detail in table SURFACE MOUNT COMPONENTS
Abstract: MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.2 PRINTED CIRCUIT BOARD DESIGN In surface mounting, mount pad designing and board material selection are critical. Mount pad designing may influence solder yield. The substrate material may influence post-soldering reliability.
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MITSUBISHI CAPACITOR
Abstract: paste capacitor SOLDERING REFLOW process mitsubishi SOP mitsubishi
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.1 SURFACE MOUNTING PROCESS SEQUENCE This section shows the surface-mounting process flow chart. There are two soldering methods: the flow method and reflow method. In surface mounting, the latter is usually used.
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MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
Abstract: MITSUBISHI INTEGRATED CIRCUIT PACKAGES mitsubishi soldering process
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.5 SOLDERING PROCESS There are two soldering methods used in surface mounting: the flow method and reflow method. This section outlines the latter, which is mainstream in the industry. Table 6 REFLOW METHOD EXAMPLES
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MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
MITSUBISHI INTEGRATED CIRCUIT PACKAGES
mitsubishi soldering process
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printer component
Abstract: No abstract text available
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES MOUNTING TECHNOLOGY OUTLINE 1. MOUNTING TECHNOLOGY OUTLINE In the electronics industry, the demand is increasing for devices that are more multifunctional while compact, with components mounted densely. This demand is expected to escalate.
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senju solder paste
Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste
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80-95wt%
63Sn/37Pb)
62Sn/36Pb/2Ag)
senju solder paste
senju printing speed
Senju metal solder paste
viscometer
Rosin Flux Type RMA
Senju flux
Senju
soldering paste
solder powder
62Sn36Pb2Ag
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Abstract: MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES INSTRUCTIONS TO BE FOLLOWED IN MOUNTING 3. INSTRUCTIONS TO BE FOLLOWED IN MOUNTING 3.1 PACKAGE CRACKING Introduction With electronic equipment becoming more compact, light-weight and sophisticated, the high-intensity mounting of semiconductor devices,
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TAIYO PSR 4000
Abstract: TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600
Text: Application Note 114 August 2007 Revised March 2009 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds
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an114fa
AN114-8
TAIYO PSR 4000
TAIYO PSR 4000 datasheet
bga dye pry
PSR-4000
TAIYO PSR 2000
taiyo PSR-4000 aus
LGA voiding
LTM46XX
land pattern BGA 0,50
LTM4600
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component data
Abstract: smema smema specifications automatic room light control with program QFP lead pitch 0.3mm Ricoh 2205 ups 3KVA boards
Text: VT-WIN PRINTED CIRCUIT BOARD INSPECTION SYSTEM Fully Automated And Integrated High-Speed, In-Line PCB Inspection and Verification System The increasing density and quality requirements of PCBs and intense manufacturing competition leave little room for error.To stay ahead of competition, maximize your resources
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component data
smema
smema specifications
automatic room light control with program
QFP lead pitch 0.3mm
Ricoh 2205
ups 3KVA boards
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ecg semiconductors master replacement guide
Abstract: transistor SMD marked RNW th 20594 TRANSISTOR si 6822 MIL-STD-202F-201A CT 1975 sam transistors br 6822 sun hold ras 2410 relay TRANSISTOR SMD MARKING CODE jg Mist Ultrasonic Humidifier
Text: RELIABILITY OF SEMICONDUCTOR DEVICES I. RELIABILITY OF SEMICONDUCTOR DEVICES 1. OUR PHILOSOPHY OF QUALITY 2. SEMICONDUCTOR RELIABILITY RELIABILITY OF SEMICONDUCTOR DEVICES I. RELIABILITY OF SEMICONDUCTOR DEVICES 1. OUR PHILOSOPHY OF QUALITY Since its foundation, Mitsubishi Electric has been seeking a philosophy of extending the business and contributing the society with high
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hitachi ha17904
Abstract: HA17904 HA17904AFP HA17904APS HA17904A
Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
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cxd1125
Abstract: sony cxd1125 CXD1135 Sony CXD1135 Mitsubishi transistor databook Mitsubishi databook 1FS transistor dac dip8 TDA1311A Sanyo ic databook
Text: INTEGRATED CIRCUITS DATA SHEET TDA1311A Stereo Continuous Calibration DAC CC-DAC Preliminary specification Supersedes data of July 1993 File under Integrated Circuits, IC01 1995 Dec 19 Philips Semiconductors Preliminary specification Stereo Continuous Calibration DAC
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TDA1311A
TDA1311A;
cxd1125
sony cxd1125
CXD1135
Sony CXD1135
Mitsubishi transistor databook
Mitsubishi databook
1FS transistor
dac dip8
TDA1311A
Sanyo ic databook
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HA17358 Series
Abstract: HA17358 HA17358A HA17358AF HA17358ARP
Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
