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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: PDF: 2003 Jun 19 Philips Semiconductors PC board footprint HBCC16; SOT639-2 FOOTPRINT REFLOW SOLDERING handbook, full pagewidth PA = OA = 3.40 (2x) 1.35 (2×) 0.675 (2×) solder lands solder resist 0.50 (8×) 0.075 clearance 0.150 0.35 (4×) 0.30 Cu + SP	Original	PDF	HBCC16; OT639-2 MGX374

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: PDF: 2003 Jun 19 Philips Semiconductors PC board footprint HBCC16; SOT639-2 FOOTPRINT REFLOW SOLDERING handbook, full pagewidth PA = OA = 3.40 (2x) 1.35 (2×) 0.675 (2×) solder lands solder resist 0.50 (8×) 0.075 clearance 0.150 0.35 (4×) 0.30 Cu + SP

Original

PDF

HBCC16; OT639-2 MGX374