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    MICRON 3.3 Search Results

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    MT29F128G08AJAAAWP-IT

    Abstract: MT29F128G08AJAAAWP MT29F32G08ABCABH1-10IT MT29F32G08ABCABH1 MT29F32G08AB MT29F128G08AJAAA M73A 256gb nand flash mt29f128g08 MT29F128G08A
    Text: MT29F32G08ABCABH1-10IT - Micron Technology, Inc. Page 1 Micron Global Investor Relations News & Events Jobs Contact Micron Login PRODUCTS & SUPPORT ABOUT MICRON How To Buy Sign up for Access Enter Search Term or Part Number MY WORKSPACE MT29F32G08ABCABH1-10IT


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    PDF MT29F32G08ABCABH1-10IT MT29F32G08ABCABH1-10IT 100-ball 32/64/128/256Gb Down09/2010 flash/mass-storage/mt29f32g08abcabh1-10it MT29F128G08AJAAAWP-IT MT29F128G08AJAAAWP MT29F32G08ABCABH1 MT29F32G08AB MT29F128G08AJAAA M73A 256gb nand flash mt29f128g08 MT29F128G08A

    AMI350XXPR

    Abstract: ODCHXX16 MAP 3959 crystal oscillator 4049
    Text: 0.35 Micron CMOS Pad Library Datasheets AMI350XXPR 3.3/5.0 Volt Section 4 PAD LIBRARY Revision 1.1 PAD LIBRARY SELECTIO DATASHEETS Pad Logic AMI350XXPR 0.35 micron CMOS Pad Library 4-3 AMI350XXPR 0.35 micron CMOS Pad Library Pad Logic PAD SELECTION GUIDE


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    PDF AMI350XXPR ODCHXX16 MAP 3959 crystal oscillator 4049

    PC/104

    Abstract: No abstract text available
    Text: MICRON MICRON MICRON MICRON Low power 200MHz PR266 or 250MHz (PR366) CPU options Up to 256MB SDRAM SST ATA-Disk Chip and CompactFlash support Integrated AGP (x2) Trident CyberBlade Graphics for LCD and CRT 10/100Base-T Ethernet Soundblaster compatible Audio (optional)


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    PDF 200MHz PR266) 250MHz PR366) 256MB 10/100Base-T PC/104 PC/104+ PC/104

    MT29F32G08AFACA

    Abstract: MT29F32G08 MT29F32G0
    Text: Specifications Data Sheets B~s/Cell: SLC Brand: Micron Bus Wi<hh: x8 Chill Em1ble: Single Component Density: 32Gb Depth: 2Gb Fall: Micron Family: NAND Flash Generation l>rimaly : First Generation 110 : Common 110 Channels: 1 lnte1face: Async Manufacturer: Micron


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    PDF 48-pin MT29F32G08AFACAVVP MT29F32G08AFACAVI/PES MT29F32G08AFACA MT29F32G08 MT29F32G0

    MT29F32G08AFACAWP-IT

    Abstract: MT29F32G08AFACAWP-ITES MT29F32G08AFA MT29F32G08 MT29F32G08AFACAWP
    Text: Specifications Data Sheets B~s/Cell: SLC Brand: Micron Bus Wi<hh: x8 Chill Em1ble: Single Component Density: 32Gb Depth: 2Gb Fall: Micron Family: NAND Flash Generation l>rimaly : First Generation 110 : Common 110 Channels: 1 lnte1face: Async Manufacturer: Micron


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    PDF 48-pin MT29F32G08AFACAWP-ItC MT29F32G08AFACAWP-ITES MT29F32G08AFACAWP-IT MT29F32G08AFA MT29F32G08 MT29F32G08AFACAWP

    XH018

    Abstract: No abstract text available
    Text: 0.18 m Process Family: XH018 0.18 Micron Modular Analog Mixed HV Technology DESCRIPTION The XH018 series is X-FAB’s 0.18 micron Modular Mixed Signal HV CMOS Technology. Based upon the industrial standard single poly with up to six metal layers 0.18 micron


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    PDF XH018 XH018 18-micron

