Conduit Material Properties
Abstract: ASTM-A-753
Text: Series 75 Metal-Core Conduit Series 75 Flexible Metal-Core EMI/RFI Conduit Conduit Material Properties Conduit Material Choices, Material Properties, and Military Specifications Glenair Code Material Properties Applicable Military Specifications IAW A-A-52440 Covering shielded, electrical, flexible, metal
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Material Properties
Abstract: EPDM fungus resistance fungus Ethylene Propylene fungus resistance hypalon 40 hypalon psi20 TEFZEL ETFE
Text: Convoluted Tubing Introduction to Conduit Interconnect Technologies and Packaging Material Properties Convoluted Tubing Material Properties A MATERIAL PROPERTY PERFLUORO- FLUORINATED ETH- ETHYLENE TETRA- POLYTETRAFLU- POLYVINYLIDENE ALKOXY YLENE PROPYLENE FLUOROETHYLENE OROETHYLENE
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F/500
C/260
F/400
C/204
F/310
C/154
F/330
C/166
F/392
Material Properties
EPDM fungus resistance
fungus
Ethylene Propylene fungus resistance
hypalon 40
hypalon
psi20
TEFZEL ETFE
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MF202
Abstract: Si3N4 AuSn eutectic eftec 45 SC-101 silicon carbide MgO Al2O3 Thermal conductivity coefficient properties fe -80 ni
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PROPERTIES OF PACKAGE MATERIALS 7. PROPERTIES OF PACKAGE MATERIALS Principal package material characteristics are shown in the following tables. Table 1 Case Material Characteristics Material Almina Alminum nitride Type Name
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SC-101
42Alloy
MF202
Si3N4
AuSn eutectic
eftec 45
SC-101
silicon carbide
MgO Al2O3 Thermal conductivity coefficient
properties fe -80 ni
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07474
Abstract: No abstract text available
Text: Pen Pocket Opening ESD Protective Symbol Imprinted SPECIFICATIONS: 1" Material Properties: Card Pocket Opening 5-13/16" • • • • • • • Dissipative Polyvinylchloride PVC Material Thickness: 0.012" (1S) front & back Material Tolerance (thickness): +/-10%
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STM11
07474
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sub for 1969
Abstract: No abstract text available
Text: IDC Systems D-Subminiature BACKSHELL KIT, FINE PITCH D SUB LR49571 E60980 PHYSICAL PROPERTIES STRAIN RELIEF STRAP: Material-Steel, Finish-Bright tin over nickel #2-56 UNC PAN HEAD SCREW: Material-Steel, Finish-Nickel #2-56 UNC COUNTERSINK SCREW: Material -Steel, Finish-Nickel
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LR49571
E60980
311-XXX
300102-026AS3
300102-040AS4
sub for 1969
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Untitled
Abstract: No abstract text available
Text: IDC Systems D-Subminiature BACKSHELL KIT, FINE PITCH D SUB LR49571 E60980 PHYSICAL PROPERTIES STRAIN RELIEF STRAP: Material-Steel, Finish-Bright tin over nickel #2-56 UNC PAN HEAD SCREW: Material-Steel, Finish-Nickel #2-56 UNC COUNTERSINK SCREW: Material -Steel, Finish-Nickel
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LR49571
E60980
311-XXX
311-XXX-SM29C
300102-026BS3
300102-068BS6
300102-100BS8
300102-026CS3
300102-068CS6
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USB-A1011-M050
Abstract: USB-A1411-M020
Text: Computer I/O USB USB SERIES A TO STUB AND A TO B CABLE ASSEMBLIES PLUG PHYSICAL PROPERTIES INSULATION MATERIAL: Glass filled thermoplastic, rated UL 94V-0 INSULATION COLOR: Natural OVERMOLD MATERIAL: PVC OVERMOLD COLOR: Frost White CONTACT MATERIAL: Copper alloy, See Ordering
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LR49571
E60980
USB-A1011-M050
USB-A1411-M020
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Untitled
Abstract: No abstract text available
