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    MITSUBISHI INTEGRATED CIRCUIT PACKAGES Search Results

    MITSUBISHI INTEGRATED CIRCUIT PACKAGES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLP2701 Toshiba Electronic Devices & Storage Corporation Photocoupler (photo-IC output), 5000 Vrms, 4pin SO6L Visit Toshiba Electronic Devices & Storage Corporation
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type Visit Toshiba Electronic Devices & Storage Corporation

    MITSUBISHI INTEGRATED CIRCUIT PACKAGES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    carton

    Abstract: packaging
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES STANDARD PACKAGING 1.3 PACKAGING WITH EMBOSSED CARRIER TAPING 1 STANDARD PACKING Inner packing label Inner carton Inner packing label Reel Outer carton Outer packing label Mar.’98 MITSUBISHI INTEGRATED CIRCUIT PACKAGES


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    carton

    Abstract: MITSUBISHI integrated circuit
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES STANDARD PACKAGING 1.1 PACKAGING WITH TUBES 1 STANDARD PACKAGING Tubes Inner carton Inner packing label Outer carton Outer packing label Mar.’98 MITSUBISHI INTEGRATED CIRCUIT PACKAGES STANDARD PACKAGING (2) STANDARD PACKAGING (FOR MEMORY ICs)


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    mitsubishi marking

    Abstract: mitsubishi part marking
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES MARKING SPECIFICATIONS 4.4 CUSTOMIZED MARKING Mitsubishi Electric can also produce devices with clientspecified part numbers, logos, etc. on a special order basis. Please contact your rep for detail. Mar.’98


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    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6. IC PACKAGE ELECTRICAL CHARACTERISTICS Semiconductor devices are making rapid progress. They are becoming faster in speed, and more integrated, multifunctinal, and sophisticated. Mitsubishi is committing itself to developing IC packages with smart electrical characteristics, which are essential for


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    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.4 ADHESIVE TAPE 32 26 6 8 4.0 4 0.2 0.25 12 φ1.0 Mar.’98


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    integrated circuit

    Abstract: 2 A 98
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.5 TAPE REELS 1 EMBOSSED CARRIER TAPING REEL 330mm DIAMETER (MATERIAL : PS COMPOUND) T G φA φN φ13 MITSUBISHI Dimensions(mm) No. A G T 12mm 14.0 18.0 16mm 16.4


    Original     		PDF 330mm EDX-7601 255mm 80or120 integrated circuit 2 A 98

    BGA and QFP Package mounting

    Abstract: mitsubishi package integrated circuit
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE CLASSIFICATION 2. IC PACKAGE CLASSIFICATION The following pages classify Mitsubishi Packages by the sealing method and the mounting method. The conventions shown here are used throughout this DATA BOOK, so we suggest you take the time to review them.


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    ls00

    Abstract: M74LS00P mitsubishi marking lot number mitsubishi marking m74ls00 mitsubishi lot marking marking mitsubishi MITSUBISHI marking example
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES MARKING SPECIFICATIONS 4. MARKING SPECIFICATIONS 4.1 GENERAL SPECIFICATIONS Mitsubishi ICs are marked with the device number, the lot number, and the Mitsubishi logo . We include the complete device number on all ICs except such space limited packages as 8-pin DIP and SOPs and so on. Available space determine the shortened form.


    Original     		PDF M74LS00P ls00 M74LS00P mitsubishi marking lot number mitsubishi marking m74ls00 mitsubishi lot marking marking mitsubishi MITSUBISHI marking example

    L142

    Abstract: M095-51 M095-37 M095-14B M095-45 M095-06 M095-29 M095-23B m095
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.2 TRAYS 1 TRAYS M095(MATERIAL : M095-01~06 : PS COMPOUND) M095-14B~ : PP COMPOUND W : 152.6 MITSUBISHI M095-40 ZW eW NW 160P6E-A HEAT PROOF L : 300.0 H ZL eL NL Pocket Pitch(mm)


    Original     		PDF M095-01 M095-14B~ M095-40 160P6E-A M095-01 M095-04 M095-06 M095-13B M095-14B M095-17 L142 M095-51 M095-37 M095-14B M095-45 M095-06 M095-29 M095-23B m095

    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES STANDARD PACKAGING 1.4 PACKAGING WITH ADHESIVE TAPING 1 STANDARD PACKAGING Inner packing label Inner carton Inner packing label Reel Outer carton Outer packing label Mar.’98


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    detail in table SURFACE MOUNT COMPONENTS

    Abstract: MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.2 PRINTED CIRCUIT BOARD DESIGN In surface mounting, mount pad designing and board material selection are critical. Mount pad designing may influence solder yield. The substrate material may influence post-soldering reliability.


