67292-013
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 26 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
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67292-014LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 28 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
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67292-012LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 24 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
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10114829-20106LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Vertical, Through Hole, 6 Positions |
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67292-019LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 38 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
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