curing
Abstract: instruction bulletin b-130 cure GT-14 M-BOND 600
Text: M-Bond 600 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 600 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol • Silicon-Carbide Paper • M-Prep Conditioner A • • • • • • • M-Prep Neutralizer 5A
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GT-14
08-Apr-05
curing
instruction bulletin b-130
cure
M-BOND 600
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Untitled
Abstract: No abstract text available
Text: M-Bond 600 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 600 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges
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GT-14
27-Apr-11
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instruction bulletin b-130
Abstract: M-BOND 610 FOR TRANSDUCERS M-BOND GA-61 mjg-2 TT-609 M-BOND GA-61 cure temperatures m-bond 450 b Instruction Bulletin B-130, tt606 GT-14
Text: Instruction Bulletin B-130 Vishay Micro-Measurements Strain Gage Installations with M-Bond 43-B, 600, and 610 Adhesive Systems INTRODUCTION SURFACE PREPARATION Vishay Micro-Measurements M-Bond 43-B, 600, and 610 adhesives are high-performance epoxy resins, formulated
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B-130
11-Apr-07
instruction bulletin b-130
M-BOND 610 FOR TRANSDUCERS
M-BOND GA-61
mjg-2
TT-609
M-BOND GA-61 cure temperatures
m-bond 450 b
Instruction Bulletin B-130,
tt606
GT-14
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M-BOND GA-61
Abstract: dupont mylar rohs degreaser GA 61 Vishay GT-14
Text: M-Bond GA-61 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND GA-61 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol • Silicon-Carbide Paper • M-Prep Conditioner A • • • • • • • M-Prep Neutralizer 5A
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GA-61
GA-61
GT-14
08-Apr-05
M-BOND GA-61
dupont mylar rohs
degreaser
GA 61
Vishay
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GT-14
Abstract: dupont mylar M-BOND 610
Text: M-Bond 610 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION: • • • • • • • • • • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A
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GT-14
005mm]
08-Apr-05
dupont mylar
M-BOND 610
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Instruction Bulletin B-130,
Abstract: GT-14 dupont mylar rohs
Text: M-Bond 43-B Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 43-B INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol • Silicon-Carbide Paper • M-Prep Conditioner A • • • • • • • M-Prep Neutralizer 5A
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GT-14
08-Apr-05
Instruction Bulletin B-130,
dupont mylar rohs
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Untitled
Abstract: No abstract text available
Text: M-Bond 610 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges
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GT-14
005mm]
27-Apr-11
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Untitled
Abstract: No abstract text available
Text: M-Bond 43-B Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 43-B INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges
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GT-14
27-Apr-2011
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Untitled
Abstract: No abstract text available
Text: M-Bond GA-61 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND GA-61 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges
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GA-61
GA-61
GT-14
27-Apr-2011
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27611
Abstract: 27611 transistor A 27611 transistor A 27611 benzene M-BOND 600 monograph LD50 msds vishay M-BOND 600 safety data
Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond Curing Agent 600/610 October 21, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM013L 919-365-3800 CHEMTREC 1-800-424-9300 U.S.
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MGM013L
805-FRM011
27611
27611 transistor
A 27611
transistor A 27611
benzene
M-BOND 600
monograph
LD50
msds vishay
M-BOND 600 safety data
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M-BOND 600
Abstract: LD50 CAS No. 28064-14-4 28064-14-4 ld50 c M-BOND 600 safety data 14034 flammable "Flammable Liquid"
Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond 600 Adhesive October 21, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM011J 919-365-3800 CHEMTREC 1-800-424-9300 U.S. 703-527-3887 (Outside U.S.)
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MGM011J
805-FRM011
M-BOND 600
LD50
CAS No. 28064-14-4
28064-14-4
ld50 c
M-BOND 600 safety data
14034
flammable
"Flammable Liquid"
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28064-14-4
Abstract: M-BOND GA-61 CAS No. 28064-14-4 A 27611 MATERIAL SAFETY 29CFR1910 transistor A 27611 LD50 polyglycidyl M-Bond GA - 61 A
Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond GA-61 Part A November 23, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM016I 919-365-3800 CHEMTREC 1-800-424-9300 (U.S.)