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DP-14
Abstract: FP-14DA HA17902 HA17902A HA17902AFP HA17902AP
Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
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ha17324a
Abstract: HA17324A application DP-14 FP-14DA FP-14DN HA17324 HA17324AF HA17324ARP
Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
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cxd1125
Abstract: cxd1135 Sony CXD1135 sony cxd1125 mbg863 TDA1311A 1Fs transistor MBG866 TDA1311AT mitsubishi ic. 5201
Text: INTEGRATED CIRCUITS DATA SHEET TDA1311A Stereo Continuous Calibration DAC CC-DAC Preliminary specification Supersedes data of July 1993 File under Integrated Circuits, IC01 1995 Dec 18 Philips Semiconductors Preliminary specification Stereo Continuous Calibration DAC
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cxd1125
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Sony CXD1135
sony cxd1125
mbg863
TDA1311A
1Fs transistor
MBG866
TDA1311AT
mitsubishi ic. 5201
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cxd1125
Abstract: Sony CXD1135 cxd1135 sony cxd1125 cmos ic cd 4549 CXD1162 add 5201 CMOS applications handbook dac dip8 Sanyo ic databook
Text: INTEGRATED CIRCUITS DATA SHEET TDA1311A Stereo Continuous Calibration DAC CC-DAC Preliminary specification Supersedes data of July 1993 File under Integrated Circuits, IC01 1995 Dec 18 Philips Semiconductors Preliminary specification Stereo Continuous Calibration DAC
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SCD47
513061/50/02/pp20
cxd1125
Sony CXD1135
cxd1135
sony cxd1125
cmos ic cd 4549
CXD1162
add 5201
CMOS applications handbook
dac dip8
Sanyo ic databook
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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transistor SR 13001
Abstract: RCA SK CROSS-REFERENCE PCD8572I ATmel 730 24c04 SR 13001 transistor atmel 716 24c04 UNITRODE applications handbook uc3842 -96 all 89c51 microcontroller references book QFP44 footprint HI5618
Text: INTEGRATED CIRCUITS DATA SHEET PCF5001 POCSAG Paging Decoder Product specification Supersedes data of 1995 Apr 27 File under Integrated Circuits, IC17 1997 Mar 04 Philips Semiconductors Product specification POCSAG Paging Decoder PCF5001 CONTENTS BLOCK DIAGRAMS
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RCA SK CROSS-REFERENCE
PCD8572I
ATmel 730 24c04
SR 13001 transistor
atmel 716 24c04
UNITRODE applications handbook uc3842 -96
all 89c51 microcontroller references book
QFP44 footprint
HI5618
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ISL9219IRZ-TR5360
Abstract: TH11-4H104F ISL9219IRZ-T ISL9219IRZR5360 ISL9219R5360 TB347 TB363 TB379 TB389 ISL9219IRZ
Text: ISL9219R5360 ¬ Data Sheet December 4, 2009 FN6823.1 USB Compliant Li-ion Battery Charger Features The ISL9219R5360 is a fully integrated high input voltage single-cell Li-ion battery charger. These chargers are fully in compliance with the USB electrical specification. The
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ISL9219IRZ-TR5360
TH11-4H104F
ISL9219IRZ-T
ISL9219IRZR5360
TB347
TB363
TB379
TB389
ISL9219IRZ
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Abstract: No abstract text available
Text: ISL9219 Data Sheet April 7, 2010 FN6606.2 Li-ion Battery Charger Features The ISL9219 is a fully integrated high input voltage single-cell Li-ion battery charger. This charger is fully in compliance with the USB electrical specification. The charger performs the CC/CV charge function required by
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FN6606
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resistor16
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Abstract: No abstract text available
Text: ISL9219R5360 Data Sheet January 9, 2009 FN6823.0 USB Compliant Li-ion Battery Charger Features The ISL9219R5360 is a fully integrated high input voltage single-cell Li-ion battery charger. These chargers are fully in compliance with the USB electrical specification. The
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FN6823
ISL9219R5360
5m-1994.
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ISL9219
Abstract: ISL9219IRZ TB347 TB363 TB379 TB389
Text: ISL9219 Data Sheet April 7, 2010 FN6606.2 Li-ion Battery Charger Features The ISL9219 is a fully integrated high input voltage single-cell Li-ion battery charger. This charger is fully in compliance with the USB electrical specification. The charger performs the CC/CV charge function required by
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ISL9219
FN6606
ISL9219
5m-1994.
ISL9219IRZ
TB347
TB363
TB379
TB389
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cxd1135
Abstract: cxd1125 Sony CXD1135 sony cxd1125 Mitsubishi transistor databook m50423 Mitsubishi databook Mitsubishi High-Frequency Devices databook TDA1311 TDA1311A
Text: Philips Semiconductors Preliminary specification Stereo Continuous Calibration DAC CC-DAC TDA1311A FEATURES GENERAL DESCRIPTION • Voltage output The TDA1311A; AT is a voltage-driven digital-to-analog converter and is new generation of DAC devices which
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cxd1135
cxd1125
Sony CXD1135
sony cxd1125
Mitsubishi transistor databook
m50423
Mitsubishi databook
Mitsubishi High-Frequency Devices databook
TDA1311
TDA1311A
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