M-BOND 610
Abstract: M-BOND 610 FOR TRANSDUCERS 450f "Strain Gage" 5A transducers M-BOND M-prep neutralizer mylar tape GT-14 pressure pads GT-14
Text: M-Bond 610 For Transducers Vishay Micro-Measurements Strain Gage Adhesives for Transducer Applications OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION: M-Bond 610 • • • • • • • • • • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper
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PDF
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GT-14
005mm)
21-Aug-03
M-BOND 610
M-BOND 610 FOR TRANSDUCERS
450f
"Strain Gage"
5A transducers
M-BOND
M-prep neutralizer
mylar tape
GT-14 pressure pads
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mjg-2
Abstract: M-prep neutralizer instruction bulletin b-130 "Strain Gage" M-BOND 600 M-BOND 610 FOR TRANSDUCERS M-BOND m-bond 450 b mylar tape strain gage
Text: M-Bond 450 For Transducers Vishay Micro-Measurements Strain Gage Adhesives for Transducer Applications OTHER ACCESSORIES USED IN AN M-BOND 450 INSTALLATION: M-Bond 450 • • • • • • • • • • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper
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Original
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PDF
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GT-14
B-130,
B-152,
21-Aug-03
mjg-2
M-prep neutralizer
instruction bulletin b-130
"Strain Gage"
M-BOND 600
M-BOND 610 FOR TRANSDUCERS
M-BOND
m-bond 450 b
mylar tape
strain gage
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cure
Abstract: GT-14 pressure pads mylar tape F-205 M-BOND M-prep neutralizer GT-14 M-BOND 43-B FOR TRANSDUCERS M-BOND 610 mjg-2
Text: M-Bond 43-B For Transducers Vishay Micro-Measurements Strain Gage Adhesives for Transducer Applications OTHER ACCESSORIES USED IN AN M-BOND 43-B INSTALLATION: M-Bond 43-B • • • • • • • • • • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper
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Original
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PDF
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GT-14
21-Aug-03
cure
GT-14 pressure pads
mylar tape
F-205
M-BOND
M-prep neutralizer
M-BOND 43-B FOR TRANSDUCERS
M-BOND 610
mjg-2
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M-BOND 610 FOR TRANSDUCERS
Abstract: mylar tape 15-MONTHS M-BOND 600 viscosity GT-14 m-bond 450 b
Text: M-Bond 610 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION: • • • • • • • • • • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A
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Original
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PDF
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GT-14
B-130,
10-Jan-03
M-BOND 610 FOR TRANSDUCERS
mylar tape
15-MONTHS
M-BOND 600
viscosity
m-bond 450 b
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GT-14
Abstract: dupont mylar M-BOND 610
Text: M-Bond 610 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION: • • • • • • • • • • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A
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Original
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PDF
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GT-14
005mm]
08-Apr-05
dupont mylar
M-BOND 610
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Untitled
Abstract: No abstract text available
Text: M-Bond 610 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 610 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges
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Original
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PDF
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GT-14
005mm]
27-Apr-11
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instruction bulletin b-130
Abstract: M-BOND 610 FOR TRANSDUCERS M-BOND GA-61 mjg-2 TT-609 M-BOND GA-61 cure temperatures m-bond 450 b Instruction Bulletin B-130, tt606 GT-14
Text: Instruction Bulletin B-130 Vishay Micro-Measurements Strain Gage Installations with M-Bond 43-B, 600, and 610 Adhesive Systems INTRODUCTION SURFACE PREPARATION Vishay Micro-Measurements M-Bond 43-B, 600, and 610 adhesives are high-performance epoxy resins, formulated
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Original
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PDF
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B-130
11-Apr-07
instruction bulletin b-130
M-BOND 610 FOR TRANSDUCERS
M-BOND GA-61
mjg-2
TT-609
M-BOND GA-61 cure temperatures
m-bond 450 b
Instruction Bulletin B-130,
tt606
GT-14
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M-BOND 200
Abstract: instruction bulletin b-130 M-BOND 600 M-prep neutralizer mylar tape Instruction Bulletin B-130, "Strain Gage" GT-14 dupont mylar a Strain Gage adhesive paper
Text: M-Bond 600 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 600 INSTALLATION: • • • • • • • • • • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A
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Original
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PDF
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GT-14
B-130,
10-Jan-03
M-BOND 200
instruction bulletin b-130
M-BOND 600
M-prep neutralizer
mylar tape
Instruction Bulletin B-130,
"Strain Gage"
dupont mylar a
Strain Gage adhesive paper
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curing
Abstract: instruction bulletin b-130 cure GT-14 M-BOND 600
Text: M-Bond 600 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 600 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol • Silicon-Carbide Paper • M-Prep Conditioner A • • • • • • • M-Prep Neutralizer 5A
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Original
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PDF
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GT-14
08-Apr-05
curing
instruction bulletin b-130
cure
M-BOND 600
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Instruction Bulletin B-130,
Abstract: GT-14 dupont mylar rohs
Text: M-Bond 43-B Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 43-B INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol • Silicon-Carbide Paper • M-Prep Conditioner A • • • • • • • M-Prep Neutralizer 5A
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Original
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PDF
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GT-14
08-Apr-05
Instruction Bulletin B-130,
dupont mylar rohs
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Untitled
Abstract: No abstract text available
Text: M-Bond 600 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 600 INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges
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Original
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PDF
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GT-14
27-Apr-11
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instruction bulletin b-130
Abstract: mylar tape Instruction Bulletin B-130, mjg-2 GT-14 M-prep neutralizer M-BOND 610
Text: M-Bond 43-B Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 43-B INSTALLATION: • • • • • • • • • • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A
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Original
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PDF
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GT-14
B-130,
10-Jan-03
instruction bulletin b-130
mylar tape
Instruction Bulletin B-130,
mjg-2
M-prep neutralizer
M-BOND 610
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Untitled
Abstract: No abstract text available
Text: M-Bond 43-B Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND 43-B INSTALLATION: • CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges
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Original
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PDF
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GT-14
27-Apr-2011
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27611
Abstract: 27611 transistor A 27611 transistor A 27611 benzene M-BOND 600 monograph LD50 msds vishay M-BOND 600 safety data
Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond Curing Agent 600/610 October 21, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM013L 919-365-3800 CHEMTREC 1-800-424-9300 U.S.
