AUS308
Abstract: AUS308 thermal kester 256 AUS303 AUS-308 aus5 kester 245 solder wire Lead Free reflow soldering profile BGA
Text: Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components WP-CHMFGRELLDFR-2.0 White Paper The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that
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Abstract: No abstract text available
Text: 7 Series FPGAs SelectIO Resources User Guide UG471 v1.3 October 31, 2012 The information disclosed to you hereunder (the "Materials") is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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FBG676
Abstract: FFG1156
Text: 7 Series FPGAs Packaging and Pinout Product Specification UG475 v1.9 February 14, 2013 The information disclosed to you hereunder (the "Materials") is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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UG475
FBG676
FFG1156
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chotherm
Abstract: ASTM d792 ASTM D412 D149 D2240 D257 D374 D412 D624 D792
Text: INSULATORS • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs
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WW-XXYYYY-1671.
381mm)
October1999
chotherm
ASTM d792
ASTM D412
D149
D2240
D257
D374
D412
D624
D792
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Untitled
Abstract: No abstract text available
Text: Chip Quik Solder Spheres for BGAs - Product Sheet Page 1 of 2 Product Description View Cart Product Name: Chip Quik Solder Spheres for BGAs Product Details CHIP QUIK Solder Spheres for BGAs • CHIP QUIK® BGA solder spheres are manufactured from virgin materials to meet or exceed the
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SMD2165
SMD2190
SMD2200
SMD2205
SMD2215
SAC305
SMD2040
SMD2050
SMD2055
SMD2060
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T443
Abstract: Chomerics T710 D257 D374 D792 T310 T725 chomerics 77 PARKER HANNIFIN parker
Text: TECHNICAL BULLETIN • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs
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Abstract: No abstract text available
Text: Thermal Solutions for BGAS Home | Contact Us | About Aavid -Useful Links- For use with TO-220 packages Printer friendly version Search by part # Check distributor part inventory Browse Products Part Number - 7025B-MTG Mechanical Outline Drawing -By Device-By Product Line-Attachment Methods-Interface Materials-Accessories-
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O-220
7025B-MTG
7025b-moldering
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KJR9022E
Abstract: KJR4013E GTO thyristor driver KJR651 KJR9061E silicone low volatile potting G1821 KJR-9010E KJR651E KJR9060E
Text: Shin-Etsu Liquid Coating Materials for Electronic Devices KJR Series Junction Coating Resins Liquid Type Silicone & Polyimide Silicone for Electronic, Electric and Optical Devices Main Features ●Ultra High Purity ●High Thermal Stability ●High Electrical Stability
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TCR500
Abstract: SiCr wire bond 60k4
Text: PMC Passive Micro Components OVERVIEW PMC thin-film technology offers comprehensive materials and processes combinations allowing electronic designers superior space saving, tolerance and signal integrity for semi custom designs in the MHz to GHz spectrum.
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S-PMC00M107-N
TCR500
SiCr
wire bond
60k4
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Untitled
Abstract: No abstract text available
Text: SEMICONDUCTOR MATERIALS TSF-6522 No-Clean Tacky Soldering Flux Product Description Kester TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. Kester TSF-6522 can also be used in dot dispensing for BGA/PGA
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TSF-6522
TSF-6522
10rpm
13Jun07
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JEDEC J-STD-033A
Abstract: AMD Package moisture LBA399 F-1249 J-STD-033A J-STD-020B J-STD-033 ASTM 1249 MIL-PRF-81705D MIL-I-18835
Text: u Chapter 12 Dry Packing CHAPTER 12 DRY PACKING Introduction Testing for Moisture Sensitivity Dry Packing Process and Materials Handling Dry Packed Products Storing Dry Packed Products AMD’s Moisture Sensitive Products by Package Type Packages and Packing Publication
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intel mch 945gc
Abstract: bga dye pry UL1439 945gc PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet
Text: Intel Atom Processor 300Δ Series Thermal and Mechanical Design Guidelines — Supporting Nettop Platform for ‘08 September 2008 Document Number: 320530-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITH NO WARRANTIES, EXPRESS OR
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E20724-001
E40825-001
945GC
E37585-001
intel mch 945gc
bga dye pry
UL1439
PCM45F
atx specification v2.2
BGA heatsink compressive force
437-pin
foxconn motherboard
945gc datasheet
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antimony trioxide epoxy molding
Abstract: material declaration semiconductor package Material declaration organic materials oxygen material declaration amd 104 c1k
Text: Chapter 4 Package Materials Material Declaration Data Sheets. AMD has created material data sheets for some of its more popular package designs. These data sheets are organized as follows: • Suface-Mount Array Packages PBGA, page 6-19 • Surface-Mount Leaded Packages
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N5P22
Abstract: Hifn Security Platform HIFN 7854-PB4 PAR64 REQ64 mppc 01 "ESP" hifn lzs hifn mppc -lzs
