LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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MS-026
Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
Text: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is
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MS-026 lqfp 80
Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Text: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging
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JEDEC MS-026
Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
JEDEC MS-026
MS-026
Amkor mold compound
lqfp 7x7 tray
jedec MS-026-A
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lqfp 7x7 tray
Abstract: MS-026 7X748LD amkor
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
lqfp 7x7 tray
MS-026
7X748LD
amkor
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Techpoint
Abstract: 100L JESD51-2 JESD51-7 lqfp 7x7 tray QFP 128 bonding
Text: LQFP Low Profile Quad Flat Pack • 7 x 7mm to 28 x 28mm body sizes • 32 to 208 lead counts • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 28 x 28mm STATS ChipPAC’s LQFP is a low profile 1.4mm version of the QFP. The LQFP is a leadframe based, plastic encapsulated
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LQFP Package tray
Abstract: 128-PIN nec 144 pin LQFP LQFP Package 128-pin LQFP 144 tray
Text: TRAY CONTAINER UNIT : mm 17.55 135°C MAX 22.63 25.40 17.80 22.63 100.8 A' LQFP 20x20×1.4 25.20 135.9 NEC A 279.4 315.0 322.6 SECTION A-A' 22.63 6.02 (6.35) 7.62 19.85 Applied Package Quantity (pcs) Material 128-pin Plastic LQFP (Fine Pitch) (1.4mm thick)
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128-pin
144-pin
176-pin
SSD-A-H6553-1
LQFP Package tray
nec 144 pin LQFP
LQFP Package 128-pin
LQFP 144 tray
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LQFP Package tray
Abstract: TQFP14X14X1 LQFP "100 pin" PACKAGE LQFP Package 128-pin 128-PIN tray container dimensions TRAY CONTAINER LQFP14 100-PIN PLASTIC LQFP NEC tqfp14x14x1.4
Text: TRAY CONTAINER 7 15.45 16.7 6x15=90 21.00 A' A 150°C MAX. PPE 105.0 TQFP14X14X1.4 15.40 16.7 20.30 284.2 315.0 322.6 Section A – A' 16.7 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 80-pin Plastic LQFP (1.4mm thick) 100-pin Plastic LQFP (1.4mm thick)
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TQFP14X14X1
LQFP14
80-pin
100-pin
128-pin
SSD-A-H6285-2
-A-H6285-2
LQFP Package tray
LQFP "100 pin" PACKAGE
LQFP Package 128-pin
tray container dimensions
TRAY CONTAINER
100-PIN PLASTIC LQFP NEC
tqfp14x14x1.4
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ZL50011QCG1
Abstract: GR-1244-CORE MS-026 ZL50011
Text: ZL50011 Flexible 512 Channel DX with on-chip DPLL Data Sheet Features • March 2006 512 channel x 512 channel non-blocking switch at 2.048 Mbps, 4.096 Mbps or 8.192 Mbps operation Ordering Information 160 Pin LQFP Trays 144 Ball LBGA Trays 160 Pin LQFP* Trays, Bake & Drypack
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ZL50011
ZL50011/QCC
ZL50011/GDC
ZL50011QCG1
ZL50011GDG2
GR-1244-CORE
ZL50011QCG1
MS-026
ZL50011
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LQFP Package tray
Abstract: 128-PIN ST-TQ142014TJ-1 NEC 87 tray dimensions
Text: TRAY CONTAINER A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A-A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 128-pin Plastic LQFP (1.4mm thick) 5.62 6.35 7.62 19.87 Quantity (pcs)
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ST-TQ142014TJ-1
100-pin
128-pin
SSD-A-H5941-1
LQFP Package tray
ST-TQ142014TJ-1
NEC 87
tray dimensions
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LQFP1414-8bt Package tray
Abstract: LQFP Package tray h658 LQFP1414-8BT
Text: TRAY CONTAINER HEAT PROOF 7 A' 15.45 18.0 6x15=90 21.00 A 135°CMAXPPE 105.0 NEC LQFP1414−8BT 15.40 18.0 20.30 284.2 315.0 322.6 < SECTION A – A' > 18.0 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (1.4mm thick)
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LQFP1414-8BT
64-pin
80-pin
SSD-A-H6583-1
LQFP1414-8bt Package tray
LQFP Package tray
h658
LQFP1414-8BT
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HM-RAE105
Abstract: RPG100 PEAK TRAY qfn 4 x 4 RPG100F RPG100-01 qfn 5 x 5 TRAY PEAK TRAY qfn
Text: HM-RAE105-1105 PACKAGE [ RPG100 ] 32-pin plastic LQFP 32-pin plastic LQFP Lead pitch 0.80mm Package width x package length 7 x 7 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Note1 * :These dimensions do not include resin protrusion.
