Practical Construction Tips For Coils Using Iron Powder Cores
Abstract: Application Notes furukawa TEX-E raychem silicone grease EPOXYLITE "adhesive study reference" 9398-083-20011 micrometals EPOXYLITE 213 FURUKAWA MAGNET WIRE catalog
Text: HOME APPLICATION NOTES Practical Construction Tips For Coils Using Iron Powder Cores Presented by Dale Nicol Micrometals, Inc. APEC ‘96 San Jose, California March 5th, 1996 Revised April 2, 2001 The purpose of the following discussion is to convey practical application information for coil
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Abstract: No abstract text available
Text: Surface mount capacitors 1.1 - Production process flowchart Ceramic powder preparation 1.1 to 1.3 1.2 - Syfer reliability grades Electrode ink material Space grade ESCC 3009 1 (wet process) Fire Standard components Rumble High reliability (space quality)
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OMRON G2A-434A-N1 relay
Abstract: G2A-434A-D PY14 G2A-434 PYF14A PYF14T OMRON g2a 434A PYF14A-TU
Text: Power Relay G2A-434 CSM_G2A-434_DS_E_4_1 Fully Sealed Version of G2A that Displays Its Power in Adverse Environments • Exhibits stable performance in an adverse atmosphere of harmful gas, moisture, or powdery dust due to its hermetically sealed construction.
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G2A-434
G2A-434
G2A-434A
G2A-4341P
G2A-434A-VS
OMRON G2A-434A-N1 relay
G2A-434A-D
PY14
PYF14A
PYF14T
OMRON g2a
434A
PYF14A-TU
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OMRON G2A-434A-N1 relay
Abstract: OMRON g2a
Text: Power Relay G2A-434 CSM_G2A-434_DS_E_3_1 Fully Sealed Version of G2A that Displays Its Power in Adverse Environments • Exhibits stable performance in an adverse atmosphere of harmful gas, moisture, or powdery dust due to its hermetically sealed construction.
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G2A-434
G2A-434
G2A-434A
G2A-434A-US
G2A-4341P
G2A-4341P-US
OMRON G2A-434A-N1 relay
OMRON g2a
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PY14
Abstract: PYF14A PYF14T
Text: Power Relay G2A-434 Fully Sealed Version of G2A that Displays Its Power in Adverse Environments • Exhibits stable performance in an adverse atmosphere of harmful gas, moisture, or powdery dust due to its hermetically sealed construction. • All the mechanical components of the Relay have been
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G2A-434
G2A-434A
G2A-4341P
G2A-434A-US
G2A-4341P-US
PY14
PYF14A
PYF14T
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SMSP10S
Abstract: SMSP10SL 32082 RG10 650-015-00-7 solder powder
Text: PAGE: SAFETY DATA SHEET 1 of 3 PRINT DATE: REF: 06/08/1997 SMSP 1. IDENTIFICATION OF THE SUBSTANCE/PREPARATION AND THE COMPANY/UNDERTAKING Product name: SURFACE MOUNT SOLDER PASTE Product code: SMSP Supplier: ELECTROLUBE H.K. Wentworth Ltd., Wentworth House, Blakes Road,
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SMSP10SL
SMSP10S
SMSP10SL
32082
RG10
650-015-00-7
solder powder
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kester Sn62Pb36Ag02
Abstract: Sn63pB37 temp profile
Text: R500 Dispensable Water-soluble Solder Paste for Leaded Alloys Product Description Physical Properties Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting
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Sn63Pb37
10rpm
21Sep09
kester Sn62Pb36Ag02
Sn63pB37 temp profile
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Kester 197
Abstract: No abstract text available
Text: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder
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Sn63Pb37,
10Sep04