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    lga 1336

    Abstract: ED-7401-2 pga144 lattice package dimension sop40 PGA0144-C-S15U-2 R400 S115 ZIP0020-P-0400-1 QFP 64 Cavity package
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES EIAJ PACKAGE CODES 3. EIAJ PACKAGE CODES Package codes specified in EIAJ Packages name and code for semiconductor device package (Integrated Circuits ED-7401-2) (1) Construction of package code (1) (2) (3) (4) (5) (6)


    Original     		PDF ED-7401-2) ZIP0020-P-0400-1 SDIP0064-C-0750-1 ZIP20-P-400-1 SDIP64-C-750-1 PGA0144-C-S15U-2 PGA144-C-S15U-2 OP0028-P-0450-1 OP28-P-450-1 SOJ0026-P-0300-1 lga 1336 ED-7401-2 pga144 lattice package dimension sop40 R400 S115 QFP 64 Cavity package

    QFP PACKAGE thermal resistance

    Abstract: ic and equivalent
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5. PACKAGE THERMAL RESISTANCE 5.1 EQUIVALENT THERMAL CIRCUIT The power dissipation of many ICs is, on a par with that of small-signal transistors, extremely small so that with the exception of power ICs


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    MP016PC2

    Abstract: poly vinyl chloride MP525PC MP016PC-2 SP178 chloride MITSUBISHI INTEGRATED CIRCUIT PACKAGES Mitsubishi drawings
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.1 TUBES Stopper pin Tube Stopper Scale : N.T.S Material Electrostatic protection Treatment 550 —1.5 Overall length PVC Poly Vinyl Chloride Electrostatic protection


    Original     		PDF P300PC-2 P300PC P300PC-4 JP400PC JP350PC JP500PC MP016PC2 poly vinyl chloride MP525PC MP016PC-2 SP178 chloride MITSUBISHI INTEGRATED CIRCUIT PACKAGES Mitsubishi drawings

    hssop

    Abstract: 32 QFP PACKAGE thermal resistance mitsubishi mounting technology
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES ORDERING INFORMATION TABLE OF CONTENTS 1 . GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION 3. PACKAGE STRUCTURE 4. PACKAGE CODING CONVENTIONS 5. PACKAGE LINE-UP 2 . DETAILED DIAGRAM OF PACKAGE OUTLINES


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    MO95

    Abstract: carton L142 Mitsubishi LABEL
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES STANDARD PACKAGING 1.2 PACKAGING WITH TRAYS 1 MOISTURE-PROOF PACKAGING (L142 Tray Series; mainly used for shipment of TSOPs) Foam plastic bag Desiccant Trays yyyyyyyy yyyyyyyy yyyyyyyy yyyyyyyy yyyyyyyy yyyyyyyy yyyyyyyy


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    324pc

    Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension


    Original     		PDF 240mil SP050PC 340mil SP070PC 440mil 12P9B 14P5A 16P5A 20P5A 24P5A 324pc L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881

    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2. SURFACE MOUNTING PROCESS This chapter describes the surface mounting process, focusing on surface mounting technologies. For more information on the material and/or equipment, please consult your supplier.


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    "vacuum tube"

    Abstract: No abstract text available
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES FUNCTIONAL REQUIREMENTS 1. FUNCTIONAL REQUIREMENTS The history of electronic components is one of miniaturization and of increasing component-mounting densities. Active devices have evolved from vacuum tube through transistors to integrated circuits that contain peripheral circuitry as well. IC integration has advanced from LSI to


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    100MHZ

    Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,


    Original     		PDF 136P6S-C 100P6S-C 80P6N-C 208P6Y-A 64P6N-B 160P6E-A 44P6N-B 100MHZ IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C

    printer component

    Abstract: No abstract text available
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES MOUNTING TECHNOLOGY OUTLINE 1. MOUNTING TECHNOLOGY OUTLINE In the electronics industry, the demand is increasing for devices that are more multifunctional while compact, with components mounted densely. This demand is expected to escalate.


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    senju solder paste

    Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste


    Original     		PDF 80-95wt% 63Sn/37Pb) 62Sn/36Pb/2Ag) senju solder paste senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag

    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES DIRECTIONS FOR STORAGE AND TRANSPORTATION 2. DIRECTIONS FOR STORAGE AND TRANSPORTATION The design of packaging material has been devised to ensure that the quality of ICs will be retained until installation. However, handle the


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    1000H

    Abstract: MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES INSTRUCTIONS TO BE FOLLOWED IN MOUNTING 3. INSTRUCTIONS TO BE FOLLOWED IN MOUNTING 3.1 PACKAGE CRACKING Introduction With electronic equipment becoming more compact, light-weight and sophisticated, the high-intensity mounting of semiconductor devices,


    Original     		PDF 28-pin 1000H MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow