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    LOW POWER MOBILE DDR3 Search Results

    LOW POWER MOBILE DDR3 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4164K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4207F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation

    LOW POWER MOBILE DDR3 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    PXA1088

    Abstract: No abstract text available
    Text: Marvell PXA1088 Pro Quad-core WCDMA/TD-SCDMA Communication Processor Quad-cortex A7, High-performance, Low-power, Low-cost PRODUCT OVERVIEW The Marvell PXA1088 Pro is a highly integrated quad-core application and communications mobile System-on-Chip SoC that provides high-performance, low-power mobile computing; support for all


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    PXA1088 Pro-01 PDF

    rk3188

    Abstract: RK3188-T ARGB888 emmc boot sequence
    Text: RK3188Technical Reference ManualRev 1.2 Chapter 1 Introduction RK3188 is a low power, high performance processor for mobile phones, personal mobile internet device and other digital multimedia applications, and integrates quad-core Cortex-A9 with separately NEONand FPU coprocessor.


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    RK3188Technical RK3188 1080p 60fps, 264/MVC/VP8 30fps, RK3188-T ARGB888 emmc boot sequence PDF

    ISSI

    Abstract: DDR-3
    Text: ► DRAM PRODUCT LINE Strategy: Provide complete portfolio of low-to-medium density and low power DRAMs • Long-term support for all ISSI DRAMs: 7-10 years typical • SDRAM in all densities up to 512Mb, including x32 products SDR, DDR, DDR2 • Mobile DRAMs for SDR and DDR families for power sensitive application


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    512Mb, -40oC 105oC) 64Kb-8Mb, inc69-7800 ISSI DDR-3 PDF

    Untitled

    Abstract: No abstract text available
    Text: www.axiomtek.com NA-812B 1U Rackmount Network Appliance Platform with Low Power Intel Core 2 Duo Processor, 6 LANs and Intel® AMT Features Front view Rear view Introduction The NA-812B 1U rackmountable network appliance platform is configured with an ultra low power Intel® Core™2 Duo processor up to 2.26 GHz with Mobile Intel®


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    NA-812B NA-812B NA-812B-R6GI 10/100/1000Mbps CK9A104 59416112100E 8816E320010E) RJ-45, RJ-45 PDF

    EDD51323DBH-LS

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET 512M bits DDR Mobile RAM WTR Wide Temperature Range , Low Power Function EDD51323DBH-LS (16M words x 32 bits) Specifications Features • Density: 512M bits • Organization: 4M words × 32 bits × 4 banks • Package: 90-ball FBGA


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    EDD51323DBH-LS 90-ball 400Mbps/333Mbps M01E0706 E1432E11 EDD51323DBH-LS PDF

    EDD10163BBH-5BLS-F

    Abstract: ELPIDA mobile DDR DDR333 DDR400 1g bits ddr mobile ram
    Text: PRELIMINARY DATA SHEET 1G bits DDR Mobile RAM WTR Wide Temperature Range , Low Power Function EDD10163BBH-LS (64M words x 16 bits) Specifications Features • Density: 1G bits • Organization: 16M words × 16 bits × 4 banks • Package: 60-ball FBGA


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    EDD10163BBH-LS 60-ball 400Mbps/333Mbps M01E0706 E1436E30 EDD10163BBH-5BLS-F ELPIDA mobile DDR DDR333 DDR400 1g bits ddr mobile ram PDF

    E1433

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET 512M bits DDR Mobile RAM WTR Wide Temperature Range , Low Power Function EDD51163DBH-LS (32M words x 16 bits) Specifications Features • Density: 512M bits • Organization: 8M words × 16 bits × 4 banks • Package: 60-ball FBGA


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    EDD51163DBH-LS 60-ball 400Mbps/333Mbps M01E0706 E1433E21 E1433 PDF

    DDR RAM 512M

    Abstract: ELPIDA mobile DDR DDR333 DDR400
    Text: PRELIMINARY DATA SHEET 512M bits DDR Mobile RAM WTR Wide Temperature Range , Low Power Function EDD51163DBH-LS (32M words x 16 bits) Specifications Features • Density: 512M bits • Organization: 8M words × 16 bits × 4 banks • Package: 60-ball FBGA


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    EDD51163DBH-LS 60-ball 400Mbps/333Mbps M01E0706 E1433E30 DDR RAM 512M ELPIDA mobile DDR DDR333 DDR400 PDF

