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    MICRO CIRCUIT ENGINEERING Search Results

    MICRO CIRCUIT ENGINEERING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLP2701 Toshiba Electronic Devices & Storage Corporation Photocoupler (photo-IC output), 5000 Vrms, 4pin SO6L Visit Toshiba Electronic Devices & Storage Corporation
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCKE800NA Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Auto-retry, WSON10B Visit Toshiba Electronic Devices & Storage Corporation
    TCKE800NL Toshiba Electronic Devices & Storage Corporation eFuse IC (electronic Fuse), 4.4 to 18 V, 5.0 A, Latch, WSON10B Visit Toshiba Electronic Devices & Storage Corporation

    MICRO CIRCUIT ENGINEERING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Glenair MWDM2L

    Abstract: Microway 85049 backshell saddle clamp BS9523 pcb connectors BS9523F0002 ASTM a240 83513 pigtail glenair 85049 torque 4-40 brass jackscrew "installation torque"
    Text: Micro-D TwistPin Connectors and Accessories Product Selection Guide MIL-DTL-83513 Connectors Glenair COTS Micro-D Connectors Section A Section B Micro-D Printed Circuit Board Connectors Micro-D Backshells and Accessories Section B Section C MicroEdgeboard Connectors


    Original     		PDF MIL-DTL-83513 06324/0CA77 Glenair MWDM2L Microway 85049 backshell saddle clamp BS9523 pcb connectors BS9523F0002 ASTM a240 83513 pigtail glenair 85049 torque 4-40 brass jackscrew "installation torque"

    Untitled

    Abstract: No abstract text available
    Text: Manual Press with 25 Circuit Tooling Manual Press with Micro-D Backshell Crimp Tool Kit 25 Circuit Instruction Manual Order No. 62202-0000 For Micro-D Backshell Assembly 83424-9014 ΠΠΠDescription Operation Maintenance Order No ATS-622020000 Revision: A


    Original     		PDF ATS-622020000 AM60026-50 1-800-78MOLEX

    393 EZ 952

    Abstract: AA59466-0017 PM1015
    Text: NEW PRODUCTS * MICRO-SCALE TEST KIT Micro-scale Test Kit accessories are designed to attach to industry standard multimeter test probes or prods. These accessories allow convenient and safe testing on breadboards or printed circuit boards. KT-MS002 includes:


    Original     		PDF KT-MS002 JP-8783 BU-60C BU-33C BU-34C BU-40A-* BU-40C-* BU-41A-* BU-41C-* BU-45 393 EZ 952 AA59466-0017 PM1015

    AN-100

    Abstract: CPC7582BC EIA-481-2 J-STD-020A 5510P
    Text: CPC7584 Line Card Access Switch Description • Small 16-pin SOIC or micro-leadframe package • Micro-leadframe package MLP printed circuit board footprint is 70% smaller than 4TH generation EMRs and 60% smaller than SOIC version • Monolithic IC reliability


    Original     		PDF CPC7584 16-pin CPC7584 DS-CPC7584 AN-100 CPC7582BC EIA-481-2 J-STD-020A 5510P

    Untitled

    Abstract: No abstract text available
    Text: 10/3/13 Micro-Ohm Precision Wirewound Miniature Rectangular Printed Circuit Lead Resistor produc guide PRECISION WIREWOUND MINIATURE RECTANGULAR Configuration with Printed Circuit Lead FEATURES: Ultra Stable - Meets Mil R-39005 Non-Inductive - Low Thermal EMF


    Original     		PDF R-39005

    Untitled

    Abstract: No abstract text available
    Text: Agilent 11923A Connectors Product Overview Flexible micro-circuit packaging The Agilent Technologies 11923A 1.0 mm female-connector launch threads into a package or fixture housing to transition a microwave circuit from microstrip to coaxial connector. The 11923A


    Original     		PDF 1923A 1923A 8510XF 5968-4315E

    ARINC 568

    Abstract: Micro Circuit Engineering "Micro Circuit Engineering" Micro Circuit Engineering 70014 application notes on ARINC-429 receiver return to zero decoder arinc 429 70003 four channel decoder 5 to 32 decoder circuit
    Text: MICRO CIRCUIT ENGINEERING ALEXANDRA WAY ASHCHURCH BUSINESS CENTRE TEWKESBURY GLOUCESTERSHIRE, GL20 8TB UNITED KINGDOM DATABUS – ARINC 429 • One way digital information transmission system • Words of 32 bits are transmitted in bipolar return to zero format