Kester 197
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Untitled
Abstract: No abstract text available
Text: Easy Profile 256 No-Clean Solderpaste Product Description Physical Properties Data given for Sn63Pb37 90% metal, -325+500 mesh Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil
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Sn63Pb37
EP256
21Sep09
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1501a
Abstract: MATERIAL SAFETY Solder powder RMA-15-01A Rosin Flux Type RMA 150-1A
Text: RMA-15-01A Тип : Паяльная паста Название: 63/37 RMA-15-01A Наименование компании: KU PING ENTERPRISE CO.,LTD. Адрес: No. 5, Lane 302, Hsin Shuh Rd., Hsin Chuang City, Taipei Taiwan Телефон / Факс: TEL: 02 8201-3987~9 FAX: (02)8201-2368,8201-2388
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RMA-15-01A
40oC/90%
85oC/85%
200oC
183oC
1501a
MATERIAL SAFETY Solder powder
RMA-15-01A
Rosin Flux Type RMA
150-1A
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Sn63Pb37
Abstract: No abstract text available
Text: R276 Dispensable No-Clean Solderpaste for Leaded Alloys Product Description Physical Properties Data given for Sn63Pb37 87% metal, -325+500 mesh Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged
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Sn63Pb37
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Multicore Solders
Abstract: No abstract text available
Text: TEMPORARY SOLDER RESISTS SPOT-ON, COPPER SPOT-ON & AQUA SPOT-ON Multicore Temporary Solder Resists are designed to be used on printed circuit boards prior to soldering and will withstand fluxing and wave soldering operations. l Peelable and water soluble versions available
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mechanics blue msds
Abstract: amp quality crimping handbook soil "electrical conductivity" underground power cable book GUIDE INSTALLATION rbs 2111 UL486A BURNDY split bolt UL467 Aluminum alloys physical properties ASTM nut and bolt
Text: $22.00 BURNDY PRODUCTS www.fciconnect.com CALL 1-800-346-4175 FOR YOUR LOCAL SALES REPRESENTATIVE Connector Theory and Application Experience. Technology. Answers. Customer Service Dept. 7 Aviation Park Drive Londonderry, NH 03053 1-800-346-4175 Quebec & Eastern Ontario
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Abstract: No abstract text available
Text: M U LT I P R I N T A N D FA S T P R I N T S O L D E R C R E A M S MULTIPRINT SOLDER CREAMS • PRODUCES CLEAR RESIDUES - ELIMINATES THE NEED FOR CLEANING • IPC TYPE ‘L’ AND HIGH ACTIVITY VERSIONS • EXCELLENT TACK PERFORMANCE AND PRINTER OPEN TIME • SUITABLE FOR FINE PITCH HIGH SPEED STENCIL PRINTING APPLICATIONS
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SN62NC62AGS89
SN62NC72AGS89
500gm
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MATERIAL SAFETY Solder powder
Abstract: PURGEL-01 MULTICORE SOLDER
Text: DISPENSING EQUIPMENT CLEANSING GEL PURGEL-01 Purgel-01 has been designed to be used as part of regular maintenance programme for solder paste dispensing equipment. Regular use will reduce the incidence of blockage by preventing paste from drying out in the equipment.
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PURGEL-01
Purgel-01
MATERIAL SAFETY Solder powder
MULTICORE SOLDER
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MULTICORE
Abstract: No abstract text available
Text: DISPENSING EQUIPMENT CLEANSING GEL PURGEL-01 Purgel-01 has been designed to be used as part of regular maintenance programme for solder paste dispensing equipment. Regular use will reduce the incidence of blockage by preventing paste from drying out in the equipment.