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GA-61
MGM016I
805-FRM011
28064-14-4
M-BOND GA-61
CAS No. 28064-14-4
A 27611
MATERIAL SAFETY
29CFR1910
transistor A 27611
LD50
polyglycidyl
M-Bond GA - 61 A
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L0508
Abstract: l2920 W068
Text: Microwave Capacitors GH/ GB Series ③ Working Voltage Code Features 5 aximum capacitance change of ±15% M from −55°C to +125°C • G old ter minations 100µ inches over barrier layer • Excellent bond strength MIL−STD−883, method 2011.5 • Available with and without borders
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MIL-STD-883,
50WVDC
N1500
N3300
N4700
100WVDC
30ppm/
250ppm/
1000ppm/
L0508
l2920
W068
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Untitled
Abstract: No abstract text available
Text: SDA-6000 SDA-6000 GaAs Distributed Amplifier GaAs DISTRIBUTED AMPLIFIER Die: 2.21 mm x 1.21 mm x 0.102 mm Product Description Features RFMD’s SDA-6000 is a directly coupled DC GaAs microwave monolithic integrated circuit (MMIC) distributed driver amplifier die designed to support a wide array of high frequency commercial, military, and space applications. They are ideal for wideband amplifier gain blocks, modulators,
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SDA-6000
SDA-6000
SDA-6000SB
DS100223
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C122D SCR thyristor
Abstract: scr driver dc motor speed control dc motor speed control using scr driver universal MOTOR speed control using scr DC motor speed control circuit with SCR C122E scr scr driver ac motor speed control C122E scr general electric DC SCR Armature Voltage control thyristor SCR 406
Text: SCR C122 8 A RMS Up to 600 Volts The C l22 is a m olded silicon plastic SCR which incorporates General Electric’s new POWERGLAS glassivation process. This process provides for an intimate void-free bond between the silicon chip and the glass coating significantly improving performance and reliability.
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O-22QAB
C122D SCR thyristor
scr driver dc motor speed control
dc motor speed control using scr driver
universal MOTOR speed control using scr
DC motor speed control circuit with SCR
C122E scr
scr driver ac motor speed control
C122E scr general electric
DC SCR Armature Voltage control
thyristor SCR 406
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CMP-01
Abstract: No abstract text available
Text: SP - 2107 liHiiiiimui Bond Pad Buried Zener Nichrome Clear Field Area 1- HPNP HNPN 0 N+/P+Diode Esa Pinch Resistor i— i DBNPN | DBPNP (I ) MNPN @ MPNP [] SPNP ¡SNPN Capacitor Block m 1^lpF SP2107 COMPONENT COUNT SUMMARY DESCRIPTION COUNT Tiles:
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SP2107
SPI204
CMP-01
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JAN 1N4500
Abstract: 1N4500
Text: COMPUTER DIODE JAN & JANTX 1N4500 500m A Switching Diode FEATU RES D ESCR IPTIO N • • • • • This device is a fast sw itching, high con ductance diode for military, space, high rel and other systems. M etallurgical Bond Qualified to MIL-S-19500/403
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500mA
1N4500
MIL-S-19500/403
DO-35
80Vdc
75Vpk
300mAdc
JAN 1N4500
1N4500
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2N4430
Abstract: AC5000 OAC3000 OAC5000
Text: O PT E K TECHNOLOGY INC MñE D • LTTÔSÛÜ OOOmGS 23G ■ OTK fcHjOPTEK Product Bulletin OAC3000 V -X * “T *0 March 1990 3' Extra Fast Recovery Rectifier Die OAC3000/OAC5000 Series • Contact metallization for wire bond and surface mount package construction:
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k71S5aG
OAC3000
AC3000/O
AC5000
OAC3000
OAC5000
2N4430
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Untitled
Abstract: No abstract text available
Text: F requency M Lcvel 1 3 ixers 2 5 kHz to 7 GHz SBL / SIMA/ SRA + 1 3 dBm LO, up to + 9 dBm RF FREQUENCY MHz MODEL NO. w LO/RF CONVERSION LOSS dB Mid-Bond TolaJ x Max. Max. IF TFM / TUF LO-RF ISOLATION, dB LO-IF ISOLATION, dB L M U l M U Typ. Min. Typ. Min. Typ. Min. Typ. Min. Typ. Min. Typ. Min.
