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    MARKING 52 TSOP 6 Search Results

    MARKING 52 TSOP 6 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MG8097/B Rochester Electronics LLC 8097 - Math Coprocessor - Dual marked (8506301ZA) Visit Rochester Electronics LLC Buy
    5490/BCA Rochester Electronics LLC 5490 - Decade Counter - Dual marked (M38510/01307BCA) Visit Rochester Electronics LLC Buy
    5405/BCA Rochester Electronics LLC 5405 - Gate - Dual marked (M38510/00108BCA) Visit Rochester Electronics LLC Buy
    54AC20/SDA-R Rochester Electronics LLC 54AC20/SDA-R - Dual marked (M38510R75003SDA) Visit Rochester Electronics LLC Buy
    UHD503R/883 Rochester Electronics LLC UHD503R/883 - Dual marked (5962-8855101CA) Visit Rochester Electronics LLC Buy

    MARKING 52 TSOP 6 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Schottky Diode 20V 5A

    Abstract: Bi-Directional P-Channel mosfet IR P-Channel mosfet SPC6801 SPC6801ST6RG P-Channel MOSFET code 1A
    Text: SPC6801 P-Channel Trench MOSFET with Schottky Diode DESCRIPTION The SPC6801combines the Trench MOSFET technology with a very low forward voltage drop Schottky barrier rectifier in an TSOP-6P package. The Trench MOSFET is the P-Channel enhancement mode power field effect


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    PDF SPC6801 SPC6801combines -30V/-2 105ise Schottky Diode 20V 5A Bi-Directional P-Channel mosfet IR P-Channel mosfet SPC6801 SPC6801ST6RG P-Channel MOSFET code 1A

    P-Channel MOSFET code 1A

    Abstract: P-channel Trench MOSFET Bi-Directional P-Channel mosfet SPC6801 SPC6801ST6RG 6P marking P-channel MOSFET VGS -25V
    Text: SPC6801 P-Channel Trench MOSFET with Schottky Diode DESCRIPTION The SPC6801combines the Trench MOSFET technology with a very low forward voltage drop Schottky barrier rectifier in an TSOP-6P package. The Trench MOSFET is the P-Channel enhancement mode power field effect


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    PDF SPC6801 SPC6801combines -30V/-2 105ise P-Channel MOSFET code 1A P-channel Trench MOSFET Bi-Directional P-Channel mosfet SPC6801 SPC6801ST6RG 6P marking P-channel MOSFET VGS -25V

    S24C MARK

    Abstract: tsop 3602 9020 8-pin SOP SIP 400B nec 1251 P100G thomson 462 t P5VP-340B3-2 J 80222 P28D-100-600A1-1
    Text: Packages Plastic DIP Dual In-line Package Units in mm 8-pin plastic DIP (300mil) 8 5 1 4 14-pin plastic DIP with TAB (300mil) 14 8 1 7 20.32 MAX. 7.62 10.16 MAX. 24.60 MAX. 7.62 4.31 MAX. 6.4 0.9 MIN. 6.4 5.08 MAX. 5.08 MAX. 4.31 MAX. 2.54 0.51 MIN. 2.54


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    PDF 300mil) 14-pin P8C-100-300B, P14CT-100-300B-1 X10679EJCV0SG00 S24C MARK tsop 3602 9020 8-pin SOP SIP 400B nec 1251 P100G thomson 462 t P5VP-340B3-2 J 80222 P28D-100-600A1-1

    tsop 66

    Abstract: MICRON 63 micron ddr TSOP RECEIVER general architecture of ddr sdram TSOP 66 Package MT46LC8M8TG-10 sdram pins detail
    Text: ADVANCE 64 MEG: x8 DDR SDRAM MT46LC8M8 - 2 Meg x 8 x 4 banks DOUBLE DATA RATE SDRAM For the latest data sheet revisions, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES • Internal, pipelined double data rate DDR architecture; two data accesses per clock cycle


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    PDF MT46LC8M8 tsop 66 MICRON 63 micron ddr TSOP RECEIVER general architecture of ddr sdram TSOP 66 Package MT46LC8M8TG-10 sdram pins detail

    63-Ball

    Abstract: fbe063-63-ball ei 306 20 64
    Text: ADVANCE INFORMATION Am29LV640M 64 Megabit 4 M x 16-Bit or 4 M x 16-Bit/8 M x 8-Bit MirrorBit 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Single power supply operation


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    PDF Am29LV640M 16-Bit 16-Bit/8 128-word/256-byte 8-word/16-byte 63-ball TS056 LAA064 fbe063-63-ball ei 306 20 64