    Original     		PDF 70014in ARINC 568 Micro Circuit Engineering "Micro Circuit Engineering" Micro Circuit Engineering 70014 application notes on ARINC-429 receiver return to zero decoder arinc 429 70003 four channel decoder 5 to 32 decoder circuit

    TFD-101-011-10

    Abstract: CC848808551 CC109103157 TFD-101-011-09 CC408617410 407998244 CC109145463 ED83368 ED83368-30 406700658
    Text: PRODUCT OVERVIEW Micro-BDCBB -48V DC Battery Distribution Circuit Breaker Bay • Ideal for customer premise power applications • Digital meter interface Benefits Reliability – Delivers decades of service – High availability architecture – NEBS level 3 certified


    Original     		PDF 877-LINEAGE TFD-101-011-10 CC848808551 CC109103157 TFD-101-011-09 CC408617410 407998244 CC109145463 ED83368 ED83368-30 406700658

    PA66-GF30 RELAY

    Abstract: PA66-GF30 RELAis PA66-GF30 RELAY schema PA66-GF30 Miniature glass fuses color coding subminiature fuses color coding JASO d 611 PA66-GF30 start relais PIV RATING 36 V DIODE with peak repetitive current 60A STK 4252
    Text: Automotive Circuit Protection Products Contents Fuseology 1 Fuseology Relays 8 Relays ISO MINI Relays MICRO Relays STARTER Relays Surface Mount Varistors Multilayer Transient Voltage Surge Surpressor Resettable PTCs 1206L Series Surface Mount PTCs 1812L Series Surface Mount PTCs


    Original     		PDF 1206L 1812L FHAC0001 FHAC0002 0FHA000x 0FHA0200 0FHM000x 0FHM0200 0MAH0001 PA66-GF30 RELAY PA66-GF30 RELAis PA66-GF30 RELAY schema PA66-GF30 Miniature glass fuses color coding subminiature fuses color coding JASO d 611 PA66-GF30 start relais PIV RATING 36 V DIODE with peak repetitive current 60A STK 4252

    Z4D-B02

    Abstract: 175489-4 amp
    Text: Micro-displacement Sensor Z4D-B02 • Dimensions ■ Features • • • • Note: All units are in millimeters unless otherwise indicated. 175489-4 Tyco Electronics AMP Easier control enabled by built-in processor circuit. Resolution: ±50 µm. Operating area: 9.5±3 mm.


    Original     		PDF Z4D-B02 JB301-E3-01 Z4D-B02 175489-4 amp

    k1b0

    Abstract: AN-100 CPC7581 EIA-481-2 J-STD-020A IPC-9502
    Text: CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions. • Monolithic IC reliability


    Original     		PDF CPC7581 16-pin DS-CPC7581-R3 k1b0 AN-100 CPC7581 EIA-481-2 J-STD-020A IPC-9502

    AN-100

    Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE J-STD-020A
    Text: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability


    Original     		PDF CPC7582 16-pin DS-CPC7582-R3 AN-100 CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE J-STD-020A

    munsell 6.5

    Abstract: distance sensor circuit
    Text: Micro-displacement Sensor Z4D-B01 • Dimensions ■ Features Note: All units are in millimeters unless otherwise indicated. • • • • 2-175489-4 Tyco Electronics AMP Easier control enabled by built-in processor circuit. Resolution: ±10 µm. Operating area: 6.5±1 mm.


    Original     		PDF Z4D-B01 Z4D-B01 munsell 6.5 distance sensor circuit

    Z4D-B01

    Abstract: No abstract text available
    Text: Micro-displacement Sensor Z4D-B01 • Dimensions ■ Features Note: All units are in millimeters unless otherwise indicated. • • • • 2-175489-4 Tyco Electronics AMP Mounting reference plane Emitter axis +0.05 Two, 2 −0.15 dia. Two, 1 dia. Easier control enabled by built-in processor circuit.


