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    MICRO SOLDER BALL Search Results

    MICRO SOLDER BALL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM3HMFYAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HPFYADFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP128-1420-0.50-001 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HLFYAUG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP64-1010-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation

    MICRO SOLDER BALL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    IPC-SM-785

    Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
    Text: National Semiconductor Application Note 1112 March 2002 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning


    Original     		PDF AN-1112 IPC-SM-785 GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP

    stencil tension

    Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
    Text: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning


    Original     		PDF AN-1112 stencil tension IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design

    BGA-3000

    Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball
    Text: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste


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    zif socket 1.27mm pitch

    Abstract: micro pitch BGA PGA zif socket
    Text: This document was generated on 01/11/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0512899592 Planned for Obsolescence 1.27mm .050" Pitch, ZIF Micro PGA Socket, 959 Circuits with Ball Grid Array (BGA) Solder, with Cover Tape, 0.30µm (12µ") Gold (Au) Plating


    Original     		PDF 51289Series zif socket 1.27mm pitch micro pitch BGA PGA zif socket

    ansys darveaux

    Abstract: pitarresi ansys optimization BGA Ball Crack 8L-10L
    Text: Solder Joint Reliability Model with Modified Darveaux’s Equations for the micro SMD Wafer Level-Chip Scale Package Family L. Zhang, R. Sitaraman*, V. Patwardhan, L. Nguyen, and N. Kelkar National Semiconductor Corporation 3707 Tahoe Way, M/S 19-100 Santa Clara, CA 95051


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    transistor b 1238

    Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension
    Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA*) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


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    28F160

    Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
    Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


    Original     		PDF

    BGA reflow guide

    Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
    Text: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


    Original     		PDF N163MZ163 N130MZ327 N161MZ612 N169MZ365 N169MZ641 N158MZ395 BGA reflow guide "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256

    120C

    Abstract: 140C 210C
    Text: Note Number AN-C1-RW-A Development Tools And Methods APPLICATION NOTE CLEARONE REWORK PROCEDURE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using


    Original     		PDF N130MZ327 N163MZ163 N169MZ365 N161MZ612 N169MZ641 120C 140C 210C

    PSR4000 AUS308

    Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
    Text: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array


    Original     		PDF HL832 HL832-HS HL832-NB MCL-E-679W MCL-E-679BR MCL-E-679FG GHPL-830 GEA-679N MR600 GHPL-830 PSR4000 AUS308 prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG

    PGA socket 479

    Abstract: No abstract text available
    Text: This document was generated on 01/11/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: Replacement Part Number: 0471719110 Obsolete 1.27mm .050" Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)


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    micro SD socket

    Abstract: PGA socket 479 socket 479 mobile pentium 4
    Text: This document was generated on 01/06/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0512484792 Planned for Obsolescence 1.27mm .050" Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA) Mount, ZIF, 479 Circuits, with Pick and Place Cover, Tray Package, 0.25µm (10µ")


    Original     		PDF PS-51248-005 51248Series SD-51248-003 micro SD socket PGA socket 479 socket 479 mobile pentium 4

    JESD22-B117

    Abstract: MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110
    Text: VISHAY SILICONIX Power MOSFETs Application Note 835 PCB Design and Surface-Mount Assembly Guidelines for MICRO FOOT Packages By Changsheng Chen/Greg Getzan Introduction The Vishay Siliconix MICRO FOOT® product family is based on wafer-level chip scale packaging WL-CSP


    Original     		PDF Si8902EDB 25-Apr-08 JESD22-B117 MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110

    ALIVH

    Abstract: national semiconductor pb-free marking AN-1112 JESD51-3 MARKING CODE SMD IC General Semiconductor smd gm 9221 MARKING
    Text: National Semiconductor Application Note 1112 December 18, 2007 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 ALIVH national semiconductor pb-free marking AN-1112 JESD51-3 MARKING CODE SMD IC General Semiconductor smd gm 9221 MARKING

    AN-1112

    Abstract: ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC
    Text: National Semiconductor Application Note 1112 January 13, 2010 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 AN-1112 ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC

    8 PIN SMD IC 211

    Abstract: BGA-3000 top mark smd A9 SMD MARK A9 shaker
    Text: National Semiconductor Application Note 1112 September 1999 CONTENTS Package Construction ing, singulation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for Micro SMD 4 and 8 I/O Packages


    Original     		PDF AN-1112 8 PIN SMD IC 211 BGA-3000 top mark smd A9 SMD MARK A9 shaker

    ALIVH

    Abstract: HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC
    Text: National Semiconductor Application Note 1112 September 2005 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF CSP-9-111S2) CSP-9-111S2. AN-1112 ALIVH HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC

    ALIVH

    Abstract: JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement
    Text: National Semiconductor Application Note 1412 June 9, 2009 Table of Contents Introduction . Package Construction .


    Original     		PDF AN-1412 ALIVH JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement

    AN-1112

    Abstract: solder joint reliability IPC-SM-785 Solder paste stencil life thick bga die size Semiconductor smd marking BY SMD 420
    Text: National Semiconductor Application Note 1112 March 2002 Table of Contents Introduction to MICRO SMD . Package Construction .


    Original     		PDF

    IPC-SM-785

    Abstract: stencil tension AN-1112
    Text: National Semiconductor Application Note 1112 April 2003 Table of Contents Introduction . Package Construction .


    Original     		PDF

    ALIVH

    Abstract: pcb thermal Design guide trace theta layout AN-1412 7x8 64 footprint micro solder ball
    Text: National Semiconductor Application Note 1412 May 2006 Table of Contents Introduction . Package Construction .


    Original     		PDF AN-1412 ALIVH pcb thermal Design guide trace theta layout AN-1412 7x8 64 footprint micro solder ball

    ALIVH

    Abstract: AN-1112 AN1112 ALIVH PCB joint JESD51-3
    Text: National Semiconductor Application Note 1112 January 13, 2010 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 ALIVH AN-1112 AN1112 ALIVH PCB joint JESD51-3

    stratos 210-010

    Abstract: Stratos Lightwave SFP Cage 210-010 BT 742 stratos EIA-481-2-A L031 l0319 Stratos Lightwave SHT5
    Text: REVISIONS 00 — — DRAW ING R ELEASE 03/29/01 RM .40 [.02] .80 [.03] T YP ightwave NOTES: 1. MATERIAL: INSULATOR - HIGH TEMPERATURE LCP, UL 94VO, BLACK CONTACTS: PHOSOPOR BRONZE 2. CONTACT FINISH: 30 MICRO-INCHES OF GOLD OVER NICKEL GOLD FLASH OVER NICKEL ON SOLDER FOOT


    OCR Scan     		PDF