Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    M-BOND 600 Search Results

    M-BOND 600 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    5962-9762201QEA Texas Instruments Quad LVDS Receiver 16-CDIP -55 to 125 Visit Texas Instruments Buy
    SN65LV1023ARHBR Texas Instruments 10:1 LVDS Serdes Transmitter 100 - 660Mbps 32-VQFN -40 to 85 Visit Texas Instruments Buy
    SN65LV1224BDBR Texas Instruments 1:10 LVDS Serdes Receiver 100 - 660Mbps 28-SSOP -40 to 85 Visit Texas Instruments Buy
    SN65LVCP22DR Texas Instruments 2x2 Crosspoint Switch : LVDS Outputs 16-SOIC -40 to 85 Visit Texas Instruments Buy
    SN65LVCP23PW Texas Instruments 2x2 Crosspoint Switch : LVPECL Outputs 16-TSSOP -40 to 85 Visit Texas Instruments Buy

    M-BOND 600 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    M-BOND 600 Vishay Strain Gage Adhesive Original PDF

    M-BOND 600 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    curing

    Abstract: instruction bulletin b-130 cure GT-14 M-BOND 600
    Text: M-Bond 600 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 600 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol • Silicon-Carbide Paper • M-Prep Conditioner A • • • • • • • M-Prep Neutralizer 5A


    Original
    PDF GT-14 08-Apr-05 curing instruction bulletin b-130 cure M-BOND 600

    Untitled

    Abstract: No abstract text available
    Text: M-Bond 600 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 600 INSTALLATION: •          CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges


    Original
    PDF GT-14 27-Apr-11

    instruction bulletin b-130

    Abstract: M-BOND 610 FOR TRANSDUCERS M-BOND GA-61 mjg-2 TT-609 M-BOND GA-61 cure temperatures m-bond 450 b Instruction Bulletin B-130, tt606 GT-14
    Text: Instruction Bulletin B-130 Vishay Micro-Measurements Strain Gage Installations with M-Bond 43-B, 600, and 610 Adhesive Systems INTRODUCTION SURFACE PREPARATION Vishay Micro-Measurements M-Bond 43-B, 600, and 610 adhesives are high-performance epoxy resins, formulated


    Original
    PDF B-130 11-Apr-07 instruction bulletin b-130 M-BOND 610 FOR TRANSDUCERS M-BOND GA-61 mjg-2 TT-609 M-BOND GA-61 cure temperatures m-bond 450 b Instruction Bulletin B-130, tt606 GT-14

    M-BOND GA-61

    Abstract: dupont mylar rohs degreaser GA 61 Vishay GT-14
    Text: M-Bond GA-61 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND GA-61 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol • Silicon-Carbide Paper • M-Prep Conditioner A • • • • • • • M-Prep Neutralizer 5A


    Original
    PDF GA-61 GA-61 GT-14 08-Apr-05 M-BOND GA-61 dupont mylar rohs degreaser GA 61 Vishay

    GT-14

    Abstract: dupont mylar M-BOND 610
    Text: M-Bond 610 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION: • • • • • • • • • • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A


    Original
    PDF GT-14 005mm] 08-Apr-05 dupont mylar M-BOND 610

    Instruction Bulletin B-130,

    Abstract: GT-14 dupont mylar rohs
    Text: M-Bond 43-B Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 43-B INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol • Silicon-Carbide Paper • M-Prep Conditioner A • • • • • • • M-Prep Neutralizer 5A


    Original
    PDF GT-14 08-Apr-05 Instruction Bulletin B-130, dupont mylar rohs

    Untitled

    Abstract: No abstract text available
    Text: M-Bond 610 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION: •          CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges


    Original
    PDF GT-14 005mm] 27-Apr-11

    Untitled

    Abstract: No abstract text available
    Text: M-Bond 43-B Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 43-B INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol  Silicon-Carbide Paper  M-Prep Conditioner A        M-Prep Neutralizer 5A GSP-1 Gauze Sponges


    Original
    PDF GT-14 27-Apr-2011

    Untitled

    Abstract: No abstract text available
    Text: M-Bond GA-61 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND GA-61 INSTALLATION: •          CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges


    Original
    PDF GA-61 GA-61 GT-14 27-Apr-2011

    27611

    Abstract: 27611 transistor A 27611 transistor A 27611 benzene M-BOND 600 monograph LD50 msds vishay M-BOND 600 safety data
    Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond Curing Agent 600/610 October 21, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM013L 919-365-3800 CHEMTREC 1-800-424-9300 U.S.