    MR26T51203L

    Abstract: OKI date code MR26T51203L-XXXMB
    Text: PEDR26T51203L-02-03 OKI Semiconductor MR26T51203L 32M–Word x 16–Bit or 64M–Word × 8–Bit Issue Date: Jun. 17, 2003 Preliminary P2ROM FEATURES • 33,554,432-word × 16-bit/67,108,864-word × 8-bit electrically switchable configuration · 2.7 V to 3.6 V power supply


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    PDF PEDR26T51203L-02-03 MR26T51203L 432-word 16-bit/67 864-word MR26T51203L-xxxTM 50-pin 50-P-400-0 MR26T51203L-xxxMB 70-pin MR26T51203L OKI date code MR26T51203L-XXXMB

    30V 20A power p MOSFET

    Abstract: Transistor Mosfet N-Ch 30V SPC6602 SPC6602ST6RG
    Text: SPC6602 N & P Pair Enhancement Mode MOSFET DESCRIPTION The SPC6602 is the N- and P-Channel enhancement mode power field effect transistors are produced using high cell density , DMOS trench technology. This high density process is especially tailored to minimize on-state


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    PDF SPC6602 SPC6602 30V 20A power p MOSFET Transistor Mosfet N-Ch 30V SPC6602ST6RG

    IDT package marking

    Abstract: IDT marking IDT marking TQFP IDT TOP SIDE package marking A-0410-02 IDT CODE DATE marking MQUAD pbga 144 TQFP 132 PACKAGE PDIP-48
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0410-02 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: 10/5/2004 DATE: All IDT Products (see attached list)


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    SPC6602ST6RG

    Abstract: SPC6602 N and P MOSFET
    Text: SPC6602 N & P Pair Enhancement Mode MOSFET DESCRIPTION The SPC6602 is the N- and P-Channel enhancement mode power field effect transistors are produced using high cell density , DMOS trench technology. This high density process is especially tailored to minimize on-state


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    PDF SPC6602 SPC6602 SPC6602ST6RG N and P MOSFET

    SPC6604

    Abstract: SPC6604ST6RG N and P MOSFET
    Text: SPC6604 N & P Pair Enhancement Mode MOSFET DESCRIPTION The SPC6604 is the N- and P-Channel enhancement mode power field effect transistors are produced using high cell density , DMOS trench technology. This high density process is especially tailored to minimize on-state


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    PDF SPC6604 SPC6604 SPC6604ST6RG N and P MOSFET

    SPC6601

    Abstract: SPC6601ST6RG 6P marking TSOP 6 marking 52 N and P MOSFET
    Text: SPC6601 N & P Pair Enhancement Mode MOSFET DESCRIPTION The SPC6601 is the N- and P-Channel enhancement mode power field effect transistors are produced using high cell density , DMOS trench technology. This high density process is especially tailored to minimize on-state


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    PDF SPC6601 SPC6601 SPC6601ST6RG 6P marking TSOP 6 marking 52 N and P MOSFET

    TOP SIDE MARKING OF MICRON

    Abstract: ba0 marking
    Text: ADVANCE 64Mb: x4, x8, x16 DDR SDRAM MT46V16M4 - 4 Meg x 4 x 4 banks MT46V8M8 - 2 Meg x 8 x 4 banks MT46V4M16 - 1 Meg x 16 x 4 banks DOUBLE DATA RATE SDRAM For the latest data sheet, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html


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    PDF 64Mx4x8x16DDRSDRAM TOP SIDE MARKING OF MICRON ba0 marking

    Untitled

    Abstract: No abstract text available
    Text: UG416S6486KSE-PHPN Data sheets can be downloaded at www.unigen.com 128M Bytes 16M x 64 bits SYNCHRONOUS DRAM MODULE PC100 SDRAM Unbuffered SODIMM based on 4 pcs 16M x 16 SDRAM with LVTTL, 4 banks & 8K Refresh GENERAL DESCRIPTION PIN ASSIGNMENT (Front View)


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    PDF UG416S6486KSE-PHPN PC100 UG416S6486KSE-PHPN 16Mbits 144-Pin

    Untitled

    Abstract: No abstract text available
    Text: UG42S6428GSG-PL Data sheets can be downloaded at www.unigen.com 16M Bytes 2M x 64 bits SYNCHRONOUS DRAM MODULE PC100 SDRAM Unbuffered SODIMM based on 8 pcs 2M x 8 SDRAM with LVTTL, 2 banks & 2K Refresh GENERAL DESCRIPTION PIN ASSIGNMENT (Front View) 144-Pin SODIMM


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    PDF UG42S6428GSG-PL PC100 UG42S6428GSG-PL 144-Pin

