561AB
Abstract: lqfp 7x7 LQFP 7x7 package
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LQFP−32, 7x7 CASE 561AB−01 ISSUE O DOCUMENT NUMBER: STATUS: 98AON30893E ON SEMICONDUCTOR STANDARD REFERENCE: Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 32 LEAD LQFP, 7X7
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LQFP-32,
561AB-01
98AON30893E
561AB
561AB
lqfp 7x7
LQFP 7x7 package
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1632CG
Abstract: M30260F6T-48P
Text: M16C/26T 29-May-06 Evaluation of Subsystem Clock Oscillation Circuit [M30260F6T-48P] LQFP 7x7 0.5mm pitch Measurement conditions :3.3V Model Vcc=3.0V to 5.5V :SP-T2A Frequency :Fo=32.768kHz Frequency tolerance :dF/Fo= +/-20x10-6 Load capacitance :CL=12.5pF
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M16C/26T
29-May-06
M30260F6T-48P]
768kHz
/-20x10-6
1x10-6W
1632CG
M30260F6T-48P
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LQFP 7x7 package
Abstract: SSPT7 ssp-t7
Text: M16C/26T 06-Jul-06 Evaluation of Subsystem Clock Oscillation Circuit [M30260F6T-48P] LQFP 7x7 0.5mm pitch Measurement conditions :3.3V Model Vcc=3.0V to 5.5V :SSP-T7 Frequency :Fo=32.768kHz Frequency tolerance :dF/Fo= +/-20x10-6 Load capacitance :CL=12.5pF
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M16C/26T
06-Jul-06
M30260F6T-48P]
768kHz
/-20x10-6
65kohm
1x10-6W
LQFP 7x7 package
SSPT7
ssp-t7
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VT-200
Abstract: No abstract text available
Text: M16C/26T 06-Jul-06 Evaluation of Subsystem Clock Oscillation Circuit [M30260F6T-48P] LQFP 7x7 0.5mm pitch Measurement conditions :3.3V Model Vcc=3.0V to 5.5V :VT-200 IC Frequency :Fo=32.768kHz Frequency tolerance :dF/Fo= +/-20x10-6 Load capacitance :CL=12.5pF
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M16C/26T
06-Jul-06
M30260F6T-48P]
VT-200
768kHz
/-20x10-6
50kohm
1x10-6W
VT-200)
VT-200
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SSP-T7-F
Abstract: 78k0/kc2 mcu 48pin uPD78F0582GB NE-200L-F SSP-T7-FL uPD78F0581GA nec 44pin uPD78F0588GA-48P uPD78F0583GA
Text: 78K0/Kx2-L 21-Aug-09 Evaluation of a Low Frequency Clock Oscillation Circuit SSP-T7-F 7.0pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V NE-200L-F SSP-T7-F Vdd=1.8 to 5.5V Model :SSP-T7-F Frequency :Fo=32.768kHz IC 3.11uWmax
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78K0/Kx2-L
21-Aug-09
uPD78F0588GA-48P
NE-200L-F
768kHz
11uWmax
/-20x10
1x10-6F
65kohm
-925k
SSP-T7-F
78k0/kc2
mcu 48pin
uPD78F0582GB
NE-200L-F
SSP-T7-FL
uPD78F0581GA
nec 44pin
uPD78F0583GA
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uPD78F0588GA-48P
Abstract: nec 44pin
Text: 78K0/Kx2-L 21-Aug-09 Evaluation of a Low Frequency Clock Oscillation Circuit SSP-T7-FL 3.7pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :SSP-T7-FL Frequency :Fo=32.768kHz IC 0.50uWmax
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78K0/Kx2-L
21-Aug-09
uPD78F0588GA-48P
NE-200L-F
768kHz
50uWmax
/-20x10
1x10-6F
65kohm
nec 44pin
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SSP-T7-FL
Abstract: nec 44pin uPD78F0588GA-48P NEC MCU IC CD 3102 SSP-T7F
Text: 78K0/Kx2-L 21-Aug-09 Evaluation of a Low Frequency Clock Oscillation Circuit SSP-T7-FL 6.0pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :SSP-T7-FL Frequency :Fo=32.768kHz IC 1.33uWmax
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78K0/Kx2-L
21-Aug-09
uPD78F0588GA-48P
NE-200L-F
768kHz
33uWmax
/-20x10
1x10-6F
65kohm
78K0/KC2-L
SSP-T7-FL
nec 44pin
NEC MCU
IC CD 3102
SSP-T7F
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nec 44pin
Abstract: uPD78F0582GB uPD78F0588GA-48P VT-200 NEC MCU
Text: 78K0/Kx2-L 09-Sep-09 Evaluation of a Low Frequency Clock Oscillation Circuit VT-200-FL 6.0pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New VT-200-FL NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :VT-200-FL Frequency :Fo=32.768kHz
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78K0/Kx2-L
09-Sep-09
VT-200-FL
uPD78F0588GA-48P
VT-200-FL
NE-200L-F
768kHz
33uWmax
/-20x10
nec 44pin
uPD78F0582GB
VT-200
NEC MCU
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PDF
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uPD78F0588GA-48P
Abstract: nec 44pin uPD78F0582GB VT-200 RL246
Text: 78K0/Kx2-L 09-Sep-09 Evaluation of a Low Frequency Clock Oscillation Circuit VT-200-FL 3.7pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New VT-200-FL NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :VT-200-FL Frequency :Fo=32.768kHz
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78K0/Kx2-L
09-Sep-09
VT-200-FL
uPD78F0588GA-48P
VT-200-FL
NE-200L-F
768kHz
50uWmax
/-20x10
nec 44pin
uPD78F0582GB
VT-200
RL246
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7x7x1.4
Abstract: 932AA