    Original     		PDF Z4D-B01 JB301-E3-01 Z4D-B01

    Untitled

    Abstract: No abstract text available
    Text: STE □ 2S7S27 aG313*ìO 043 • AMD3 D PRELIMINARY AD V MICRO TELECOM ^ 7 5 -1 5 Am79C30A Advanced Micro Devices Digital Subscriber Controller (DSC™) Circuit DISTINCTIVE CHARACTERISTICS ■ Combines CCUT 1.430 S/T-lnterface Trans­ ceiver, D-Channel LAPD Processor, Audio


    OCR Scan     		PDF 2S7S27 aG313* Am79C30A 32-byte PL028 PL032 CD040 PD040 PL044

    EIA-364-13

    Abstract: EIA-364-20 EIA-364-21 EIA-364-27 EIA-364-28 EIA-364-52
    Text: tifca Electronics 108-1955 Product Specification 160ct02 Rev A EC 0990-1551-02 AMPMODU* Micro Interconnect Plug and Receptacle Connectors 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the AMPMODU* Micro Interconnect cable mounted plug and printed circuit board mounted receptacle connectors available in


    OCR Scan     		PDF 160ct02 06Aug02. EIA-364-13 EIA-364-20 EIA-364-21 EIA-364-27 EIA-364-28 EIA-364-52

    AMP Spec 109-21-7

    Abstract: 10C1 Spec 109-28-1 17105-3608
    Text: PRODUCT SPECIFICATION 1. 1.1. SCOPE Content This specification covers performance, tests and quality requirements for AMP* Micro-Strip board to board right angle and vertical connector family. These assemblies accommodate a variety of printed circuit board thicknesses. Plug


    OCR Scan     		PDF 77r77r AMP Spec 109-21-7 10C1 Spec 109-28-1 17105-3608

    STR F 6234

    Abstract: 09893E e712 09893f 56497 440-256 lmr2 5d DSC 5D
    Text: Am79C30A/32A Advanced Micro Devices Digital Subscriber Controller DSC™ Circuit DISTINCTIVE CHARACTERISTICS • Combines CCITT 1.430 S/T-lnterface Transceiv­ er, D-Channel LAPD Processor, Audio Proces­ sor (DSC device only), and IOM-2 Interface in a


    OCR Scan     		PDF Am79C30A/32A 16-byte 09B93G 3M-i/95-0 STR F 6234 09893E e712 09893f 56497 440-256 lmr2 5d DSC 5D

    Untitled

    Abstract: No abstract text available
    Text: PRELIM IN ARY Advanced Micro Devices Am79C30A Digital Subscriber Controller DSC™ Circuit DISTINCTIVE CHARACTERISTICS • ■ ■ Combines CCITT 1.430 S/T-lnterface Trans­ ceiver, D-Channel LAPD Processor, Audio Processor (DSC device only), and IOM 2


    OCR Scan     		PDF Am79C30A 32-byte 16-byte

    DM74ALS1245A

    Abstract: No abstract text available
    Text: DM54ALS1245A/DM74ALS1245A TRI-STATE Bus Transceivers General Description Features This advanced low power Schottky device contains 8 pairs of TRI-STATE logic elements configured as octal bus trans­ ceivers. This circuit is designed for use in memory, micro­


    OCR Scan     		PDF DM54ALS1245A/DM74ALS1245A 20-3A DM74ALS1245A

    Untitled

    Abstract: No abstract text available
    Text: Quality and Reliabilty Introduction Superior integrated circuit device reliability is attained when it is an integral part of process devel­ opment, design and manufacturing. This section describes the methodology used by the IBM Micro­ electronics Division to achieve robust DRAM


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Quality and Reliabilty Introduction Superior integrated circuit device reliability is attained when it is an integral part of process devel­ opment, design and manufacturing. This section describes the methodology used by the IBM Micro­ electronics Division to achieve robust DRAM


    OCR Scan     		PDF

    MT32018

    Abstract: MT32028 Micro Circuit Engineering T3G27 DALE crystal 16Mhz iran manchester encoder 1553B generation circuit of manchester "Micro Circuit Engineering"
    Text: MCI MT32018 MT32028 Micro Circuit Engineering ENCODER/DECODER ACTUAL SIZE M IL -S T D -1553B THE INTERNATIONAL STANDARD FEATURES SIMPLIFIED BLOCK SCHEMATIC T E R M IN A I ADDR ESS PARITY S ER E EN DIS B*T* vü r i r A B C • COMPLIANT TO 1553 • COMPLETE WORD VALIDATION


    OCR Scan     		PDF MIL-STD-1553B MT32018 MT32028 16MHz i0684 29943S 1267/M MT32028 Micro Circuit Engineering T3G27 DALE crystal 16Mhz iran manchester encoder 1553B generation circuit of manchester "Micro Circuit Engineering"

    Untitled

    Abstract: No abstract text available
    Text: Electro-Films has developed a thin film process that has the unique capability of incorporating up to 5.0 mil thick plated copper conductors on the same substrate with standard 100 to 300 micro-inch thick conductors. Some hybrid circuit applications require thick copper conductors for the power lines but


    OCR Scan     		PDF A1203,