Text: iron powder core,metallic powder core,toroidal core,e cores,bus bar cores,u cores,i cores Page 1 print version Material Properties 1.MATERIAL PROPERTIES OF THE IRON POWDER CORE Characteristics \ 35 55 75 Material Permeability µ 35 55 75 Temp.Coef.of 250 360
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YT30-YT38
YT44-YT72
YT80-YT141
YT150-YT225
YT249-YT300
10KHz
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
MIL-M-38510
MIL-STD-883
LGA 1156 PIN OUT diagram
QSJ-44403
LGA 1150 Socket PIN diagram
LGA 1155 Socket PIN diagram
IC107-26035-20-G
LGA 1151 PIN diagram
REFLOW lga socket 1155
IC107-3204-G
TB 2929 H alternative
LGA 1155 pin diagram
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Untitled
Abstract: No abstract text available
Text: REFERENCE Use this reference section as a guide to the properties of product materials, the industry recognized standards, and a full part number index. Reference Contents Master Material Index . 164 Laser Material Index . 169
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Abstract: No abstract text available
Text: Flexible Interconnections Flexpac FLEXPAC® LOCKING HEADER, SINGLE ROW STRAIGHT CONTACTS 2MM .079" CENTER SPACING LR49571 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass reinforced thermoplastic rated 94V-0 COLOR: Black CONTACT MATERIAL: Copper alloy
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LR49571
E60980
F2H-04SSG
F2H-04SST
26SSG
F2H-26SST
F2H-27SSG
F2H-27SST
F2H-28SSG
F2H-28SST
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Untitled
Abstract: No abstract text available
Text: Flexible Interconnections Flexpac FLEXPAC® CABLE .100" CENTER SPACING LR49571 E60980 PHYSICAL PROPERTIES CONDUCTOR MATERIAL: Copper CONDUCTOR SIZE: AWG 26 INSULATION MATERIAL: Polyester ELECTRICAL PROPERTIES VOLTAGE RATING: 300 VAC CURRENT RATING: 3 Amps
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LR49571
E60980
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Untitled
Abstract: No abstract text available
Text: Flexible Interconnections Flexpac FLEXPAC® LOCKING HEADER, SINGLE ROW RIGHT ANGLE CONTACTS 2MM .079" CENTER SPACING LR49571 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass reinforced thermoplastic rated 94V-0 COLOR: Black CONTACT MATERIAL: Copper alloy
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LR49571
E60980
F2H-04SRG
F2H-04SRT
26SRG
F2H-26SRT
F2H-27SRG
F2H-27SRT
F2H-28SRG
F2H-28SRT
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UL-510
Abstract: UL510 VHB4926 Flux Density UL polymide film UL746C COERCIVE nickel zinc
Text: API Materials Properties and Characteristics Loss Factor tan/µι API Material 1 Material Initial Permeability Saturation Flux Density (BS) Residual Flux Density (BR) Coercive Force (HC) Curie Temperature (TC) Volume Resistivity (p) Recommended Frequency Range
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10x10
60x10
UL94V-0,
UL-510
UL-746C
2000e
VHB4926
UL510
Flux Density
UL polymide film
UL746C
COERCIVE
nickel zinc
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Untitled
Abstract: No abstract text available
Text: API Materials Properties and Characteristics Loss Factor tan/µι API Material 1 Material Initial Permeability Saturation Flux Density (BS) Residual Flux Density (BR) Coercive Force (HC) Curie Temperature (TC) Volume Resistivity (p) Recommended Frequency Range
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10x10â
60x10â
UL94V-0,
UL-510
UL-746C
VHB4926
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Untitled
Abstract: No abstract text available
Text: Flexible Interconnections Flexpac FLEXPAC® LOCKING HEADER DOUBLE ROW STRAIGHT CONTACTS 2MM .079" x 2MM (.079") CENTER SPACING LR49571 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass reinforced thermoplastic rated 94V-0 COLOR: Black CONTACT MATERIAL: Copper alloy
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LR49571
E60980
