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    MICRON NAND Search Results

    MICRON NAND Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54H30J Rochester Electronics LLC NAND Gate Visit Rochester Electronics LLC Buy
    DM74LS22J Rochester Electronics LLC DM74LS22 - NAND Logic Gate Visit Rochester Electronics LLC Buy
    54H30J/C Rochester Electronics LLC 54H30 - NAND Gate Visit Rochester Electronics LLC Buy
    946HM/C Rochester Electronics LLC 946 - NAND Gate Visit Rochester Electronics LLC Buy
    MC2101F Rochester Electronics LLC MC2101F - Dual NAND Logic Gate Visit Rochester Electronics LLC Buy

    MICRON NAND Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MT29F128G08AJAAAWP-IT

    Abstract: MT29F128G08AJAAAWP MT29F32G08ABCABH1-10IT MT29F32G08ABCABH1 MT29F32G08AB MT29F128G08AJAAA M73A 256gb nand flash mt29f128g08 MT29F128G08A
    Text: MT29F32G08ABCABH1-10IT - Micron Technology, Inc. Page 1 Micron Global Investor Relations News & Events Jobs Contact Micron Login PRODUCTS & SUPPORT ABOUT MICRON How To Buy Sign up for Access Enter Search Term or Part Number MY WORKSPACE MT29F32G08ABCABH1-10IT


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    PDF MT29F32G08ABCABH1-10IT MT29F32G08ABCABH1-10IT 100-ball 32/64/128/256Gb Down09/2010 flash/mass-storage/mt29f32g08abcabh1-10it MT29F128G08AJAAAWP-IT MT29F128G08AJAAAWP MT29F32G08ABCABH1 MT29F32G08AB MT29F128G08AJAAA M73A 256gb nand flash mt29f128g08 MT29F128G08A

    MT29F32G08AFACA

    Abstract: MT29F32G08 MT29F32G0
    Text: Specifications Data Sheets B~s/Cell: SLC Brand: Micron Bus Wi<hh: x8 Chill Em1ble: Single Component Density: 32Gb Depth: 2Gb Fall: Micron Family: NAND Flash Generation l>rimaly : First Generation 110 : Common 110 Channels: 1 lnte1face: Async Manufacturer: Micron


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    PDF 48-pin MT29F32G08AFACAVVP MT29F32G08AFACAVI/PES MT29F32G08AFACA MT29F32G08 MT29F32G0

    MT29F32G08AFACAWP-IT

    Abstract: MT29F32G08AFACAWP-ITES MT29F32G08AFA MT29F32G08 MT29F32G08AFACAWP
    Text: Specifications Data Sheets B~s/Cell: SLC Brand: Micron Bus Wi<hh: x8 Chill Em1ble: Single Component Density: 32Gb Depth: 2Gb Fall: Micron Family: NAND Flash Generation l>rimaly : First Generation 110 : Common 110 Channels: 1 lnte1face: Async Manufacturer: Micron


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    PDF 48-pin MT29F32G08AFACAWP-ItC MT29F32G08AFACAWP-ITES MT29F32G08AFACAWP-IT MT29F32G08AFA MT29F32G08 MT29F32G08AFACAWP

    MT29F128G08AJAAAWP-ITES

    Abstract: MT29F128G08AJAAAWP-IT MT29F128G08AJAAAWP-I MT29F128G08AJAAA MT29F128G08AJAAAWP MT29F128 mt29f128g08 MT29F128G
    Text: Specifications Data Sheets B~s/Cell: ~ Datasheet: 3216411281256Gb Async/Sync NAND M 73Al Q SLC Brand: Micron Bus Wi<hh: xa Chill Em1ble: Single Component Density: 128Gb Depth: 16Gb Fall: Micron Family: NAND Flash 110 : Common Mmmfacturer: Micron Mode Operation: Single Die


