality of the power amplifiers, filtering, power detector, T/R switch,


    Original     		PDF SE2548A: 11a/b/g/n IEEE802 SE2548A 202422A SIGe2548a sige 2548A