Contextual Info: SMD WIRE WOUND CERAMIC CHIP INDUCTORS 0603CP SERIES Mechanical Dimensions: Unit:mm 1.12(MAX) 1.80(MAX) 1.80(MAX) 1.02(MAX) 1.02(MAX) 1.12(MAX) Electrical Specification Part Part0603CP-1N No. Part 0603CP-1N8 0603CP-1N 0603CP-1N6□-LFR 0603CP-2N1 0603CP-1N8

IHA-007

Abstract: IHA-008 IHA-009 IHA-010 IHA-011 IHA-012
Contextual Info: 1000 BASE-T LAN COMPONENTS Part No. IHA-007 IHA-008 IHA-009 IHA-010 IHA-011 IHA-012 OCL uH Min 100KHz 5.50 5.50 30.3 15.0 7.5 60.0 DCR (Ω) Max 0.21 0.21 0.20 0.20 0.20 0.20 CWW (pF) Max 5.0 5.0 5.0 5.0 LL (uH) Max Rise Time (Ps) Max 20~80% 350 280 1.6

0137 0904

Abstract: 3144 0842 A 3120 0504 PM 1027 T 3109 001 CKR22 MIL-PRF-39014 3887 0415
Contextual Info: MIL-PRF-39014/2Pin DIP T MAX. L H1 MAX. SEE NOTE 1 SEE NOTE 2 .015 MIN .325 ±.035 .012 ±.004 .400 max. H2 MAX. See Note 3 .019 ±.004 .058 ±.012 60° TYP. ±20° Note 1 = Leads centered within ±.005" Note 2 = Angle shall be 95°, +10°, -5° Note 3 = .140 ±.020 inch 3.56 ±0.51mm for

Contextual Info: MIL-PRF-39014/2Pin DIP T MAX. L H1 MAX. SEE NOTE 1 SEE NOTE 2 .015 MIN .325 ±.035 .012 ±.004 .400 max. H2 MAX. See Note 3 .019 ±.004 .058 ±.012 60° TYP. ±20° Note 1 = Leads centered within ±.005" Note 2 = Angle shall be 95°, +10°, -5° Note 3 = .140 ±.020 inch 3.56 ±0.51mm for

Contextual Info: MIL-PRF-39014/2Pin DIP T MAX. L H1 MAX. SEE NOTE 1 SEE NOTE 2 .015 MIN .325 ±.035 .012 ±.004 .400 max. H2 MAX. See Note 3 .019 ±.004 .058 ±.012 60° TYP. ±20° Note 1 = Leads centered within ±.005" Note 2 = Angle shall be 95°, +10°, -5° Note 3 = .140 ±.020 inch 3.56 ±0.51mm for

k 3369

Abstract: 4001 4002 4007 4011 4013 4017 4030 4052 4060 4066 A 3760 0549 3994 0303 CKR24BX105K MARKING 81 0409 47 005 000
Contextual Info: MIL-PRF-39014/2Pin DIP T MAX. L SEE NOTE 1 SEE NOTE 2 .015 MIN .325 .035 .012 .004 H2 MAX. H1 .400 max. See Note 3 .019 .004 .058 .012 60 TYP. 20 Note 1 = Leads centered within .005" Note 2 = Angle shall be 95, +10, -5 Note 3 = .140 .020 inch 3.56 0.51mm for

THF-007D

Abstract: THF-002D THF-006D c 5929
Contextual Info: ISDN LAN COMPONENTS FEATURE: • Designed to meet IR requirement • Environmental: At 265°C in 1 minute • Specifications: At 25°C OCL mH Min 20 30 30 LL (uH) Max 15 4 30 CWW (pF) Max 120 150 A B C D E F DCR (Ω)Max 2.3 4 3.2 ISDN LAN Part No. THF-006D

