U8 100E

Abstract: BGA2002 ECHO schematic diagrams GS8170DD36C-300 GS8170DD36C-333
Contextual Info: Preliminary GS8170DD18/36C-333/300/250 18Mb Σ1x2Lp Double Data Rate SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Double Data Rate Read and Write mode • JEDEC-standard SigmaRAM™ pinout and package

ECHO schematic diagrams

Contextual Info: Preliminary GS8170LW18/36/72C-333/300/250 18Mb Σ1x1 Late Write SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Late Write mode • Pipeline read operation • JEDEC-standard SigmaRAM™ pinout and package

GS8170D36B-333

Abstract: 8170D18 GS8170D36B-300
Contextual Info: Preliminary GS8170D18/36B-333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x2Lp DDR SRAM 1M x 18, 512K x 36 250 - 333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Double Data Rate Read and Write mode • JEDEC standard SigmaRAM pinout and package

Contextual Info: Preliminary GS8170EW18/36/72C-333/300/250 18Mb Σ1x1 Early Write SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Early Write mode • User-configurable pipeline and flow through operation

ECHO schematic diagrams

Abstract: 8170D18 8170D36 GS8170D36B-300 GS8170D36B-333 Sigma ddr
Contextual Info: Advanced Information GS8170D18/36B-333/300/275/250 209-Bump BGA Commercial Temp Industrial Temp ΣRAM 1M x 18, 512K x 36 16Mb DDR SRAM 333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Double Data Rate Read and Write mode • Observes the Sigma RAM pinout standard

ECHO schematic diagrams

Abstract: flip chip bga 0,8 mm
Contextual Info: Preliminary GS8170DW18/36/72C-333/300/250 18Mb Σ1x1 Double Late Write SigmaRAM SRAM 209-Bump BGA Commercial Temp Industrial Temp 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Double Late Write mode • JEDEC-standard SigmaRAM™ pinout and package

5.1 audio amplifier control circuit

Abstract: MSA7 TDA7057
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA7057AQ 2 x 8 W stereo BTL audio output amplifier with DC volume control Product specification Supersedes data of 1997 July 15 File under Integrated Circuits, IC01 1998 Apr 07 Philips Semiconductors Product specification 2 × 8 W stereo BTL audio output amplifier

Contextual Info: Features/Benefits • • • • • • • • Programmable System Clock with Prescaler and Three Different Clock Sources Very Low Sleep Current < 1 µA Very Low Power Consumption in Active, Power-down and Sleep Mode 2-Kbyte ROM, 256 x 4-bit RAM 12 Bi-directional I/Os

BP51 3A

Contextual Info: Features/Benefits • • • • • • • • Programmable System Clock with Prescaler and Three Different Clock Sources Very Low Sleep Current < 1 µA Very Low Power Consumption in Active, Power-down and Sleep Mode 2-Kbyte ROM, 256 x 4-bit RAM 12 Bi-directional I/Os

so41

Abstract: ATA6020N ATAM893 BP23 BP40 SSO20 LA 4138
Contextual Info: Features/Benefits • • • • • • • • Programmable System Clock with Prescaler and Three Different Clock Sources Very Low Sleep Current < 1 µA Very Low Power Consumption in Active, Power-down and Sleep Mode 2-Kbyte ROM, 256 x 4-bit RAM 12 Bi-directional I/Os

ECHO schematic diagrams

Abstract: GS8170DD36 GS8170DD36C-250 GS8170DD36C-300 GS8170DD36C-300I GS8170DD36C-333 GS8170DD36C-333I
Contextual Info: GS8170DD36C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x2Lp CMOS I/O Double Data Rate SigmaRAM Features • Double Data Rate Read and Write mode • Late Write; Pipelined read operation • JEDEC-standard SigmaRAM™ pinout and package

GS8170LW72C-250

Abstract: GS8170LW72C-300 GS8170LW72C-333 GS8170LW72C-333I
Contextual Info: GS8170LW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM Features 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Functional Description • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

GS8170DW72C-250

Abstract: GS8170DW72C-300 GS8170DW72C-333 GS8170DW72C-333I
Contextual Info: GS8170DW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM Features 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Functional Description • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

GS8170DW36C-200

Abstract: GS8170DW36C-250 GS8170DW36C-300 GS8170DW36C-333
Contextual Info: Preliminary GS8170DW36/72C-333/300/250/200 18Mb Σ1x1Dp CMOS I/O 209-Bump BGA Commercial Temp Industrial Temp 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Double Late Write SigmaRAM Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

GS8170LW72AC-300I

Abstract: GS8170LW36AC-300I GS8170LW36AC-250I GS8170LW72AC-250I GS8170LW36AC-350 GS8170LW36AC-250 GS8170LW36AC-300 GS8170LW36AC-333
Contextual Info: GS8170LW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

Contextual Info: Preliminary GS8170DW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM 250 MHz – 350 MHz 1.8 V VDD 1.8 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

Contextual Info: GS8170LW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

GS8170LW36AC-250

Abstract: GS8170LW36AC-300 GS8170LW36AC-333 GS8170LW36AC-350
Contextual Info: GS8170LW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

Contextual Info: Preliminary GS8170LW36/72AC-350/333/300/250 18Mb Σ1x1Lp CMOS I/O 209-Bump BGA Commercial Temp Industrial Temp 250 MHz – 350 MHz 1.8 V VDD 1.8 V I/O Late Write SigmaRAM Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

Contextual Info: GS8170LW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

GS8170DW36AC-250

Abstract: GS8170DW36AC-300 GS8170DW36AC-333 GS8170DW36AC-350 GS8170DW36AC-350I
Contextual Info: GS8170DW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM 250 MHz–350 MHz 1.8 V VDD 1.8 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

GS8170DD36C-250

Abstract: GS8170DD36 GS8170DD36C-300 GS8170DD36C-300I GS8170DD36C-333 GS8170DD36C-333I
Contextual Info: GS8170DD36C-333/300/250/200 18Mb Σ1x2Lp CMOS I/O Double Data Rate SigmaRAM • Double Data Rate Read and Write mode • Late Write; Pipelined read operation • JEDEC-standard SigmaRAM™ pinout and package • 1.8 V +150/–100 mV core power supply • 1.8 V CMOS Interface

Contextual Info: Preliminary GS8170LW36/72C-333/300/250/200 18Mb Σ1x1Lp CMOS I/O 209-Bump BGA Commercial Temp Industrial Temp 200 MHz–333 MHz 1.8 V VDD 1.8 V I/O Late Write SigmaRAM Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package

GS8170DW36AC-300

Abstract: GS8170DW36AC-333 GS8170DW36AC-350
Contextual Info: Preliminary GS8170DW36/72AC-350/333/300/250 18Mb Σ1x1Dp CMOS I/O 209-Bump BGA Commercial Temp Industrial Temp 250 MHz – 350 MHz 1.8 V VDD 1.8 V I/O Double Late Write SigmaRAM Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package