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HM-RAE105-1105
RPG100
32-pin
RPG100F
HM-RAE105
RPG100
PEAK TRAY qfn 4 x 4
RPG100F
RPG100-01
qfn 5 x 5 TRAY
PEAK TRAY qfn
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PCR 406 J
Abstract: transistor pcr 406 sdc 7500 pwm control PCR 406 J transistor PCR 406 TRANSISTOR smd transistor pk3 sdc 7500 transistor SMD PJ3 data sheet for all smd components NEW TRANSISTOR DATA SHEET
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5606S Rev. 1, 10/2008 MPC5606S LQFP–144 MAPBGA–225 QFN12 20 mm x 20 mm ##_mm_x_##mm 15 mm x 15 mm MPC560xS Microcontroller Data Sheet LQFP–176 24 mm x 24 mm SOT-343R ##_mm_x_##mm
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MPC5606S
QFN12
MPC560xS
OT-343R
32-bit
MPC5606S
PCR 406 J
transistor pcr 406
sdc 7500 pwm control
PCR 406 J transistor
PCR 406 TRANSISTOR
smd transistor pk3
sdc 7500
transistor SMD PJ3
data sheet for all smd components
NEW TRANSISTOR DATA SHEET
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MPC5601D
Abstract: MPC5602D MPC560* reference manual JESD51-3 JESD51-7 LQFP100 LQFP64 MPC560 e200Z0 IEEE-ISTO
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5602D Rev. 4, 07/2011 MPC5602D 100 LQFP 14 mm x 14 mm 64 LQFP 10 mm x 10 mm MPC5602D Microcontroller Data Sheet • • • • • • • • • • • • • • • • •
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MPC5602D
MPC5602D
32-bit
e200z0h)
16-bit
16b-free
MPC5601D
MPC560* reference manual
JESD51-3
JESD51-7
LQFP100
LQFP64
MPC560
e200Z0
IEEE-ISTO
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5602P Rev. 4.1, 09/2011 MPC5602P MPC5602P Microcontroller Data Sheet 100 LQFP 14 mm x 14 mm 64 LQFP (10 mm x 10 mm) • Up to 64 MHz, single issue, 32-bit CPU core complex (e200z0h)
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MPC5602P
MPC5602P
32-bit
e200z0h)
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MPC5602P
Abstract: bldc motor eps steering bosch relay equivalent MPC5601P e200Z0h- instruction set 16-CCITT MPC5602 CRC-32 JESD51-2 JESD51-7
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5602P Rev. 4.1, 09/2011 MPC5602P MPC5602P Microcontroller Data Sheet 100 LQFP 14 mm x 14 mm 64 LQFP (10 mm x 10 mm) • Up to 64 MHz, single issue, 32-bit CPU core complex (e200z0h)
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MPC5602P
MPC5602P
32-bit
e200z0h)
bldc motor eps steering
bosch relay equivalent
MPC5601P
e200Z0h- instruction set
16-CCITT
MPC5602
CRC-32
JESD51-2
JESD51-7
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LQFP Package tray
Abstract: JEDEC TRAY DIMENSIONS tray container dimensions
Text: TRAY CONTAINER UNIT : mm 10 x 25=250 113.4 135.9 PPE NEC 135° C MAX. A' 9.60 11.25 12.60 LQFP7 × 7× 1.4 A 9.60 12.20 11.10 292.8 315.0 322.6 SECTION A-A' 9.60 5.62 (6.35) 7.62 6.82 Applied Package 48-pin Plastic LQFP (Fine Pitch)(1.4mm thick) 64-pin Plastic LQFP (Fine Pitch)(1.4mm thick)
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48-pin
64-pin
SSD-A-H7499
LQFP Package tray
JEDEC TRAY DIMENSIONS
tray container dimensions
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 10, 11/2012 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
16-bit
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MPC5604B
Abstract: mpc5604 MPC5603 MPC5602B MPC5607 trace MPC56 MPC560 ic lm 4704 MPC5603B ordering MPC56
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 8, 11/2010 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 15 MAPBGA mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C Microcontroller Data Sheet SOT-343R ##_mm_x_##mm 100 LQFP
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
MPC5604B
mpc5604
MPC5603
MPC5602B
MPC5607
trace MPC56
MPC560
ic lm 4704
MPC5603B ordering
MPC56
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MPC5604P
Abstract: sdc 7500 scr values MPC5603 MPC5603P airbag RF NPN POWER TRANSISTOR 2 GHZ
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604P Rev. 4, 7/2009 MPC5604P 144 LQFP 20 x 20 x 1.4 mm 100 LQFP 14 x 14 x 1.4 mm MPC5604P Microcontroller Data Sheet • High performance 64 MHz e200z0h CPU – 32-bit Power Architecture Book E CPU
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MPC5604P
MPC5604P
e200z0h
32-bit
16-channel
sdc 7500
scr values
MPC5603
MPC5603P
airbag
RF NPN POWER TRANSISTOR 2 GHZ
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5604BC Rev. 12, 04/2014 MPC5604B/C MAPBGA–225 QFN12 144 LQFP ##_mm_x_##mm 208 MAPBGA 15 mm x 15 mm 17 x 17 x 1.7 mm MPC5604B/C SOT-343R ##_mm_x_##mm 100 LQFP (14 x 14 x 1.4 mm)
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MPC5604BC
MPC5604B/C
QFN12
OT-343R
32-bit
e200z0)
16-bit
32-bit
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5602D Rev. 5, 11/2011 MPC5602D 100 LQFP 14 mm x 14 mm 64 LQFP 10 mm x 10 mm MPC5602D Microcontroller Data Sheet • • • • • • • • • • • • • Single issue, 32-bit CPU core complex e200z0h
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MPC5602D
MPC5602D
32-bit
e200z0h)
16-bit
32-bit
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Product specification LCD row/column driver for dot matrix graphic displays CONTENTS PCF8578 18 SOLDERING Introduction Reflow soldering Wave soldering LQFP VSO Method LQFP and VSO Repairing soldered joints 1 FEATURES 2 APPLICATIONS
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