LF-001

Abstract: LF-001D LF-002 LF-002D
Contextual Info: 10 BASE-T LAN COMPONENTS LF-001 LF-002 LF-002D Insertion Loss dB Max 1~10 MHz 1.0 1.0 3.5 Return Loss (dB) Min 5~10 MHz 15 15 15 Part No. LF-001D OCL (uH) Min 140 LL (uH) Max .600 Part No. Cross talk (dB) Min 1~10 MHz 30 35 35 CWW (pF) Max 17 A B C D CMRR

Contextual Info: .100” 2.54 mm CENTER UL - recgnized components, E 9 6 5 6 9 > SHROUDED HEADERS Shrouded lock header, straight, in-line tails PCB Layout Holes for polarizing pegs S pecifications Centerline spacing: Pins: Max. current per line: Max. continuous current per line:

on3105

Abstract: N12150 on1108
Contextual Info: Photo Couplers • Photosensors for Interrupting Photo Interrupters Ty p e No. Package No. Features If (mA) VcEO (V) ■ Reflective Photosensors (Photo Reflectors) lc Ic ë O tr.tf min. max. (nA) (/J S ) (mA) Vcfiisat) m ax typ, Type No. Package No. max.

THA-013

Abstract: THA-014 THA-015 THA-016 THA-017 THA-018
Contextual Info: ISDN LAN COMPONENTS FEATURE: • Designed to meet IR requirement • Environmental: At 235°C in 1 minute • 1500 Vrms isolation • Specifications: At 25°C OCL uH Min 1.00 1.00 2mH 40 1.20 1.2mH LL (uH) Max 60 60 1.2 .10 0.6 0.6 CWW (pF) Max 30 30 50

HSIP-002

Abstract: HSIP-017 HSIP-001 HSIP-003
Contextual Info: 10/100 BASE-T LAN COMPONENTS HSIP-001 Insertion Loss dB Max 1~125MHz -1.1 HSIP-002 -1.1 HSIP-003 -1.1 HSIP-006 HSIP-009 HSIP-011 HSIP-019 -1.0 1 -1.0 -1.1 HSIP-020 -1.1 Part No. Insertion Loss (dB) Max 100K~100MHz HSIP-010 -1.0 HSIP-012 1.0 HSIP-015 1.0

Etronic USA

Abstract: HF-001D hf-005 HF-003D HF-003DA
Contextual Info: 10/100 BASE-T APPLICATION: • Lan Power Converters Part No. HF-001D Part No. HF-003D HF-003DA HF-005 Insertion Loss dB Max 1~125 MHz -1.1 Insertion Loss (dB) Max 1~125 MHz -0.5 -0.5 -0.5 Return Loss (dB Min) MHz 0.1~60 60~100 -15TX -11TX -17RX -15RX Return Loss

HD-002

Abstract: HD-007 HD-010 HD-001 HD-003 HD-005 HD-006 HD-009 HD-020 HD-022
Contextual Info: 10/100 BASE-T LAN COMPONENTS Part No. HD-002 HD-003 HD-005 HD-006 HD-007 HD-008 HD-009 HD-010 HD-020 HD-022 Part No. HD-001 HD-021 OCL uH Min 350 350 350 350 350 350 350 350 350 350 Insertion Loss (dB) Max 1~10 0MHz -1.3 -1.0 LL (uH) Max 0.30 0.5 0.5 0.5

Contextual Info: 4 NEXT ASSEMBLY RATED VOLTAGE 3 CAPACITANCE ±10% 1 2 CEM3A683SP-1 4000 WVDC .1 µF 373405-1 CEM3A683SP-2 5000 WVDC .05 µF 373405-2 REVISIONS REL. DATE: 11/22/72 RAYTHEON PART NUMBER REV. CHG. NO. DESCRIPTION DATE APPVD. A B D 1.500 MAX .10 TYP .56±.02 SURFACE A

