MICRO FINELINE BGA Search Results

MICRO FINELINE BGA Result Highlights (5)

Part	Manufacturer	Description
TMPM3HMFYAFG	Toshiba Electronic Devices & Storage Corporation	Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003
TMPM3HPFYADFG	Toshiba Electronic Devices & Storage Corporation	Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP128-1420-0.50-001
TMP89FS60AUG	Toshiba Electronic Devices & Storage Corporation	8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E
TMP89FS63AUG	Toshiba Electronic Devices & Storage Corporation	8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65
TMPM3HLFYAUG	Toshiba Electronic Devices & Storage Corporation	Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP64-1010-0.50-003

MICRO FINELINE BGA Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
PCN0712 Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100 Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array	Original	PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100	PDF
ADV0907 Abstract: ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV0907 ADDITIONAL ASSEMBLY PLANT FOR MBGA PACKAGES Change Description Altera will be introducing Amkor, Philippines as an additional assembly source for Altera Micro FineLine BGA MBGA packages. This change does not affect the form, fit, or function of the	Original	ADV0907 ADV0907 ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N	PDF
EPM240 Abstract: epm2210 Text: Chapter 1. Introduction MII51001-1.7 Introduction The MAX II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layer-metal-flash process, with densities from 240 to 2,210 logic elements LEs (128 to 2,210 equivalent macrocells) and non-volatile	Original	MII51001-1 EPM240 epm2210	PDF
micro fineline BGA Abstract: EPM240Z EPM1270 EPM2210 EPM240 EPM240G EPM570 bga-100 0.5 Text: 1. Introduction MII51001-1.9 Introduction The MAX II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layer-metal-flash process, with densities from 240 to 2,210 logic elements LEs (128 to 2,210 equivalent macrocells) and non-volatile storage of 8 Kbits. MAX II devices	Original	MII51001-1 micro fineline BGA EPM240Z EPM1270 EPM2210 EPM240 EPM240G EPM570 bga-100 0.5	PDF
micro fineline BGA Abstract: No abstract text available Text: 1. Introduction MII51001-1.8 Introduction The MAX II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layermetal-flash process, with densities from 240 to 2,210 logic elements LEs (128 to 2,210 equivalent macrocells) and non-volatile storage of 8 Kbits. MAX II devices offer high	Original	MII51001-1 micro fineline BGA	PDF
micro fineline BGA Abstract: EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z Text: 7. Package Information MII51007-2.1 Introduction This chapter provides package information for Altera’s MAX II devices, and includes these sections: • “Board Decoupling Guidelines” on page 7–1 ■ “Device and Package Cross Reference” on page 7–1	Original	MII51007-2 144-Pin 68-Pin 144Pin 100-pin micro fineline BGA EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z	PDF
EQFP 144 PACKAGE Abstract: BGA and eQFP Package TQFP 144 PACKAGE altera micro fineline BGA eQFP EPC16 Text: Package dimensions selector guide FineLine BGA FBGA ; Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 896 33.00 x 33.00 1.00 1,508 780 31.00 x 31.00 1.00 40.00 x 40.00 1.00 35.00 x 35.00	Original		PDF
CMOS handbook Abstract: error 41 barrier EPM1270 EPM2210 EPM240 EPM240G EPM240Z EPM570 fbga Substrate design guidelines BGA PACKAGE OUTLINE Text: Section II. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for MAX II devices. It contains the required printed circuit board PCB layout guidelines, device pin tables, and package specifications.	Original		PDF
Board Design Guideline Abstract: board design guidelines RLDRAM k4h561638f EP1S60 EP2S15 EP2S30 ep2s60f1020 gx Text: Interfacing RLDRAM II with Stratix II, Stratix,& Stratix GX Devices Application Note 325 November 2005, ver. 3.1 Introduction Reduced latency DRAM II RLDRAM II is a DRAM-based point-to-point memory device designed for communications, imaging, and server	Original		PDF
marking code nt Abstract: EPM240 Text: Chapter 6. Reference & Ordering Information MII51006-1.3 Software MAX II devices are supported by the Altera® Quartus® II design software with new, optional MAX+PLUS® II look and feel, which provides HDL and schematic design entry, compilation and logic synthesis, full	Original	MII51006-1 XP/2000/NT, release00° marking code nt EPM240	PDF
MAX II Abstract: No abstract text available Text: 6. Reference and Ordering Information MII51006-1.6 Software MAX II devices are supported by the Altera® Quartus® II design software with new, optional MAX+PLUS® II look and feel, which provides HDL and schematic design entry, compilation and logic synthesis, full simulation and advanced timing analysis,	Original	MII51006-1 XP/2000/NT, MAX II	PDF
"Constant fraction discriminator" Abstract: cti pet Constant fraction discriminator SIEMENS BST vhdl cordic code EPC1064V HP 30 pin lcd flex cable pinout vhdl code for cordic Constant fraction timing discriminator EPF10K50EQI240-2 Text: & News Views First Quarter, February 2000 The Programmable Solutions Company Newsletter for Altera Customers Altera Provides World-Class HDL Synthesis & Simulation Tools Altera has entered into agreements with Synopsys, Inc., and Mentor Graphics Corporation that enable Altera’s entire	Original		PDF
256-pin Plastic BGA 17 x 17 Abstract: EPM240 EPM3032A application altera EPM7032S epm7192 micro fineline BGA EPM7032AE EPM7064AE EPM7128AE EPM7256AE Text: MAX CPLD Series Package & I/O Matrix MAX 3000A CPLDs EPM2210/G EPM3032A EPM3064A EPM3128A EPM3256A EPM3512A EPM7032B EPM7064B EPM7128B EPM7256B EPM7512B EPM7032AE EPM7064AE EPM7128AE EPM7256AE EPM7512AE EPM7032S EPM7064S EPM7128S EPM7160S EPM7192S EPM7256S	Original	7000AE 7000B 7000S EPM3064A EPM3128A EPM3256A EPM3512A EPM7032B EPM7064B EPM7128B 256-pin Plastic BGA 17 x 17 EPM240 EPM3032A application altera EPM7032S epm7192 micro fineline BGA EPM7032AE EPM7064AE EPM7128AE EPM7256AE	PDF
EPM1270 Abstract: altera 10 k series cpld recommended hdl coding styles, quartus ii handbook version 13.0, volume 1 PCI_T32 MegaCore ALTERA EPM1270F256 EPM2210 EPM240 EPM240G EPM240Z EPM570 Text: MAX II CPLD Design Guidelines Application Note 428 December 2007, Ver 1.1 Introduction With the flexibility of complex programmable logic devices CPLDs , together with their low power consumption and low cost, more designers are using CPLDs in their system design. Using MAX II CPLDs in your	Original		PDF