    Original
    PDF MGM013L 805-FRM011 27611 27611 transistor A 27611 transistor A 27611 benzene M-BOND 600 monograph LD50 msds vishay M-BOND 600 safety data

    M-BOND 600

    Abstract: LD50 CAS No. 28064-14-4 28064-14-4 ld50 c M-BOND 600 safety data 14034 flammable "Flammable Liquid"
    Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond 600 Adhesive October 21, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM011J 919-365-3800 CHEMTREC 1-800-424-9300 U.S. 703-527-3887 (Outside U.S.)


    Original
    PDF MGM011J 805-FRM011 M-BOND 600 LD50 CAS No. 28064-14-4 28064-14-4 ld50 c M-BOND 600 safety data 14034 flammable "Flammable Liquid"

    28064-14-4

    Abstract: M-BOND GA-61 CAS No. 28064-14-4 A 27611 MATERIAL SAFETY 29CFR1910 transistor A 27611 LD50 polyglycidyl M-Bond GA - 61 A
    Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond GA-61 Part A November 23, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM016I 919-365-3800 CHEMTREC 1-800-424-9300 (U.S.)


    Original
    PDF GA-61 MGM016I 805-FRM011 28064-14-4 M-BOND GA-61 CAS No. 28064-14-4 A 27611 MATERIAL SAFETY 29CFR1910 transistor A 27611 LD50 polyglycidyl M-Bond GA - 61 A

    L0508

    Abstract: l2920 W068
    Text: Microwave Capacitors GH/ GB Series ③ Working Voltage Code Features 5  aximum capacitance change of ±15% M from −55°C to +125°C • G old ter minations 100µ inches over barrier layer • Excellent bond strength MIL−STD−883, method 2011.5 • Available with and without borders


    Original
    PDF MIL-STD-883, 50WVDC N1500 N3300 N4700 100WVDC 30ppm/ 250ppm/ 1000ppm/ L0508 l2920 W068

    Untitled

    Abstract: No abstract text available
    Text: SDA-6000 SDA-6000 GaAs Distributed Amplifier GaAs DISTRIBUTED AMPLIFIER Die: 2.21 mm x 1.21 mm x 0.102 mm Product Description Features RFMD’s SDA-6000 is a directly coupled DC GaAs microwave monolithic integrated circuit (MMIC) distributed driver amplifier die designed to support a wide array of high frequency commercial, military, and space applications. They are ideal for wideband amplifier gain blocks, modulators,


    Original
    PDF SDA-6000 SDA-6000 SDA-6000SB DS100223

    C122D SCR thyristor

    Abstract: scr driver dc motor speed control dc motor speed control using scr driver universal MOTOR speed control using scr DC motor speed control circuit with SCR C122E scr scr driver ac motor speed control C122E scr general electric DC SCR Armature Voltage control thyristor SCR 406
    Text: SCR C122 8 A RMS Up to 600 Volts The C l22 is a m olded silicon plastic SCR which incorporates General Electric’s new POWERGLAS glassivation process. This process provides for an intimate void-free bond between the silicon chip and the glass coating significantly improving performance and reliability.


    OCR Scan
    PDF O-22QAB C122D SCR thyristor scr driver dc motor speed control dc motor speed control using scr driver universal MOTOR speed control using scr DC motor speed control circuit with SCR C122E scr scr driver ac motor speed control C122E scr general electric DC SCR Armature Voltage control thyristor SCR 406

    CMP-01

    Abstract: No abstract text available
    Text: SP - 2107 liHiiiiimui Bond Pad Buried Zener Nichrome Clear Field Area 1- HPNP HNPN 0 N+/P+Diode Esa Pinch Resistor i— i DBNPN | DBPNP (I ) MNPN @ MPNP [] SPNP ¡SNPN Capacitor Block m 1^lpF SP2107 COMPONENT COUNT SUMMARY DESCRIPTION COUNT Tiles:


    OCR Scan
    PDF SP2107 SPI204 CMP-01

    JAN 1N4500

    Abstract: 1N4500
    Text: COMPUTER DIODE JAN & JANTX 1N4500 500m A Switching Diode FEATU RES D ESCR IPTIO N • • • • • This device is a fast sw itching, high con­ ductance diode for military, space, high rel and other systems. M etallurgical Bond Qualified to MIL-S-19500/403


    OCR Scan
    PDF 500mA 1N4500 MIL-S-19500/403 DO-35 80Vdc 75Vpk 300mAdc JAN 1N4500 1N4500