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 48 LEAD LQFP, 7x7, 0.5P CASE 932AA−01 ISSUE A SCALE 2:1 DATE 13 OCT 2008 4X 0.2 Y T-U Z D PIN 1 CORNER D/2 Z 48 1 36 5 T e/2 DETAIL K 37 U G E G E1 E/2 E1/2 12 T, U, Z 25 DETAIL K NOTE 9 13 24 D1/2 D1 4X BASE METAL
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932AA-01
932AA
7x7x1.4
932AA
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TQ32
Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
Text: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*
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Jul-00
Oct-00
Jan-01
Apr-01
Jul-01
Oct-01
10X10,
TQ32
ablestik
amkor
amkor cabga
Nitto
ASE LQFP 208
CABGA 6x6
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JEDEC MS-026
Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
JEDEC MS-026
MS-026
Amkor mold compound
lqfp 7x7 tray
jedec MS-026-A
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lqfp 7x7 tray
Abstract: MS-026 7X748LD amkor
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
lqfp 7x7 tray
MS-026
7X748LD
amkor
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A2 diode
Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5
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S176GM-50-3EU,
S176GM-50-8EU-2
S208GD-50-5ML-2
S208GD-50-5EL-1
P208GD-50-LML,
S208GD-50-8EU-2
S216GM-40-8EV
P240GN-50-LMU,
S256GD-40-LMV,
S272GP-50-LMU,
A2 diode
transistor A2
3eb data
lmu a2
TQFP 32 PACKAGE
272-pin
TQFP 100 Pitch 0,4
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tray qfn 6x6
Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
Text: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA
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O-236AB
OT-23)
OT-23
O-220
O-252
OT-223
QFN00/Reel
490/Tray
tray qfn 6x6
tqfp 7x7 tray
QFN tray 5x5
QFN tray
QFn Package tray
QFN tray qfn 4x4
QFN tray 4x4
LQFP Package tray
6x6 TRAY
tray QFN 5x5
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nec 44 pin LQFP
Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
nec 44 pin LQFP
BGA and QFP Package
256-pin BGA drawing
14 pin ic
28-pin QFP
nec 44-pin qfp
44-Pin QFN
65A1
nec 44-pin LQFP
ic packages
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789104a
Abstract: nec 44 pin LQFP 78F9116A 78f9136a 78F9418AGC 789124A 30-pin nec 78F9468 78F9328 30PIN
Text: HOME SOLUTIONS PRODUCTS TECHNOLOGY HIGHLIGHTS SUPPORT COMPANY PROFILE NEWS AND EVENTS MICROCOMPUTER Microcomputer HOME Product Overview 8bit 78K0S Series : Development Environment NEC Electronics Tools Programming Environment Product Lineup Development Environment
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78K0S
44-pin
10x10)
30-pin
789104a
nec 44 pin LQFP
78F9116A
78f9136a
78F9418AGC
789124A
30-pin nec
78F9468
78F9328
30PIN
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HLQFP 176 Package
Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Text: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)
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13x36
13x45
14x37
17x56
17x57
O-92L
OT-25
10x10
15x15
HLQFP 176 Package
FBGA Package 14x14
121 bga 10x10
BGA 27X27 pitch
23X23
lfbga 12X12
1.0/Daewon BGA 7x7
hssop
TQFP 14X20
TSOP 14X20
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PWM example sTM8l
Abstract: STM8L151 ufdfpn8 footprint STM8AF6223 STM8AF62 STM8L101 stm8l152 STM8AF5288 stm8l151F2 STM8AF5268
Text: STM8 product families STMicroelectronics 8‑bit microcontrollers www.st.com/mcu STM8 8‑bit microcontrollers The STM8 is a platform of technologies, IPs and tools which forms the basis of STMicroelectronics’ comprehensive family of 8‑bit microcontrollers. These cover a wide range of applications from low‑power and
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BRSTM80610
PWM example sTM8l
STM8L151
ufdfpn8 footprint
STM8AF6223
STM8AF62
STM8L101
stm8l152
STM8AF5288
stm8l151F2
STM8AF5268
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MS-026 lqfp 80
Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Text: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging
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tqfp 7x7
Abstract: 10X10 14X14 LQFP 7x7 package
Text: TQFP Packaging Capabilities Surface Mount Description packages with a nominal body thickness of 1.0mm. This package finds many applications where size and weight are a critical factor. The Thin Quad Flatpack TQFP plastic package family is a reduced thickness plastic surface mount package.
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GA00050PM7/00
tqfp 7x7
10X10
14X14
LQFP 7x7 package
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PDF
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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tray 20 x 14
Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type
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E04102
tray 20 x 14
BGA 31 x 31 tray
bga trays
tray bga 17
bga tray
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