F2H-08DSG
F2H-08DST
F2H-56DSG
F2H-56DST
F2H-58DSG
F2H-58DST
F2H-60DSG
F2H-60DST
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Untitled
Abstract: No abstract text available
Text: Flexible Interconnections Flexpac FLEXPAC® LOCKING HEADER, SINGLE ROW STRAIGHT CONTACTS .100" CENTER SPACING LR49571 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Thermoplastic rated 94V-0 COLOR: Blue CONTACT MATERIAL: Phosphor Bronze CONTACT PLATING: Contact Area, .000030" Gold
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LR49571
E60980
E47817
FPH-042PH-2621G
FPH-2621T
FPH-2721G
FPH-2721T
FPH-2821G
FPH-2821T
FPH-2921G
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Untitled
Abstract: No abstract text available
Text: IDC Systems Headers SINGLE ROW PIN STRIP HEADERS RIGHT ANGLE .100" CENTERS LR49571 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass reinforced thermoplastic, rated 94V-0 COLOR: Black OXYGEN INDEX: 32 CONTACT MATERIAL: Copper alloy, gold or tin/lead
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LR49571
E60980
PS-40SR-TBA
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Untitled
Abstract: No abstract text available
Text: IDC Systems Headers SINGLE ROW PIN STRIP HEADERS RIGHT ANGLE .100" CENTERS LR49571 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass reinforced thermoplastic, rated 94V-0 COLOR: Black OXYGEN INDEX: 32 CONTACT MATERIAL: Copper alloy, gold or tin/lead
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LR49571
E60980
PS-40SR-TBA
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Untitled
Abstract: No abstract text available
Text: Technical Information Housing Material Nylon 66 All series except 122, 123 to 124 This material exhibits versatile electrical and mechanical properties making it well suited for a wide range of environments. Polycarbonate Series 122 to 124 This material offers UL94 V -0 flame retardancy material test thickness 1.6 mm and
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Untitled
Abstract: No abstract text available
Text: EPCOS SIFERRIT Materials Material properties Preferred application Material Base material Color code adjuster Symbol Initial permeability (7 = 2 5 °C) Meas. field strength Flux density (near saturation) (7=10 kHz) Coercive field strength ( f = 10 kHz) Optimum
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MT 2800 N
Abstract: Siemens Ferrite n72 ferrite Ring Core matsua etd 49 core
Text: SIFERRIT Materials Material properties Resonant circuit inductors Preferred application Material uT7T r ' K I2 1' K1 M il <10 Base material NiZn NiZn NiZn NiZn NiZn MnZn grey yellow violet brown — white 250 ±20% 600 750 Symbol j Unit Color code Initial permeability
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100-C)
MT 2800 N
Siemens Ferrite n72
ferrite Ring Core matsua
etd 49 core
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AWM ft1 300V
Abstract: AWM 2651 28 awg 2651 300V
Text: Cable Cable Properties — Internal Wiring Cable Properties Primary Insulation Material Primary Color First Conductor Marking Conductor Spacing inch mm Conductor Size Conductor Stranding Conductor Material Conductor Resistance @ 20C Ohms/lOOO f t [Ohms/km]
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Ohms/10
AWM ft1 300V
AWM 2651 28 awg
2651 300V
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UL746C
Abstract: No abstract text available
Text: API Materials Properties and Characteristics API Material 1 Loss Factor tan/pi Material Initial Permeability Saturation Flux Density (BS) Residual Flux Density (BR) Coercive Force (HC) Curie Temperature (TC) Volume Resistivity (p) Recommended Frequency Range
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10x10-6
60x10-6
UL94V-0,
UL-510
UL-746C
650pi
10x10-6
60x10-6
VHB4926
UL746C
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