    ELPIDA mobile DDR

    Abstract: EDD10323BBH-6ELS-F DDR333 DDR400 EDD10323BBH-LS 1g bits ddr mobile ram
    Text: PRELIMINARY DATA SHEET 1G bits DDR Mobile RAM WTR Wide Temperature Range , Low Power Function EDD10323BBH-LS (32M words x 32 bits) Specifications Features • Density: 1G bits • Organization: 8M words × 32 bits × 4 banks • Package: 90-ball FBGA


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    EDD10323BBH-LS 90-ball 400Mbps/333Mbps M01E0706 E1435E20 ELPIDA mobile DDR EDD10323BBH-6ELS-F DDR333 DDR400 EDD10323BBH-LS 1g bits ddr mobile ram PDF

    ELPIDA mobile DDR

    Abstract: DDR333 DDR400 EDD51323DBH-LS E1432
    Text: PRELIMINARY DATA SHEET 512M bits DDR Mobile RAM WTR Wide Temperature Range , Low Power Function EDD51323DBH-LS (16M words x 32 bits) Specifications Features • Density: 512M bits • Organization: 4M words × 32 bits × 4 banks • Package: 90-ball FBGA


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    EDD51323DBH-LS 90-ball 400Mbps/333Mbps M01E0706 E1432E20 ELPIDA mobile DDR DDR333 DDR400 EDD51323DBH-LS E1432 PDF

    EDD25163HBH-6ELS-F

    Abstract: ELPIDA mobile DDR DDR266 DDR333 E1434
    Text: PRELIMINARY DATA SHEET 256M bits DDR Mobile RAM WTR Wide Temperature Range , Low Power Function EDD25163HBH-LS (16M words x 16 bits) Specifications Features • Density: 256M bits • Organization: 4M words × 16 bits × 4 banks • Package: 60-ball FBGA


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    EDD25163HBH-LS 60-ball 333Mbps/266Mbps M01E0706 E1434E30 EDD25163HBH-6ELS-F ELPIDA mobile DDR DDR266 DDR333 E1434 PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET 256M bits DDR Mobile RAM WTR Wide Temperature Range , Low Power Function EDD25163HBH-LS (16M words x 16 bits) Specifications Features • Density: 256M bits • Organization: 4M words × 16 bits × 4 banks • Package: 60-ball FBGA


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    EDD25163HBH-LS 60-ball 333Mbps/266Mbps M01E0706 E1434E21 PDF

    EDD10323BBH-LS

    Abstract: 1g bits ddr mobile ram
    Text: PRELIMINARY DATA SHEET 1G bits DDR Mobile RAM WTR Wide Temperature Range , Low Power Function EDD10323BBH-LS (32M words x 32 bits) Specifications Features • Density: 1G bits • Organization: 8M words × 32 bits × 4 banks • Package: 90-ball FBGA


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    EDD10323BBH-LS 90-ball 400Mbps/333Mbps M01E0706 E1435E11 EDD10323BBH-LS 1g bits ddr mobile ram PDF

    1g bits ddr mobile ram

    Abstract: No abstract text available
    Text: PRELIMINARY DATA SHEET 1G bits DDR Mobile RAM WTR Wide Temperature Range , Low Power Function EDD10163BBH-LS (64M words x 16 bits) Specifications Features • Density: 1G bits • Organization: 16M words × 16 bits × 4 banks • Package: 60-ball FBGA


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    EDD10163BBH-LS 60-ball 400Mbps/333Mbps M01E0706 E1436E21 1g bits ddr mobile ram PDF

    MAX8778

    Abstract: maxim 17020e max17020e max 17020e MAX17020 ultrasonic sensor 200khz MAX17020ETJ 17020e max8778 datasheet 24v 5a smps
    Text: 19-4118; Rev 2; 2/09 KIT ATION EVALU E L B A AVAIL Dual Quick-PWM Step-Down Controller with Low-Power LDO, RTC Regulator PDAs and Mobile Communicators Telecommunication TEMP RANGE PIN-PACKAGE -40°C to +85°C 32 TQFN +Denotes a lead Pb -free/RoHS-compliant package.


