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    MICRO PITCH BGA Search Results

    MICRO PITCH BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM3HMFYAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HPFYADFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP128-1420-0.50-001 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HLFYAUG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP64-1010-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation

    MICRO PITCH BGA Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    DIODE smd marking 22-16

    Abstract: vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621
    Text: Micro SMD Qualification Package LM358, LMC6035, LM431, LM78L05, and LMC555 National’s Micro SMD – The Obvious Answer For Portable Applications Standard Surface Mount Packages vs. Micro SMD Micro SMD Package • 0.5mm Bump Pitch • 0.9mm Max Package Height


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    LM358, LMC6035, LM431, LM78L05, LMC555 OT23-5 DIODE smd marking 22-16 vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621 PDF

    0.65mm pitch BGA

    Abstract: ASTM-B-488 C17200
    Text: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in Electrical performance


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    ASTM-B-488 QQ-N-290 MICROBGA-TECH09 0.65mm pitch BGA ASTM-B-488 C17200 PDF

    PGA socket 479

    Abstract: No abstract text available
    Text: This document was generated on 01/11/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: Replacement Part Number: 0471719110 Obsolete 1.27mm .050" Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)


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    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required.


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    27mm2. UL94V-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.40mm or larger. • Pressure mounting, no soldering required.


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    27mm2. UL94V-0 PDF

    zif socket 1.27mm pitch

    Abstract: micro pitch BGA PGA zif socket
    Text: This document was generated on 01/11/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0512899592 Planned for Obsolescence 1.27mm .050" Pitch, ZIF Micro PGA Socket, 959 Circuits with Ball Grid Array (BGA) Solder, with Cover Tape, 0.30µm (12µ") Gold (Au) Plating


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    51289Series zif socket 1.27mm pitch micro pitch BGA PGA zif socket PDF

    6-1761614-0

    Abstract: 7-1761614-0
    Text: High Speed Fine Pitch Connectors MICTOR, MICTOR SB, Micro-Strip and STEP-Z Interconnection Systems Table of Contents Need more information? Call Technical Support at the numbers listed below. Technical Support is staffed with specialists well versed in all Tyco Electronics


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    ISO900ed 6-1761614-0 7-1761614-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.


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    27mm2. UL94V-0 PDF

    micro pitch BGA

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-In Socket For Devices Up to 55mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any device on 0.40mm pitch or larger. • 4 Point crown insures “scrub” on solder oxides.


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    micro SD socket

    Abstract: PGA socket 479 socket 479 mobile pentium 4
    Text: This document was generated on 01/06/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0512484792 Planned for Obsolescence 1.27mm .050" Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA) Mount, ZIF, 479 Circuits, with Pick and Place Cover, Tray Package, 0.25µm (10µ")


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    PS-51248-005 51248Series SD-51248-003 micro SD socket PGA socket 479 socket 479 mobile pentium 4 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.


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    27mm2. UL94V-0 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.


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    27mm2. UL94V-0 PDF

    F199

    Abstract: No abstract text available
    Text: FACTSHEET F-199 CSB CSB CSB .050" AREA ARRAY SOCKET High reliability Tiger-Eye contacts Mates with: MSB Materials: Polarized notches CT CONTA T PATEN G PENDIN Optional polarized Alignment Pins 1,27mm .050" micro pitch Note: Some sizes, styles and options are non-standard,


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    F-199 1-800-SAMTEC-9 F199 PDF

    23019

    Abstract: No abstract text available
    Text: CSP/MICRO BGA Test & Burn-in Socket for Devices Up to 40mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.40mm or larger. • 4 Point crown insures “scrub” on solder oxides. • Single Point Probes available for small land area contact pads.


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    132-ball

    Abstract: via antipad pitch micro pitch BGA LC4256ZE MN64 4000ZE drill market LC4256ZEMN144 UMN64 stackup
    Text: LOW COST BOARD LAYOUT TECHNIQUES FOR DESIGNING WITH PLDS IN BGA PACKAGES A Lattice Semiconductor White Paper July 2010 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Low Cost Board Layout Techniques for Designing with PLDs in BGA Packages


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    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


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    TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256 PDF

    BGA Solder Ball 0.35mm collapse

    Abstract: BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm AN-5026 FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543
    Text: Fairchild Semiconductor Application Note January 2001 Revised February 2001 Using BGA Packages Introduction Demanding space and weight requirements of personal computing and portable electronic equipment has led to many innovations in IC packaging. Combining the right


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    AN-5026 BGA Solder Ball 0.35mm collapse BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543 PDF

    BGA Solder Ball collapse

    Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
    Text: Fairchild Semiconductor Application Note January 2001 Revised September 2001 Using BGA Packages Introduction TABLE 1. BGA Space Savings Compared to Surface Mount Packages Demanding space and weight requirements of personal computing and portable electronic equipment has led to


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    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a


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    DS550R PDF

    BGA reflow guide

    Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
    Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


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    N163MZ163 N130MZ327 N161MZ612 N169MZ365 N169MZ641 N158MZ395 BGA reflow guide "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile PDF

    AN-1112

    Abstract: ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC
    Text: National Semiconductor Application Note 1112 January 13, 2010 Table of Contents Introduction . 2 Package Construction . 2


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    AN-1112 AN-1112 ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC PDF

    JESD22-B117

    Abstract: MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110
    Text: VISHAY SILICONIX Power MOSFETs Application Note 835 PCB Design and Surface-Mount Assembly Guidelines for MICRO FOOT Packages By Changsheng Chen/Greg Getzan Introduction The Vishay Siliconix MICRO FOOT® product family is based on wafer-level chip scale packaging WL-CSP


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    Si8902EDB 25-Apr-08 JESD22-B117 MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110 PDF

    ALIVH

    Abstract: WLCSP smt 250 B 340 smd Transistor WLCSP stencil design AN-1112 national semiconductor pb-free marking 250 micro solder ball 9221 MARKING MARKING SMD IC CODE smd diode ED
    Text: National Semiconductor Application Note 1112 September 9, 2009 Table of Contents Introduction . 2 Package Construction . 2


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    AN-1112 ALIVH WLCSP smt 250 B 340 smd Transistor WLCSP stencil design AN-1112 national semiconductor pb-free marking 250 micro solder ball 9221 MARKING MARKING SMD IC CODE smd diode ED PDF

    Untitled

    Abstract: No abstract text available
    Text: HI-DENSITY SOCKET SPECIFICATIONS Mates with: YFT, YFW 1,27mm .050" micro pitch High reliability Tiger-Eye contacts _ For complete specifications see www.samtec.com?YFS YFS SERIES U iJ Insulator Material: Black Liquid Crystal Polymer Contact Material: Phosphor Bronze


    OCR Scan
    400pS 100pS 1-800-SAMTEC-9 PDF