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    PDF 128Gb 48-pin Exterm11: 3216411281256Gb MT29F128G08AJAAAWP-I MT29F128G08AJAAAWP-ITES MT29F128G08AJAAAWP-IT MT29F128G08AJAAA MT29F128G08AJAAAWP MT29F128 mt29f128g08 MT29F128G

    Micron Technology

    Abstract: No abstract text available
    Text: Micron DRAM Products Overview August 2013 John Quigley – Micron FAE 2012 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings are not to scale. Micron and


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    PDF 20Note/DRAM/TN4102 TN-41-04: TN-41-13: TN-46-02: TN-46-06: TN-46-11: TN-46-14: TN-47-19: TN-47-20: Micron Technology

    dram structure

    Abstract: 2240 6T SRAM micron sram
    Text: Joint News Release by Infineon and Micron Infineon Technologies and Micron Technology Announce Cooperation to Develop ‘CellularRAM’ Munich, Germany/Boise, Idaho, USA, June 24, 2002 - Infineon Technologies AG FSE, NYSE: IFX and Micron Technology, Inc., (NYSE: MU) today announced they


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    PDF INFMP200206 dram structure 2240 6T SRAM micron sram

    Micron NAND

    Abstract: design manual atmel atl ATL25 ATL35
    Text: Below are the ATL25 0.25 micron , ALT35 (0.35 micron) and ATL60/ATLS60 (0.6 micron) design manual sections, followed by five sections which are common to all Atmel design manuals (Design, Test, Packaging, Q&R, and Military & Aerospace). ASIC Checklists Kickoff Meeting Checklist - V 3.2


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    PDF ATL25 ALT35 ATL60/ATLS60 ATL25 Micron NAND design manual atmel atl ATL35

    fan 7320

    Abstract: atmel 936 ttl buffer MG2014P MG2044P MG2142P MG2270P TM1019 radiation hard PLL OAI22 capacitance
    Text: MG2RTP Radiation Hardened 0.5 Micron Sea of Gates Introduction The MG2RTP series is a 0.5 micron, array based, CMOS product family. Several arrays up to 490k cells cover all system integration needs. The MG2RTP is manufactured using SCMOS3/2RTP, a 0.5 micron drawn, 3 metal


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    PDF OAI22 fan 7320 atmel 936 ttl buffer MG2014P MG2044P MG2142P MG2270P TM1019 radiation hard PLL OAI22 capacitance

    14020

    Abstract: MG2000 MG2001 MG2002 MG2004 MG2010 MG2044 MG2055
    Text: MG2 0.5 Micron Sea of Gates Introduction The MG2 series is a 0.5 micron, array based, CMOS product family. Several arrays up to 700k cells cover all system integration needs. The MG2 is manufactured using SCMOS3/2, a 0.5 micron drawn, 3 metal layers CMOS process.


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    PDF BOUT12 14020 MG2000 MG2001 MG2002 MG2004 MG2010 MG2044 MG2055

    32M DPRAM

    Abstract: MG2044E MG2091E MG2140E MG2194E MG2265E MG2360E MG2480E MG2700E TM1019
    Text: MG2RT Radiation Tolerant 0.5 Micron Sea of Gates Introduction The MG2RT series is a 0.5 micron, array based, CMOS product family. Several arrays up to 700k cells cover all system integration needs. The MG2RT is manufactured using SCMOS3/2RT, a 0.5 micron drawn, 3 metal layers


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    PDF Tree65 32M DPRAM MG2044E MG2091E MG2140E MG2194E MG2265E MG2360E MG2480E MG2700E TM1019

    36168

    Abstract: No abstract text available
    Text: MG2 MG2 Sea of Gates Series 0.5 Micron CMOS Introduction The MG2 series is a 0.5 micron, array based, CMOS product family. Several arrays up to 700k cells cover all system integration needs. The MG2 is manufactured using SCMOS3/2, a 0.5 micron drawn, 3 metal layers CMOS


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    PDF Bout12, BOUT12 36168