    MT29F128G08AJAAAWP-ITES

    Abstract: MT29F128G08AJAAAWP-IT MT29F128G08AJAAAWP-I MT29F128G08AJAAA MT29F128G08AJAAAWP MT29F128 mt29f128g08 MT29F128G
    Text: Specifications Data Sheets B~s/Cell: ~ Datasheet: 3216411281256Gb Async/Sync NAND M 73Al Q SLC Brand: Micron Bus Wi<hh: xa Chill Em1ble: Single Component Density: 128Gb Depth: 16Gb Fall: Micron Family: NAND Flash 110 : Common Mmmfacturer: Micron Mode Operation: Single Die


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    PDF 128Gb 48-pin Exterm11: 3216411281256Gb MT29F128G08AJAAAWP-I MT29F128G08AJAAAWP-ITES MT29F128G08AJAAAWP-IT MT29F128G08AJAAA MT29F128G08AJAAAWP MT29F128 mt29f128g08 MT29F128G

    fan 7320

    Abstract: atmel 936 ttl buffer MG2014P MG2044P MG2142P MG2270P TM1019 radiation hard PLL OAI22 capacitance
    Text: MG2RTP Radiation Hardened 0.5 Micron Sea of Gates Introduction The MG2RTP series is a 0.5 micron, array based, CMOS product family. Several arrays up to 490k cells cover all system integration needs. The MG2RTP is manufactured using SCMOS3/2RTP, a 0.5 micron drawn, 3 metal


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    PDF OAI22 fan 7320 atmel 936 ttl buffer MG2014P MG2044P MG2142P MG2270P TM1019 radiation hard PLL OAI22 capacitance

    micron sram

    Abstract: No abstract text available
    Text: PRESS RELEASE CYPRESS INTRODUCES ITS FIRST 0.35-MICRON SRAM Announces Working Silicon on 0.25-Micron Products SAN JOSE, Calif., November 18, 1997 - Cypress Semiconductor today introduced its first SRAM built in a 0.35-micron feature size. The introduction comes on the heels of Cypress’s first


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    PDF 35-MICRON 25-Micron CY7C1021, 35-micron ahe10 micron sram

    14020

    Abstract: MG2000 MG2001 MG2002 MG2004 MG2010 MG2044 MG2055
    Text: MG2 0.5 Micron Sea of Gates Introduction The MG2 series is a 0.5 micron, array based, CMOS product family. Several arrays up to 700k cells cover all system integration needs. The MG2 is manufactured using SCMOS3/2, a 0.5 micron drawn, 3 metal layers CMOS process.


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    PDF BOUT12 14020 MG2000 MG2001 MG2002 MG2004 MG2010 MG2044 MG2055

    rpp1k1

    Abstract: No abstract text available
    Text: 0.18 m Process Family: XT018 0.18 Micron HV SOI CMOS Technology DESCRIPTION The XT018 series is X-FAB’s 0.18 micron Modular High-voltage SOI CMOS Technology. Based on SOI wafers and the industrial standard single poly with up to six metal layers 0.18-micron drawn gate


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    PDF XT018 XT018 18-micron rpp1k1

    36168

    Abstract: No abstract text available
    Text: MG2 MG2 Sea of Gates Series 0.5 Micron CMOS Introduction The MG2 series is a 0.5 micron, array based, CMOS product family. Several arrays up to 700k cells cover all system integration needs. The MG2 is manufactured using SCMOS3/2, a 0.5 micron drawn, 3 metal layers CMOS


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    PDF Bout12, BOUT12 36168

    MG2000

    Abstract: MG2001 MG2002 MG2004 MG2010 MG2044 MG2055 MATRA MHS, MG2
    Text: MG2 MG2 Sea of Gates Series 0.5 Micron CMOS Introduction The MG2 series is a 0.5 micron, array based, CMOS product family. Several arrays up to 700k cells cover all system integration needs. The MG2 is manufactured using SCMOS 3/2, a 0.5 micron drawn, 3 metal layers


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    PDF BOUT12 MG2000 MG2001 MG2002 MG2004 MG2010 MG2044 MG2055 MATRA MHS, MG2

    Untitled

    Abstract: No abstract text available
    Text: MICRON' I 4 MEG x 16 E D O D R A lV l TECHNOLOGY, INC. n P A M MT4LC4M16R6 MT4LC4M16N3 U r iM IV I For the latest data sheet, please refer to the Micron Web site: www. micron, com/mti/msp/html/datasheet. html FEATURES PIN ASSIGNMENT Top View • Single +3.3V +0.3V power supply


