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    Abstract: No abstract text available
    Text: â–¡ATE 5 -1 5 -9 0 1 -6 -9 5 REVISIONS C H G 'D . INTENSITY FROM 8 .0 m o d TO 2 0 .0 REV m cd. A REDRAWN, UPDATED S P E C S ./ B RELIABILITY NOTE: OUR MANY YEARS OF EXPERIENCE DATA ACCUMULATION INDICATE THAT SOLDER HEAT IS A MAJOR CAUSE OF EARLY AND FUTURE FAILURE.


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