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PURGEL-01
Purgel-01
MULTICORE
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crane Proximity Sensor
Abstract: SS49E RDS8004 389 honeywell potentiometer hirschmann gdm military relay SS39ET sl353 922AA2YA6P0Z722A gdm hirschmann 14 A
Text: Position Sensors SENSING AND CONTROL Product Range Guide 1 For innovation that’s well apart, there’s only Honeywell Sensing and Control. With more than 50,000 products ranging from snap-action, limit, toggle, and pressure switches to position, speed, pressure, and airflow sensors, Honeywell Sensing and Control
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000709-10-EN
crane Proximity Sensor
SS49E
RDS8004
389 honeywell potentiometer
hirschmann gdm
military relay
SS39ET
sl353
922AA2YA6P0Z722A
gdm hirschmann 14 A
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JIS-Z-3197
Abstract: sf818 SF-818 BS5625 FLUXES 402-01, 425-01 450-01 sf 818 transistor DTD599A TR-NWT-000078 425-01 sf 818
Text: www.multicore.com MULTIFIX REWORK FLUXES TM 402-01, 425-01 AND 450-01 Multifix 402-01, 425-01 and 450-01 are tacky fluxes designed for use in a wide range of electronics assembly and rework processes. They represent a range of activities and residue levels to meet
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SN62RM92AAS88
Abstract: No abstract text available
Text: RMA NO–CLEAN SOLDER CREAMS RMA NO – CLEAN STENCILLING AND SCREEN PRINTING CREAMS RM 92 solder creams have been formulated as no clean RMA type products showing superior resistance to preheat slump during reflow processes. • SCREEN PRINTING & STENCILLING GRADES
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SN62RM92AAS90
SN62RM92AAS88
500gm
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SN62RM10AAS87/25
Abstract: No abstract text available
Text: RMA NO–CLEAN SOLDER CREAMS RMA NO – CLEAN STENCILLING AND SCREEN PRINTING CREAMS RM 92 solder creams have been formulated as no clean RMA type products showing superior resistance to preheat slump during reflow processes. • SCREEN PRINTING & STENCILLING GRADES
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SN62RM92AAS90
SN62RM92AAS88
500gm
SN62RM10AAS87/25
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HIOKI3227
Abstract: No abstract text available
Text: A E 14 0W 1 00019 Ver.2.00 S P E C IF IC A T IO N WOUND CHIP POWER INDUCTOR BRC2012TYPE TAIYO YUDEN AE140W100019V200 Specifications BRC2012TYPE 1. 2. Range of application This specification sheet applies to wound chip power inductor, BRC2012. Ordering code
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BRC2012TYPE
AE140W100019V200
BRC2012TYPE
BRC2012.
16034E
HIOKI3227
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Untitled
Abstract: No abstract text available
Text: A E 1 4 0 Y 1 00033 Ver. 1.02 SPECIFICATION SMP INDUCTORS COMPACT TYPE BRL2515TYPE TAIYO YUDEN AE140Y100033V102 Specifications BRL2515 TYPE (1/11) 1. Range of application This specification sheet applies to SMD inductor (compact type), BRL2515. 2. Ordering code
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BRL2515TYPE
AE140Y100033V102
BRL2515
BRL2515.
16034EA
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MARKING CODE smd R05
Abstract: No abstract text available
Text: A E 14 0Y 1 00034 Ver.1.01 SPECIFICATION SMD INDUCTORS COMPACT TYPE BRFL2518TYPE TAIYO YUDEN AE140 Y 100034V101 Specifications BRFL2518 TYPE (1/11) 1. Range of application This specification sheet applies to SMD inductor(compact type), BRFL2518. 2. Ordering code
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BRFL2518TYPE
AE140
100034V101
BRFL2518
BRFL2518.
16034EA
4291Aal
MARKING CODE smd R05
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BRL1608T2R2M
Abstract: BRL1608T
Text: AE140V100015 Ver. 1.00 S P E C IF IC A T IO N W O U N D CHIP PO W ER IND U C TO R S BR L1608TYPE TAIYO YUDEN AE140V100015V100 Specifications BRL1608 TYPE 1. 2. 1/11 Range of application This specification sheet applies to wound chip power inductor, BRL1608.
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AE140V100015
L1608TYPE
AE140V100015V100
BRL1608
BRL1608.
16034EA
429cial
BRL1608T2R2M
BRL1608T
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