EP4CE6 package Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80 Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead	Original	DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80	PDF
EP4CE15 Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead	Original	DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22	PDF
PQFP 176 Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760 Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●	Original	144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760	PDF
rtd 2612 Abstract: EP2S60F1020 EP2S60 BGA pinout diagram MT47H64M8-37E EP2S15 EP2S180 EP2S30 EP2S60 EP2S60F1020C3 EP2S90 Text: Interfacing DDR2 SDRAM with Stratix II Devices Application Note 328 May 2006, ver. 3.1 Introduction DDR2 SDRAM is the latest generation of double-data rate DDR SDRAM technology, with improvements including lower power consumption, higher data bandwidth, enhanced signal quality, and on-die termination	Original		PDF
CYCLONE 3 ep3c25f324* FPGA Abstract: FBGA-484 datasheet EP3C16F484I7N EPM570T144I5 EP3C10E144I7N EP3C25F324I7N EPM1270F256I5 EPM1270T144I5 EP2C5Q208I8N EP3C120F780I7N Text: Technical Brief Extended Temperature Support for Cyclone II, Cyclone III, and MAX II Devices Introduction Semiconductor devices undergo at least two types of testing: device characterization and production testing. Device characterization is used to verify the performance of a semiconductor design and its physical implementation.	Original		PDF
daewon tray Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA	Original	AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga	PDF
pin information ep3c10 Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55 Text: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.	Original	EP3C25 EP3C10 pin information ep3c10 EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55	PDF
Untitled Abstract: No abstract text available Text: Designing With High-Density BGA Packages for Altera Devices Application Note 114 January 2014, ver. 5.2 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues	Original		PDF
k4h561638f Abstract: K4H561638F-TCCC MT46V16M16TG-5B EP2S15 EP2S180 EP2S30 EP2S60 EP2S60F1020C3 EP2S90 MT9VDDT3272AG-40B Text: Interfacing DDR SDRAM with Stratix II Devices Application Note 327 February 2006 ver. 3.0 Introduction DDR SDRAM devices are widely used today for a broad range of applications, such as embedded processor systems, image processing, storage, communications and networking. In addition, the universal	Original	200-MHz 150-MHz k4h561638f K4H561638F-TCCC MT46V16M16TG-5B EP2S15 EP2S180 EP2S30 EP2S60 EP2S60F1020C3 EP2S90 MT9VDDT3272AG-40B	PDF
altera epm570 Date Code Formats Abstract: HP LED handbook EPM1270 ieee 1532 linear handbook EPM2210 EPM240 EPM240G EPM240Z EPM570 Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating	Original		PDF

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MICRO FINELINE BGA Search Results

MICRO FINELINE BGA Result Highlights (5)

MICRO FINELINE BGA Datasheets Context Search

PCN0712

ADV0907

EPM240

micro fineline BGA

micro fineline BGA

micro fineline BGA

EQFP 144 PACKAGE

CMOS handbook

Board Design Guideline

marking code nt

MAX II

"Constant fraction discriminator"

256-pin Plastic BGA 17 x 17

EPM1270

EP4CE6 package

EP4CE15

PQFP 176

rtd 2612

CYCLONE 3 ep3c25f324* FPGA

daewon tray

pin information ep3c10

Untitled

k4h561638f

altera epm570 Date Code Formats