    MG2000

    Abstract: MG2001 MG2002 MG2004 MG2010 MG2044 MG2055 MATRA MHS, MG2
    Text: MG2 MG2 Sea of Gates Series 0.5 Micron CMOS Introduction The MG2 series is a 0.5 micron, array based, CMOS product family. Several arrays up to 700k cells cover all system integration needs. The MG2 is manufactured using SCMOS 3/2, a 0.5 micron drawn, 3 metal layers


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    PDF BOUT12 MG2000 MG2001 MG2002 MG2004 MG2010 MG2044 MG2055 MATRA MHS, MG2

    MT29F2G01

    Abstract: SPI NAND FLASH 2GB Nand M69A
    Text: Specifications Data Sheets B~s/Cell: ~ Datasheet: NAND SPI 2Gb Data Sheet M69A ~ SLC Brand: Micron Bus Wi<hh: x1 Chill Em1ble: Single Component Density: 2Gb Depth: 2Gb Fall: Micron Family: NAND Flash Flash Vohage: 3.3V Generation primaly : First Generation


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    PDF 63-ball MT29F2G01 SPI NAND FLASH 2GB Nand M69A

    MT29F32G08ABAAA

    Abstract: MT29F32G08ABAAAWP MT29F32G08ABAAAWP-I mt29f32g08aba MT29F32G08 MT29F32G08A MT29F32G MT29F32G08ab
    Text: Specifications Data Sheets B~s/Cell: ~ Datasheet: 3216411281256Gb Async/Sync NAND M 73Al Q SLC Brand: Micron Bus Wi<hh: xa Chill Em1ble: Single Component Density: 32Gb Depth: 4Gb Fall: Micron Family: NAND Flash Flash Vohage: 1.8V Generation (primary : First


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    PDF 48-pin Exterm11: 3216411281256Gb MT29F32G08ABAAAWP-I MT29F32G08ABAAA MT29F32G08ABAAAWP mt29f32g08aba MT29F32G08 MT29F32G08A MT29F32G MT29F32G08ab

    MT29F16G08ABACAWP-IT

    Abstract: MT29F16G08ABACA MT29F16G08Abacawp MT29F16G08ABA MT29F16G08ABAC
    Text: Specifications Data Sheets B~s/Cell: SLC Brand: Micron Bus Wi<hh: x8 Chill Em1ble: Single Component Density: 16Gb Depth: 2Gb Fall: Micron Family: NAND Flash Flash Vohage: 1.8V Generation primary : First Generation 110 : Common 110 Channels: 1 Interface: Async


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    PDF 48-pin Exterm11: MT29F16G08ABACAWP-ItC MT29F16G08ABACAWP-ITES MT29F16G08ABACAWP-IT MT29F16G08ABACA MT29F16G08Abacawp MT29F16G08ABA MT29F16G08ABAC

    MT29F64G08

    Abstract: MT29F64G08AECABH1 MT29F64G08AE
    Text: Specifications Data Sheets B~s/Cell: ~ Datasheet: 3216411281256Gb Async/Sync NAND M 73Al Q SLC Brand: Micron Bus Wi<hh: xa CE Chill Count: 2 Chill Enable: Single Component Density: 64Gb Fall: Micron Family: NAND Flash Generation (l>rimaly : Third Generation


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    PDF 3216411281256Gb 100-ball MT29F64G08 MT29F64G08AECABH1 MT29F64G08AE

    mt29f128g08

    Abstract: MT29F128 MT29F128G08a MT29F128G08AM
    Text: Specifications Data Sheets B~s/Cell: ~ Datasheet: 3216411281256Gb Async/Sync NAND M 73Al Q SLC Brand: Micron Bus Wi<hh: xa CE Chill Count: 4 Chill Enable: Single Component Density: 128Gb Depth: 16Gb Fall: Micron Family: NAND Flash Generation (l>rimaly : First


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    PDF 128Gb 52-pad Exterm11: 3216411281256Gb mt29f128g08 MT29F128 MT29F128G08a MT29F128G08AM