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    PDF MT4LC4M16R6 MT4LC4M16N3 096-cycle 50-PlVl 50-PIN

    nd02d2

    Abstract: No abstract text available
    Text: V L S I Technology, in c . PRELIMINARY VGC450/VGC453 LIBRARY 0.8-MICRON GATE ARRAY SERIES FEATURES • Advanced 0.7-micron effective channel length , 0.8-micron (drawn gate length) silicon gate CMOS technology • Fully integrated with COMPASS Design Automation's ASIC Design


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    PDF VGC450/VGC453 VGC450/453 nd02d2

    dram 88 pin

    Abstract: No abstract text available
    Text: MICRON TECHNOLOGY INC 55E D MICRON I • blllS4T 0DGSDb3 3T0 ■ MRN MT12D88C25636 256K x 36, 512K x 18 IC DRAM CARD - " T


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    PDF MT12D88C25636 88-Pin dram 88 pin

    Untitled

    Abstract: No abstract text available
    Text: CD74LCX16646 Semiconductor Fast CMOS 3.3V 16-Bit Registered Transceiver December 1997 Description Features Advanced 0.6 micron CMOS Technology Harris Sem iconductor’s CD74LCX16646 is produced in an advanced 0.6 micron CMOS technology, achieving industry


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    PDF CD74LCX16646 16-Bit CD74LCX16646 MO-118-AB,

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE MICRON I 16’ 32 M E Gx32 SDRAM DIMMs TECHNOLOGY, INC. MT8LSDT1632U, MT8LSDT3232U SYNCHRONOUS DRAM MODULE For the latest full-length data sheet, please refer to the Micron Web site: www. micron, com/mti/msp/html/ datasheet.html FEATURES PIN ASSIGNMENT Front View


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    PDF MT8LSDT1632U, MT8LSDT3232U 100-pin, 128MB

    Untitled

    Abstract: No abstract text available
    Text: CD74LCX16952 Semiconductor Fast CMOS 3.3V 16-Bit Registered Transceiver January 1998 Description Features • Advanced 0.6 micron CMOS Technology Harris’ CD74LCX16952 is produced in an advanced 0.6 micron CMOS technology, achieving industry leading speed


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    PDF CD74LCX16952 16-Bit CD74LCX16952 MO-118-AB,

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE 16 MEG X 32 SDRAM DIMM MICRON' I TECHNOLOGY, INC. M T 4L S D T 1632U D SYNCHRONOUS DRAM MODULE For the latest full-length data sheet, please refer to the Micron Web site: www. micron, com/mti/msp/html/ datasheet.html FEATURES PIN ASSIGNMENT Front View


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    PDF 100-pin, 096-cycle 1632U

    4LC4M

    Abstract: No abstract text available
    Text: 4’8 M EGx32 DRAM DIMMs MICRON I TECHNOLOGY, INC. D P A |\/| MT2LDT432U X , MT4LDT832U (X) _ _ _ I WI f j | j I I I I •I For the latest full-length data sheet, please refer to the Micron Web site: www. micron, com/mti/msp/html/ datasheet.html FEATURES


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    PDF MT2LDT432U MT4LDT832U 100-pin, 096-cycle 100-Pin 4LC4M

    Untitled

    Abstract: No abstract text available
    Text: MICRON 4M E Gx4 . FPM DRAM DRAM MT4LC4M4B1, MT4LC4M4A1 For the latest data sheet revisions, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: M AR » CD74LCX16952 Fast CMOS 3.3V 16-Bit Registered Transceiver January 1998 Description Features Advanced 0.6 micron CMOS Technology Harris’ CD74LCX16952 is produced in an advanced 0.6 micron CMOS technology, achieving industry leading speed grades.


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    PDF CD74LCX16952 16-Bit CD74LCX16952 1-800-4-HARRIS

    Untitled

    Abstract: No abstract text available
    Text: m CD74L CX16952 a r r is Fast CMOS 3.3V 16-Bit Registered Transceiver January 1998 Features Description • Advanced 0.6 micron CMOS Technology Harris’ CD74LCX16952 is produced in an advanced 0.6 micron CMOS technology, achieving industry leading speed grades.


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    PDF CD74L CX16952 16-Bit CD74LCX16952