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MGM013L
805-FRM011
27611
27611 transistor
A 27611
transistor A 27611
benzene
M-BOND 600
monograph
LD50
msds vishay
M-BOND 600 safety data
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vishay PCT-2M
Abstract: PCT-2M M-Prep Conditioner A MCA-2 M-Prep Conditioner A pct-2m installation tape
Text: BAK-200, CEA-200, GAK-2 Series Micro-Measurements Strain Gage Application Kits FEATURES • GAK-2 Series Kits include materials necessary to immediately start making strain gage installations for routine applications. BAK-200 kit contains essential materials for M-Bond 200
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Original
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BAK-200,
CEA-200,
BAK-200
CEA-200
GAK-2-200
GAK-2-AE-10
27-Apr-2011
vishay PCT-2M
PCT-2M
M-Prep Conditioner A
MCA-2 M-Prep Conditioner A
pct-2m installation tape
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Untitled
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 to 1 M • Oxidized silicon substrate for good power dissipation
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11-Mar-11
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bcr20
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 to 1 M • Oxidized silicon substrate for good power dissipation
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Original
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PDF
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2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
bcr20
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M-BOND 600
Abstract: LD50 CAS No. 28064-14-4 28064-14-4 ld50 c M-BOND 600 safety data 14034 flammable "Flammable Liquid"
Text: MATERIAL SAFETY DATA SHEET SECTION 1: CHEMICAL PRODUCT AND COMPANY IDENTIFICATION PRODUCT: M-Bond 600 Adhesive October 21, 2005 Vishay Micro-Measurements Post Office Box 27777 Raleigh, NC 27611 MSDS # MGM011J 919-365-3800 CHEMTREC 1-800-424-9300 U.S. 703-527-3887 (Outside U.S.)
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Original
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PDF
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MGM011J
805-FRM011
M-BOND 600
LD50
CAS No. 28064-14-4
28064-14-4
ld50 c
M-BOND 600 safety data
14034
flammable
"Flammable Liquid"
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ The Back Contact Resistor BCR series single-value
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Original
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MIL-STD-883.
08-Apr-05
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WBCR02750000F
Abstract: BCR50000FKAHWS
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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Original
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PDF
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18-Jul-08
WBCR02750000F
BCR50000FKAHWS
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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Original
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PDF
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18-Jul-08
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WBCR02750000F
Abstract: bcr resistor bcr efi ElectroFilm
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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Original
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PDF
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11-Mar-11
WBCR02750000F
bcr resistor
bcr efi
ElectroFilm
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CMP-01
Abstract: No abstract text available
Text: SP - 2107 liHiiiiimui Bond Pad Buried Zener Nichrome Clear Field Area 1- HPNP HNPN 0 N+/P+Diode Esa Pinch Resistor i— i DBNPN | DBPNP (I ) MNPN @ MPNP [] SPNP ¡SNPN Capacitor Block m 1^lpF SP2107 COMPONENT COUNT SUMMARY DESCRIPTION COUNT Tiles:
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OCR Scan
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PDF
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SP2107
SPI204
CMP-01
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EW34
Abstract: EW180 EWP34
Text: Grounding Kits A well designed system uses grounding kits to provide a bond between the elliptical waveguide and the tower/earth ground system. One grounding kit is recommended at tower top, tower bottom, at 200 ft 60 m intervals (where applicable), and at the entrance to the equipment shelter.
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OCR Scan
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PDF
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MIL-STD-188-124A.
elim36
EWP17
EWP34
EWP37,
EWP37S
EWP43
EWP52,
EWP52S
EWP63,
EW34
EW180
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