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    MATERIAL COMPOSITION DECLARATION Search Results

    MATERIAL COMPOSITION DECLARATION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    XFL2006-823MEC Coilcraft Inc General Purpose Inductor, 82uH, 20%, 1 Element, Composite-Core, SMD, 0808, CHIP, 0808 Visit Coilcraft Inc
    XFL2006-333MEB Coilcraft Inc General Purpose Inductor, 33uH, 20%, 1 Element, Composite-Core, SMD, 0808, CHIP, 0808 Visit Coilcraft Inc
    XFL2006-103MEB Coilcraft Inc General Purpose Inductor, 10uH, 20%, 1 Element, Composite-Core, SMD, 0808, CHIP, 0808 Visit Coilcraft Inc
    XAL4040-103MEB Coilcraft Inc General Purpose Inductor, 10uH, 20%, 1 Element, Composite-Core, SMD, 1515, CHIP, 1515 Visit Coilcraft Inc
    XFL2006-562MEB Coilcraft Inc General Purpose Inductor, 5.6uH, 20%, 1 Element, Composite-Core, SMD, 0808, CHIP, 0808 Visit Coilcraft Inc

    MATERIAL COMPOSITION DECLARATION Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SVT Package Weight mg 45000 Product Group Type No. S30VT60 – S30VT160 S50VT60 – S50VT160 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating


    Original     		S30VT60 S30VT160 S50VT60 S50VT160 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARSL Package Weight mg 2000 Product Group Type No. ARS50AL – ARS50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation


    Original     		ARS50AL ARS50JL 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARL Package Weight mg 2200 Product Group Type No. AR50AL – AR50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation


    Original     		AR50AL AR50JL 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBP Package Weight mg 1700 Product Group Type No. GBP200 – GBP210 Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Solder Alloy Leadframe MSL Rating


    Original     		GBP200 GBP210 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MB-S Package Weight mg 120 Product Group Type No. B1S – B10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach


    Original     		2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBP Package Weight mg 1700 Product Group Type No. KBP150 – KBP1510 KBP200 – KBP2010 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin


    Original     		KBP150 KBP1510 KBP200 KBP2010 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package TB-S Package Weight mg 100 Product Group Type No. TB1S – TB10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach


    Original     		TB10S 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MBL-S Package Weight mg 100 Product Group Type No. LB1S – LB10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach


    Original     		LB10S 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package C35/C35M Package Weight mg 440 Product Group Type No. C3520, C3524, C3536 C35A – C35K G35160 Component Die Material Solder Alloy Slug Copper Alloy Plating Silver Passivation


    Original     		C35/C35M C3520, C3524, C3536 G35160 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBL Package Weight mg 5600 Product Group Type No. KBL400 – KBL410 KBL400G – KBL410G Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin


    Original     		KBL400 KBL410 KBL400G KBL410G 2011/65/EU. PDF

    C5024

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package C50 Package Weight mg 620 Product Group Type No. C5020, C5024, C5036 C50A – C50K C7020, C7024, C7036 Component Die Material Solder Alloy Slug Copper Alloy Plating Silver


    Original     		C5020, C5024, C5036 C7020, C7024, C7036 2011/65/EU. C5024 PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package AR Package Weight mg 1800 Product Group Type No. AR25A – AR25J AR35A – AR35J AR50A – AR50J Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance Material


    Original     		AR25A AR25J AR35A AR35J AR50A AR50J 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package TO-247AC Package Weight mg 5600 Product Group Type No. RURG1520 – RURG1560 RURG3020 – RURG3060 Component Material Die Doped Silicon* Die Attach Solder Alloy Wire Bond


    Original     		O-247AC RURG1520 RURG1560 RURG3020 RURG3060 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package C25 Package Weight mg 370 Product Group Type No. C25A – C25K Component Die Material Solder Alloy Slug Copper Alloy Plating Silver Passivation Silastic Tolerance MSL Rating


    Original     		2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MP-10 Package Weight mg 3800 Product Group Type No. MP1000 – MP1010 MP1000G – MP1010G Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin


    Original     		MP-10 MP1000 MP1010 MP1000G MP1010G 2011/65/EU. PDF

    GBJ25Q

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBJ-6 Package Weight mg 7000 Product Group Type No. GBJ6A – GBJ6M GBJ8A – GBJ8M GBJ15A – GBJ15Q GBJ25A – GBJ25Q GBJ35A – GBJ35Q Component Material Doped Silicon*


    Original     		GBJ15A GBJ15Q GBJ25A GBJ25Q GBJ35A GBJ35Q 2011/65/EU. GBJ25Q PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBJ-4 Package Weight mg 4600 Product Group Type No. GBJ4A – GBJ4M GBJ10A – GBJ10M Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin


    Original     		GBJ10A GBJ10M 2011/65/EU. PDF

    MP1500G

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MP-15 Package Weight mg 5400 Product Group Type No. MP1500 – MP1510 MP1500G – MP1510G Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin


    Original     		MP-15 MP1500 MP1510 MP1500G MP1510G 2011/65/EU. MP1500G PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MT Package Weight mg 21000 Product Group Type No. MT2500 – MT2516 MT3500 – MT3516 Material Die Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Nickel Jumper


    Original     		MT2500 MT2516 MT3500 MT3516 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBL Package Weight mg 2000 Product Group Type No. GBJ2A – GBJ2M GBL00 – GBL10 Material Die Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin Encapsulation


    Original     		GBL00 GBL10 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package R-1 Package Weight mg 181 Product Group Type No. 1H1 – 1H8 1A1 – 1A7 Material Die Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin Encapsulation


    Original     		2011/65/EU. PDF

    Material Composition Declaration

    Abstract: No abstract text available
    Text: RoHS Material Composition Declaration Manufacturer Information Company: Authorised Representative Anton Walles Name: Senior Logistics Engineer Title: +27 21 863 0033 Phone: anton.walles@azoteq.com Email: www.azoteq.com Web: Azoteq Pty Ltd 109 Main Road Paarl


    Original     		IQS259 QFN16 Material Composition Declaration PDF

    Untitled

    Abstract: No abstract text available
    Text: RoHS Material Composition Declaration Manufacturer Information Company: Authorised Representative Anton Walles Name: Senior Logistics Engineer Title: +27 21 863 0033 Phone: anton.walles@azoteq.com Email: www.azoteq.com Web: Azoteq Pty Ltd 109 Main Road Paarl


    Original     		IQS156 MSOP/10LD PDF

    Untitled

    Abstract: No abstract text available
    Text: RoHS Material Composition Declaration Manufacturer Information Company: Authorised Representative Anton Walles Name: Senior Logistics Engineer Title: +27 21 863 0033 Phone: anton.walles@azoteq.com Email: www.azoteq.com Web: Azoteq Pty Ltd 109 Main Road Paarl


    Original     		IQS128 TSOT23/6LD PDF