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    MAX17020 MAX8778 maxim 17020e max17020e max 17020e MAX17020 ultrasonic sensor 200khz MAX17020ETJ 17020e max8778 datasheet 24v 5a smps PDF

    samsung K9 flash

    Abstract: Samsung EOL 168FBGA samsung nor flash samsung s6 K4X1G163PC-FGC3 k4 MARKING CODE samsung K4 samsung cdram
    Text: SAMSUNG's Digital World go contents DRAM ● ● ● ● Computing ❍ DDR3 Products ❍ DDR2 Products ❍ DDR Products ❍ SDRAM Products ❍ System Compatibility ❍ EOL Products Consumer ❍ Products Mobile ❍ Products ❍ EOL Products Graphic & Gaming


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    800MHz-40ns i850E K4X1G163PC 07-Sep-2010 D18ns TRP18ns TRCD18ns samsung K9 flash Samsung EOL 168FBGA samsung nor flash samsung s6 K4X1G163PC-FGC3 k4 MARKING CODE samsung K4 samsung cdram PDF

    0909NS

    Abstract: GDDR5 10x10mm, LGA, 44 pin 170-FBGA 60-LGA MARKING CL4 FBGA DDR3 x32 170FBGA 60-FBGA PC133 133Mhz cl3
    Text: DRAM Code Information 1/9 K4XXXXXXXX - XXXXXXX 1 2 3 4 1. Memory (K) 2. DRAM : 4 3. Small Classification A : Advanced Dram Technology B : DDR3 SDRAM C : Network-DRAM D : DDR SGRAM E : EDO F : FP G : GDDR5 SDRAM H : DDR SDRAM J : GDDR3 SDRAM K : Mobile SDRAM PEA


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    16K/16ms 4K/32ms 8K/64ms 16K/32ms 8K/32ms 2K/16ms 4K/64ms 429ns 667ns 0909NS GDDR5 10x10mm, LGA, 44 pin 170-FBGA 60-LGA MARKING CL4 FBGA DDR3 x32 170FBGA 60-FBGA PC133 133Mhz cl3 PDF

    EDE2116ACBG

    Abstract: EDE2116ACBG-1J-F EDE1116AGBG-1J-F DDR3-800D ELPIDA lpddr DDR3-800E EDE1116AGBG EDJ1108DBSE DDR3 layout EDE1032AGBG
    Text: SELECTION GUIDE DRAM Selection Guide Document No. E1454E90 Ver.9.0 Date Published September 2009 (K) Japan Printed in Japan URL: http://www.elpida.com Elpida Memory, Inc. 2009 DRAM Selection Guide CONTENTS 1. DDR3


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    E1454E90 240-pin M01E0706 EDE2116ACBG EDE2116ACBG-1J-F EDE1116AGBG-1J-F DDR3-800D ELPIDA lpddr DDR3-800E EDE1116AGBG EDJ1108DBSE DDR3 layout EDE1032AGBG PDF

    Untitled

    Abstract: No abstract text available
    Text: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 14.0mm x 14.0mm, 220-ball FBGA EDFA164A1PF Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Package


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    220-ball EDFA164A1PF 1600Mbps M01E1007 E1965E40 PDF

    Untitled

    Abstract: No abstract text available
    Text: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm  15.0mm, 216-ball FBGA EDFA164A1PB Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words  32 bits  8 banks) in one package — Independent 2-channel bus • Package


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    216-ball EDFA164A1PB 1600Mbps M01E1007 E1909E50 PDF

    Untitled

    Abstract: No abstract text available
    Text: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM, QDP EDFA164A1MA Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb 16M words  32 bits  8 banks in one package — Independent 2-channel bus • Package — 253-ball FBGA, QDP (Quad Die Package)


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    EDFA164A1MA 253-ball 1600Mbps M01E1007 E1887E50 PDF

    Untitled

    Abstract: No abstract text available
    Text: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm  15.0mm, 216-ball FBGA EDFA164A1PK Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words  32 bits  8 banks) in one package — Independent 2-channel bus • Package


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    216-ball EDFA164A1PK 1600Mbps M01E1007 E2052E20 PDF

    Untitled

    Abstract: No abstract text available
    Text: COVER DATA SHEET 8Gb DDR3 Mobile RAMTM, DDP EDF8164A1MA Specifications Features • Density: 8Gb • Organization — 2 pieces of 4Gb 16M words  32 bits  8 banks in one package — Independent 2-channel bus • Package — 253-ball FBGA, DDP (Dual Die Package)


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    EDF8164A1MA 253-ball 1600Mbps M01E1007 E1886E40 PDF

    winband

    Abstract: W25X40BV W25Q408W w25x40v W651GG2JB WSON* 8x6mm w25q128 W25X16AV 208-MIL w25X20BV
    Text: t/vinband We D eliver Product Selection Guide - o 2010 Mobile RAM Specialty DRAM Graphics DRAM Flash Memory Memory Product Foundry Service Product Selection Guide 2010 Contents 2 Mobile RAM Pseudo SRAM Low Power SDR SDRAM Low Power DDR / DDR2 SDRAM


    OCR Scan
    300mm winband W25X40BV W25Q408W w25x40v W651GG2JB WSON* 8x6mm w25q128 W25X16AV 208-MIL w25X20BV PDF