    2N4430

    Abstract: AC5000 OAC3000 OAC5000
    Text: O PT E K TECHNOLOGY INC MñE D • LTTÔSÛÜ OOOmGS 23G ■ OTK fcHjOPTEK Product Bulletin OAC3000 V -X * “T *0 March 1990 3' Extra Fast Recovery Rectifier Die OAC3000/OAC5000 Series • Contact metallization for wire bond and surface mount package construction:


    OCR Scan
    PDF k71S5aG OAC3000 AC3000/O AC5000 OAC3000 OAC5000 2N4430

    Untitled

    Abstract: No abstract text available
    Text: F requency M Lcvel 1 3 ixers 2 5 kHz to 7 GHz SBL / SIMA/ SRA + 1 3 dBm LO, up to + 9 dBm RF FREQUENCY MHz MODEL NO. w LO/RF CONVERSION LOSS dB Mid-Bond TolaJ x Max. Max. IF TFM / TUF LO-RF ISOLATION, dB LO-IF ISOLATION, dB L M U l M U Typ. Min. Typ. Min. Typ. Min. Typ. Min. Typ. Min. Typ. Min.


    OCR Scan
    PDF ROK-186MH SRA-2010MH TFM-12MH TFM-42MH DC-500 DC-200 DC-250

    10N03

    Abstract: 06N03 VU050-12N03 04n03 14n03 VU050-16N03 VU050-08N03 IT5 rectifier 16N03 12n03
    Text: MbE D • 4 h ñ b 25 b 0 0 G 1 25 5 3 H I X Y I X Y S CORP 'T-Z.SiQ^ g m -< n TYYS k_J Data Sheet No. 911004A - November 1991 Three-Phase Diode Rectifier Bridge VU050 FEATURES:_ • Isolated Direct Copper Bond Base Plate


    OCR Scan
    PDF E72873M) 11004A VU050 VU050-04N03 VU050-06N03 VU050-08N03 VU050-10N03 VU050-12N03 VU050-14N03 VU050-16N03 10N03 06N03 04n03 14n03 VU050-16N03 IT5 rectifier 16N03 12n03

    JAN 1N4500

    Abstract: No abstract text available
    Text: COMPUTER DIODE 1N4500, JAN & JANTX 1N4500 500mA Switching Diode FEATURES DESCRIPTION • • • • T h is d evice ¡s a fast sw itching, high co n ­ d u cta n ce diode for m ilitary, space, high rel and other systems. Metallurgical Bond Qualified to MIL-S-19500/403


    OCR Scan
    PDF 500mA 1N4500, 1N4500 MIL-S-19500/403 DO-35 80Vdc 75Vpk 300mAdc 20mAdc 300mAde JAN 1N4500

    IRFC9130

    Abstract: IRFC9140
    Text: INTERN ATI ONAL RECTIFIER SbE D • 4flS54S2 QG1G101 fl ■ HEXFET Die N-Channel International l&R| Rectifier > Electrical Probe Specifications for P-Channel H E X F E T f & III Power M O S FE T Die Recommended Bond Wire S i n Hex Size 1 2 3 4 Part Number


    OCR Scan
    PDF 4flS54S2 QG1G101 IRFC9014 IRFC9110 IRFC9210 IRFC9024 IRFC9120 IRFG9220 IRFC9034 IRFC9130 IRFC9140

    VB013-08N02

    Abstract: VB013 06N02 VB013-06N02 VB013-12N02 D-6840 E72873M VB013-12A02 VB013-14N02 VB013-14A02
    Text: 4bE D I • 4böb2Eb ODOiab^ 3 H I X Y X Y S CORP DIXYS T i V o T Data Sheet No. 911011A N o v e m b e r 1991 Single-Phase Diode Rectifier Bridge VB013 • Avalanche Rated Parts Available • Isolated Direct Copper Bond Base Plate


    OCR Scan
    PDF E72873M) 11011A VB013 VB013-04N02 VB013-06N02 VB013-08N02 VB013-10N02 VB013-12N02 VB013-14N02 VB013-16N02 VB013 06N02 D-6840 E72873M VB013-12A02 VB013-14A02

    Untitled

    Abstract: No abstract text available
    Text: ¥/iïl H EW LETT* mLtLMP A C K A R D Reverse Surface Mount Flip Chip LEDs Technical Data HSMx-H630/H730 F e atu res Applications • R everse M ountable Surface Mount LED • B reakthrough R eliability through E lim ination o f Internal W ire Bond • -40°C to + 85*C Operating


    OCR Scan
    PDF HSMx-H630/H730 HSMx-H630/H730 5966-3245E 966-4930E