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ROK-186MH
SRA-2010MH
TFM-12MH
TFM-42MH
DC-500
DC-200
DC-250
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10N03
Abstract: 06N03 VU050-12N03 04n03 14n03 VU050-16N03 VU050-08N03 IT5 rectifier 16N03 12n03
Text: MbE D • 4 h ñ b 25 b 0 0 G 1 25 5 3 H I X Y I X Y S CORP 'T-Z.SiQ^ g m -< n TYYS k_J Data Sheet No. 911004A - November 1991 Three-Phase Diode Rectifier Bridge VU050 FEATURES:_ • Isolated Direct Copper Bond Base Plate
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E72873M)
11004A
VU050
VU050-04N03
VU050-06N03
VU050-08N03
VU050-10N03
VU050-12N03
VU050-14N03
VU050-16N03
10N03
06N03
04n03
14n03
VU050-16N03
IT5 rectifier
16N03
12n03
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JAN 1N4500
Abstract: No abstract text available
Text: COMPUTER DIODE 1N4500, JAN & JANTX 1N4500 500mA Switching Diode FEATURES DESCRIPTION • • • • T h is d evice ¡s a fast sw itching, high co n d u cta n ce diode for m ilitary, space, high rel and other systems. Metallurgical Bond Qualified to MIL-S-19500/403
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500mA
1N4500,
1N4500
MIL-S-19500/403
DO-35
80Vdc
75Vpk
300mAdc
20mAdc
300mAde
JAN 1N4500
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IRFC9130
Abstract: IRFC9140
Text: INTERN ATI ONAL RECTIFIER SbE D • 4flS54S2 QG1G101 fl ■ HEXFET Die N-Channel International l&R| Rectifier > Electrical Probe Specifications for P-Channel H E X F E T f & III Power M O S FE T Die Recommended Bond Wire S i n Hex Size 1 2 3 4 Part Number
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4flS54S2
QG1G101
IRFC9014
IRFC9110
IRFC9210
IRFC9024
IRFC9120
IRFG9220
IRFC9034
IRFC9130
IRFC9140
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VB013-08N02
Abstract: VB013 06N02 VB013-06N02 VB013-12N02 D-6840 E72873M VB013-12A02 VB013-14N02 VB013-14A02
Text: 4bE D I • 4böb2Eb ODOiab^ 3 H I X Y X Y S CORP DIXYS T i V o T Data Sheet No. 911011A N o v e m b e r 1991 Single-Phase Diode Rectifier Bridge VB013 • Avalanche Rated Parts Available • Isolated Direct Copper Bond Base Plate
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E72873M)
11011A
VB013
VB013-04N02
VB013-06N02
VB013-08N02
VB013-10N02
VB013-12N02
VB013-14N02
VB013-16N02
VB013
06N02
D-6840
E72873M
VB013-12A02
VB013-14A02
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Untitled
Abstract: No abstract text available
Text: ¥/iïl H EW LETT* mLtLMP A C K A R D Reverse Surface Mount Flip Chip LEDs Technical Data HSMx-H630/H730 F e atu res Applications • R everse M ountable Surface Mount LED • B reakthrough R eliability through E lim ination o f Internal W ire Bond • -40°C to + 85*C Operating
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HSMx-H630/H730
HSMx-H630/H730
5966-3245E
966-4930E
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