LQFP20 Search Results

Contextual Info: M Di ain sc te on na tin nc ue e/ d ea s ht e v tp is :// it pa fo na llo so win ni g c. U co R .jp L a /s bo em u ic t la on te /e st -in in de for x. ma ht t m ion l . DATA SHEET MN673744 MN673744HL Package Code No. MLGA239-C-1111 LQFP208-P-2828 Pl Part No.

PLQP0208KB-A

Abstract: LQFP208
Contextual Info: JEITA Package Code P-LQFP208-28x28-0.50 RENESAS Code PLQP0208KB-A Previous Code ⎯ MASS[Typ.] 2.7g HD *1 D 156 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 105 157 104 bp c c1 HE *2 E b1 Reference

ZD MARK 22

Contextual Info: JEITA Package Code P-LQFP208-28x28-0.50 RENESAS Code PLQP0208KA-A Previous Code FP-208C/FP-208CV MASS[Typ.] 2.7g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 156 105 157 104 bp c c1 HE Reference

LQFP208

Abstract: SOT459 MS-026
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1 c y X A 105 156 157 104 ZE e E HE A 3 A A2 A1 wM θ Lp bp L detail X pin 1 index 208 53 1 52 v M A ZD wM bp

Contextual Info: Low-cost, low-power ARM9 microcontrollers High integration and superior performance at an affordable price The NXP ARM9 portfolio ARM926EJ-S ARM968 ARM926EJ-S ARM926EJ-S ARM926EJ-S ARM922T LPC29xx LPC313x LPC3180/01 LPC32x0 LH7A40x LPC314x LPC315x LQFP144, LQFP208,

Contextual Info: LQFP208-P-2828-0.50-K Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 2.45 TYP. 4 版/98.11.10

LQFP-208

Abstract: LQFP208
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1 c y X A 105 156 157 104 ZE e E HE A 3 A A2 A1 wM θ Lp bp L detail X pin 1 index 208 53 1 52 v M A ZD wM bp

LQFP208

Abstract: MS-026 LQFP-208
Contextual Info: PDF: 2000 Feb 14 Philips Semiconductors Package outline LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1 c y X A 105 156 157 104 ZE e E HE A 3 A A2 A1 wM θ Lp bp L detail X pin 1 index 208 53 1 52 v M A ZD wM bp

Contextual Info: 208P6Q-A Plastic 208pin 28✕28mm body LQFP EIAJ Package Code LQFP208-P-2828-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – b2 208 ME Under Planning HD D 157 156 1 I2 Recommended Mount Pad E HE Symbol 105 52 53 104 A L1 F A1 c A2 e b y L Detail F

LQFP208-P-2828-0

Contextual Info: LQFP208-P-2828-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 2.45 TYP. 4/Nov. 10, 1998

LQFP208 reflow soldering footprint

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP208 package SOT459-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

LQFP208

Abstract: MN673744 MN673744HL ADC hard radiation
Contextual Info: DATA SHEET Part No. MN673744 MN673744HL Package Code No. MLGA239-C-1111 LQFP208-P-2828 SEMICONDUCTOR COMPANY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. Publication date: December 2004 SDF00036AEM 1 MN673744, MN673744HL MN673744, MN673744HL Video Digital Conversion LSI

LQFP208

Abstract: I051
Contextual Info: LQFP208-P-2828-0.50A U nit : mm LQFP208-P-2828-0.50A 1.25TYP Unit mm Bo + o o e

LQFP208

Contextual Info: LQFP208-P-2828-0.50-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

LPC9221

Abstract: embedded c code to interface lpc2148 with sensor P89V51RD2 microcontroller LPC2148 i2c with sensor LPC925 p89v51rd2 LPC700 LPC2148 p89v51rd2 development board lpc1754
Contextual Info: April 2009 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from

LPC2148 i2c eeprom c code

Abstract: lcd c program using lpc2378 LPC2468 embedded c code to interface lpc2148 with sensor LPC932A1 LPC922 LPC932A lpc921 lpc935 ac motor control LPC2378 instruction cache
Contextual Info: August 2008 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from

MB91F594

Abstract: MB91F59BC
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS705-00010-3v0-E 32-bit Microcontroller FR Family FR81S MB91590 Series * *

MB91570

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion

MB91F5

Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS705-00010-2v1-E 32-bit Microcontroller FR Family FR81S MB91590 Series * *

MB91F467EA

Contextual Info: MB91460E-DS705-00002-1v3-E.fm Page 1 Wednesday, September 29, 2010 9:47 AM FUJITSU SEMICONDUCTOR DATA SHEET DS705-00002-1v3-E 32-bit Microcontroller CMOS FR60 MB91460E Series MB91F467EA • DESCRIPTION MB91460E series is a line of general-purpose 32-bit RISC microcontrollers designed for embedded control

RBS 6000 pin assignment serial cable

Abstract: sja2510 maxon EC-max SCR GATE DRIVER maxon dc motor 217-R LM 7804 K 9008 maxon modem maxon motor a max
Contextual Info: UM10316 LPC29xx User manual Rev. 01 — 22 May 2009 User manual Document information Info Content Keywords LPC2917/01; LPC2919/01; LPC2927; LPC2929; LPC2921; LPC2923; LPC2925; LPC2930; LPC2939 User Manual, ARM9, CAN, LIN, USB Abstract This document extends the LPC29xx data sheets with additional details to

STM32F429N

Abstract: STM32F429Ni
Contextual Info: STM32F427xx STM32F429xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex®-M4 CPU with FPU,

Contextual Info: STM32F437xx STM32F439xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera&LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex®-M4 CPU with FPU,

IR power mosfet switching power supply

Abstract: trailing SCHEMATIC dimmer 568AF IR2136 application note RDA 8810 marking code SM texas ARMv5TE usermanual datasheet Po 9038 LPC2927 LPC2929
Contextual Info: D D R R A A A A A FT FT FT FT FT D R R A A FT FT FT FT A A R R D D D D R R A FT FT FT A A R R D D D R A F FT FT A A R R D D User manual D Rev. 01.01 — 14 July 2009 R R R LPC29xx User manual D D D UM10316 D FT FT A A R R D D D R A FT D R A Document information