Text: 7854 Network Security Processor Data Sheet 7854 Network Security Processor Hifn supplies the Internet’s most important raw materials for the creation of intelligent and secure networks: compression, encryption, and flow classification. This is central to the growth of the Internet, helping to make
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DS-0047-00
N5P22
Hifn Security Platform
HIFN
7854-PB4
PAR64
REQ64
mppc 01
"ESP"
hifn lzs
hifn mppc -lzs
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capacitor 630v
Abstract: make SMPS inverter welding machine Kyocera Kinseki CRYSTAL CX smd 0306 package KT2520 electronic passive components catalog AVX vARICON qpl ic laptop motherboard skycap LCD inverter 94v 0
Text: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials
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S-WN0610M1006-R
capacitor 630v
make SMPS inverter welding machine
Kyocera Kinseki CRYSTAL CX
smd 0306 package
KT2520
electronic passive components catalog
AVX vARICON qpl
ic laptop motherboard
skycap
LCD inverter 94v 0
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BTS4020
Abstract: BTS402 smd elco 10uf 35v smx 5138 microsd kyocera ceramic resonator through hole KC2520c military passive component smd elco 10*f 35v smx gsc3e qualcomm 7200
Text: AVX is the technology leader in the Passive electronic component and connector markets. Each year AVX Corporation accepts the challenge of helping Design Engineers create superior products for their customers. Our team of innovators around the world, utilize cutting edge research, design expertise and materials
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S-WN0815M608-R
BTS4020
BTS402
smd elco 10uf 35v smx
5138 microsd
kyocera ceramic resonator through hole
KC2520c
military passive component
smd elco 10*f 35v smx
gsc3e
qualcomm 7200
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GR-78-CORE
Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with
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65-0n-Tien
GR-78-CORE
ROSIN FLUX TYPE ROL0
sn63pb37
Sn62Pb36Ag2
J-STD-006A
RF771
bellcore GR-78
sn63pb37 solder wire
959T
TC-527
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mt 1389 de
Abstract: srfe 1164 SAB 8048 P 220 SM 590 SRFE 1126 pin DIAGRAM OF IC 7400 SH7785 datasheet tea 1601 t ca2 fn 144 manual R8A77850 mt 1389
Text: REJ09B0261-0100 32 SH7785 Hardware Manual Renesas 32-Bit RISC Microcomputer SuperH RISC Engine Family SH7780 Series Rev.1.00 Revision Date: Jan. 10, 2008 Notes regarding these materials 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
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REJ09B0261-0100
SH7785
32-Bit
SH7780
mt 1389 de
srfe 1164
SAB 8048 P 220 SM 590
SRFE 1126
pin DIAGRAM OF IC 7400
SH7785 datasheet
tea 1601 t
ca2 fn 144 manual
R8A77850
mt 1389
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TL3301EP100QG
Abstract: SI570BAB0000544DG LVCMOS18 XC7VX690T-2FFG1761C M/SI570BAB0000544DG 0b1010001
Text: VC709 Evaluation Board for the Virtex-7 FPGA User Guide UG887 v1.3 April 30, 2014 The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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VC709
UG887
2002/96/EC
2002/95/EC
2006/95/EC,
2004/108/EC,
TL3301EP100QG
SI570BAB0000544DG
LVCMOS18
XC7VX690T-2FFG1761C
M/SI570BAB0000544DG
0b1010001
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PTD08D021W
Abstract: MT8JTF12864HZ-1G6G1 LVCMOS18 M88E1111 ADV7511KSTZ virtex 5 lcd display controller Marvell alaska 88E1111 ba37 diode
Text: VC707 Evaluation Board for the Virtex-7 FPGA User Guide UG885 v1.4 May 12, 2014 The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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VC707
UG885
2002/96/EC
2002/95/EC
2006/95/EC,
2004/108/EC,
PTD08D021W
MT8JTF12864HZ-1G6G1
LVCMOS18
M88E1111
ADV7511KSTZ
virtex 5 lcd display controller
Marvell alaska 88E1111
ba37 diode
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82915g motherboard
Abstract: Intel 915G 82915GV 915Gv BGA PACKAGE thermal profile lga775 intel 82915gl PENTIUM4 intel 915gv components 915PL ICH6
Text: R Intel 915G/915GV/915GL/910GL Express Chipset Thermal Design Guide For the Intel® 82915G/82915GV/82915GL, 82910GL Graphics and Memory Controller Hub GMCH February 2005 Document Number: 301469-006 R THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES,
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915G/915GV/915GL/910GL
82915G/82915GV/82915GL,
82910GL
915G/915GV/910GL
82915g motherboard
Intel 915G
82915GV
915Gv
BGA PACKAGE thermal profile lga775
intel 82915gl
PENTIUM4
intel 915gv components
915PL
ICH6
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208 pin rqfp drawing
Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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Abstract: No abstract text available
Text: PHYSICAL LAYER PRODUCT BACKPLANE PRODUCT VSC1129 5 – 6.5 Gb/s Quad Backplane Transceiver & Concentrator BENEFITS: Increase Data Throughput and Extend Life of Existing Backplanes Allows 6.5 Gb/s Transmission Over Backplanes Designed for 1 Gb/s Save Cost by Avoiding Upgrade to Expensive Connectors and Board Materials
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4572 IC 8PIN
Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Text: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines
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503-Pin
4572 IC 8PIN
epx780
TQFP 144 PACKAGE DIMENSION
ALTERA EP610
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