    Untitled

    Abstract: No abstract text available
    Text: Specifications Data Sheets B~s/Cell: ~ Datasheet: 3216411281256Gb Async/Sync NAND M 73Al Q SLC Brand: Micron Bus Wi<hh: xa CE Chill Count: 4 Chill Enable: Single Component Density: 128Gb Depth: 16Gb Fall: Micron Family: NAND Flash Generation (l>rimaly : First


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    PDF 128Gb 52-pad Exterm11: 3216411281256Gb

    PC5004

    Abstract: VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding
    Text: V L S I T ech n o lo gy, inc. O.6-MICRON _ ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.6-micron 0.55-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec - 5 V (4.5 to 5.5 V): 190 ps, 2.6 nW/MHz


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    PDF 55-micron PC5004 VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding

    nd02d2

    Abstract: No abstract text available
    Text: V L S I Technology, in c . PRELIMINARY VGC450/VGC453 LIBRARY 0.8-MICRON GATE ARRAY SERIES FEATURES • Advanced 0.7-micron effective channel length , 0.8-micron (drawn gate length) silicon gate CMOS technology • Fully integrated with COMPASS Design Automation's ASIC Design


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    PDF VGC450/VGC453 VGC450/453 nd02d2

    2 bit magnitude comparator

    Abstract: NCR asic NCR Microelectronics Division 1-Bit full adder 30076 7217 up down counter The Western Design Center AOI22 using NAND gate construct an inverter ncr 400
    Text: A S I C APPLICATION SPECIFIC INTEGRATED CIRCUITS "i NCR 62A00 2-Micron Gate Array Products fM H ffik • 2-micron drawn, 1.5-micron effective, DLM process • 600 to 8,500 equivalent gate complexity with up to 95% utilization • Commercial, industrial, automotive and


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    PDF 62A00 2 bit magnitude comparator NCR asic NCR Microelectronics Division 1-Bit full adder 30076 7217 up down counter The Western Design Center AOI22 using NAND gate construct an inverter ncr 400

    toshiba tc110g

    Abstract: 74LS82 74ls150 74LS514 toshiba tc140g 74ls150 pin configuration 74LS273 SC11C1 diode sr45 74LS194 internal circuit diagram
    Text: SIEMENS AKTIEN6ESELLSCHAF 47E » • BS3SbOS 0037405 7 » S I E G General Description Our Sea-of-Gates concept is based on a highperformance CMOS technology, in either 1.5 micron or 1.0 micron transistor gate length. This is equivalent to 1.1 or 0.8 micron effective


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    PDF

    PT6042

    Abstract: VGC453 model values for 0.18 micron technology cmos nd02d2
    Text: V L S I TECHNOLOGY INC T3aa3M? oooaaio □ M7E D V L S I T echn o lo gy , in c . VTI ' PRELIMINARY -0 9 VGC450/VGC453 LIBRARY O.8-MICRON GATE ARRAY SERIES FEATURES • Advanced 0.7-micron effective channel length , 0.8-micron (drawn gate length) silicon gate CMOS


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    PDF VGC450/VGC453 VGC453 VGC450 PT6042 model values for 0.18 micron technology cmos nd02d2

    integrated circuit TL 2262

    Abstract: PT6042 180 nm CMOS standard cell library Synopsys compass ic ND02D2 0.03 um CMOS technology VSC470
    Text: V L S I TECHNOLOGY INC M7E D VTI V L S I T ech n o lo g y , in c . T - m PRELIMINARY - m VSC470 SERIES 0.8-MICRON HIGH-DENSITY STANDARD CELL LIBRARY FEATURES • Advanced 0.7-micron channel length, 0.8-micron drawn gate length silicon gate CMOS technology


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    PDF VSC470 integrated circuit TL 2262 PT6042 180 nm CMOS standard cell library Synopsys compass ic ND02D2 0.03 um CMOS technology