137DE

Abstract: EW37 137DEM
Contextual Info: Characteristics Type Numbers SuperPremium Waveguide EWP37S Premium Waveguide EWP37 Standard Waveguide EW37 Electrical Max. Frequency Range, GHz 3.3-4.3 eTEn Mode Cutoff Frequency, GHz Connectors - Flange dimensions on pages 216-217 L W A W eight in m m

IH-001

Abstract: ih001 IH-002
Contextual Info: 1000 BASE-T LAN COMPONENTS Part No. IH-001 IH-002 Insertion Loss dB Max 1~100 MHz -0.1 1.0 APPLICATION: • Long Haul Gigabit Ethernet • 1000 Base T • full applications supports 4 pairs of category 5UTP cable interface for isolation and low common mode

HLE-101

Contextual Info: LAN & HOME FILTER COMPONENTS FEATURE: • Designed to meet IR requirement • Environmental: At 235°C in 1 minute • 2000 Vrms isolation • Specifications: At 25°C HLE-101 Insertion Loss dB Max 6~9 MHz -1.0 Return Loss (dB) Min 6~9 MHz -1.0 Cross talk

HSBP-001

Abstract: LF-003D LF-005D
Contextual Info: 10/100 BASE-T LAN COMPONENTS Part No. HSBP-001 Insertion Loss dB Max 1~125 MHz -1.1 APPLICATION: • 100 Mbps 155 Mbps transmission in support of • AMD • Level One and other chip manufacturers Rise Time (ns typical) 2.5 Return Loss (dB Min) MHz 0.1~60 60~100

taimag

Abstract: 1861 Taimag USA HB-001
Contextual Info: 10/100 BASE-T LAN COMPONENTS Part No. HB-001 Insertion Loss dB Max 1~125 MHz -1.1 Return Loss (dB Min) MHz 0.1~60 60~100 -15TX -11TX -17RX -15RX APPLICATION: • 100 Mps transmission in support of National Semiconductors • AMD • Level One and other chip manufacturers

TIC-001

Abstract: TIC-006 TIC-007 c 5929 tic 120 TIC-002 TIC-003 TIC-005 tronic tic 35
Contextual Info: ISDN LAN COMPONENTS FEATURE: • Designed to meet IR requirement • Environmental: At 235°C in 1 minute • Specifications: At 25°C TIC-001 TIC-002 TIC-003 TIC-005 TIC-006 TIC-007 OCL mH Min 1.20 22 1.20 1.20 1.20 1.50 LL (uH) Min CWW (pF) Max 0.6 11

HHE-101

Abstract: HHE-102 HHE-103 HHE-105
Contextual Info: LAN & HOME FILTER COMPONENTS Insertion Loss dB Max 1~100MHz HHE-101 -1.1 HHE-102 4.0 HHE-103 -1.1 HHE-105 -1.0 Part No. Return Loss (dB Min) MHz 30~60 60~80 -14 -11 10 -14 -11 -16 -10 APPLICATION: • Home Lan Networking AMD chip and all other chip manufacturers.

MPS 1012

Abstract: HC-002 HC-002A HC-003 c20e
Contextual Info: 10/100 BASE-T LAN COMPONENTS HC-002 Insertion Loss dB Max 1~125 MHz -1.1 HC-002A -1.1 HC-003 -1.1 Part No. Part No. HC-005 HC-017 Part No. HC-006 Return Loss (dB Min) MHz 0.1~60 60~100 -18TX -13TX -17RX -15RX -18TX -13TX -17RX -15RX -15TX -11TX -17RX -15RX

LK-003

Abstract: LK-007 5929 LK-001 LK-002 LK-005 LK-006 LK-008 LK-010 LK-011
Contextual Info: 10 BASE-T LAN COMPONENTS Part No. LK-001 LK-003 LK-005 LK-006 LK-007 LK-008 LK-009 LK-010 LK-011 Part No. LK-002 OCL uH Min 150 140 140 140 140 200 140 100 140 APPLICATION: • Adapter Cards • MAU’S • HUB’S •Motherboards LL (uH) Max 0.3 0.4 0.3