    UG432S6488KSG

    Abstract: No abstract text available
    Text: UG432S6488KSG Data sheets can be downloaded at www.unigen.com 256M Bytes 32M x 64 bits SYNCHRONOUS DRAM MODULE PC100 SDRAM Unbuffered SODIMM based on 8 pcs 32M x 8 SDRAM with LVTTL, 4 banks & 8K Refresh GENERAL DESCRIPTION PIN ASSIGNMENT (Front View) 144-Pin SODIMM


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    PDF UG432S6488KSG PC100 UG432S6488KSG-PL/PH 32Mbits 144-Pin UG432S6488KSG

    RISC-Processor s3c2410

    Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
    Text: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH


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    PDF BR-04-ALL-005 BR-04-ALL-004 RISC-Processor s3c2410 MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B

    sdram spectek

    Abstract: No abstract text available
    Text: P32M648YAC, P64M6416YAC P32M648YBC, P64M6416YBC SDRAM MODULE 32M, 64M x 64 DIMM Features: • • • • • • • • • Intel PC-100/PC-133 Compatible JEDEC-standard 168-pin, dual in-line memory module DIMM TSOP components. Single 3.3v +.3v power supply.


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    PDF P32M648YAC, P64M6416YAC P32M648YBC, P64M6416YBC PC-100/PC-133 168-pin, 81us/row) 32Mx8 P32M648YAC-XX sdram spectek

    Untitled

    Abstract: No abstract text available
    Text: P32M648YL, P64M6416YL P32M648YLE, P64M6416YLE SDRAM MODULE 32M, 64M x 64 DIMM PIN ASSIGNMENT Front View 168-Pin DIMM Features: • • • • • • • • • Intel PC-100/PC-133 Compatible JEDEC-standard 168-pin, dual in-line memory module (DIMM) TSOP components.


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    PDF P32M648YL, P64M6416YL P32M648YLE, P64M6416YLE 168-Pin PC-100/PC-133 168-pin, 81us/row) 32Mx8

    Untitled

    Abstract: No abstract text available
    Text: UG432S6448KUG Data sheets can be downloaded at www.unigen.com 256M Bytes 32M x 64 bits SYNCHRONOUS DRAM MODULE PC100 SDRAM Unbuffered SODIMM based on 8 pcs 32M x 8 Stacked SDRAM with LVTTL, 4 banks & 4K Refresh GENERAL DESCRIPTION PIN ASSIGNMENT (Front View)


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    PDF UG432S6448KUG PC100 UG432S6448KUG-PL/PH 32Mbits 144-Pin InteQ55

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE M IC H D IM I M T28F800S2/M T28F008S 2 V 512K x 16, 1 MEG x 8 FLASH MEM ORY 8 MEG SVT-II , LOW POWER, SECTORED ERASE S martV oltage FEATURES PIN ASSIGNMENT (Top View) • • • • Sixteen 64K B/(32K -w ord) erase blocks Programmable sector protect


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    PDF T28F800S2/M T28F008S 120ns, 150ns 56-Pin MT28F600S2/MT2BF008S2V

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE MT28F161 1 MEG x 16, 2 MEG x 8 FLASH MEMORY 1 MEG x 16, 2 MEG x 8 5V/5V SECTORED ERASE FEATURES PIN ASSIGNMENT Top View • Thirty-two 64KB/(32K-word) erase blocks • Programmable sector lock • Deep Power-Down Mode: 5|lA MAX • 5V ±10% V cc and Vpp


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    PDF MT28F161 32K-word) 100ns, 150ns 56-Pin

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE MT28F800S2/MT28F008S2 V 512K x 16,1 MEG x 8 FLASH MEMORY FLASH MEMORY 8 MEG SVT-II , LOW POWER, SECTORED ERASE S m a r tV o lta g e FEATURES • • • • Sixteen 64KB/(32K-word) erase blocks Programmable sector protect Deep Power-Down Mode: 10(iA MAX


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    PDF MT28F800S2/MT28F008S2 32K-word) 120ns, 150ns 70ns/120ns 90ns/150ns 56-Pin

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE MT28F161 1 MEG x 16, 2 MEG x 8 FLASH MEMORY |V |IC = R O N 5V/5V SECTORED ERASE FEATURES • • • • • • • • • • PIN ASSIGNMENT Top View Thirty-two 64KB/(32K-word) erase blocks Programmable sector lock Deep Power-Down Mode: 5|iA MAX


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    PDF MT28F161 32K-word) 100ns, 150ns 56-Pin i------A19 -DQ15 CT995.

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE 64 MEG: x8 DDR SDRAM MICRON I TECHNOLOGY, INC. MT46LC8M8 - 2 Meg x 8 x 4 banks DOUBLE DATA RATE SDRAM For the latest data sheet revisions, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES • Internal, pipelined double data rate DDR architec­


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    PDF MT46LC8M8 66-PIN