Untitled
Abstract: No abstract text available
Text: PA5131-MD Data Sheet 48 pin MLF socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of an Atmel AT89C5131 in the 48 pin MLF package using the 40 pin DIP footprint specified by Atmel. The adapter is made up of 2 sub-assemblies. They assemble via
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PA5131-MD
socket/40
AT89C5131
PA5131-MD
5131QN48
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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DUAL ROW QFN leadframe
Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This
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amkor
Abstract: amkor exposed pad
Text: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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IDT5V41
Abstract: IDT5V412 IDT5V41236 1236n pcb of pcie X1 edge connector 5V41236 5V41236PGGI pcie X1 pcb of edge connector MO-220C
Text: DATASHEET IDT5V41236 4 OUTPUT PCIE GEN1/2/3 SYNTHESIZER Recommended Applications Features/Benefits Four output synthesizer for PCIe Gen1/2/3 • 20-pin TSSOP/MLF packages; small board footprint • Spread-spectrum capable; reduces EMI • Outputs can be terminated to LVDS; can drive a wider
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IDT5V41236
20-pin
IDT5V41
IDT5V412
1236n
pcb of pcie X1 edge connector
5V41236
5V41236PGGI
pcie X1 pcb of edge connector
MO-220C
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IEC-6000-4-2
Abstract: 5M MARKING CODE DIODE SMC
Text: NZMM7V0T4 EMI Filter with ESD Protection This device is scheduled for availability in Q4 2000. Please contact your nearest ON Semiconductor sales representative for further information. http://onsemi.com Features: • • • • • • • • • 4 x 4 mm Lead Less MLF Surface Mount Package
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IEC6000
IEC-6000-4-2
5M MARKING CODE DIODE SMC
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IDT5V41235
Abstract: mark R5B
Text: DATASHEET IDT5V41235 2 OUTPUT PCIE GEN1/2/3 SYNTHESIZER Recommended Applications Features/Benefits 2 Output synthesizer for PCIe Gen1/2/3 and Ethernet • 16-pin TSSOP and MLF packages; small board footprint • Spread-spectrum capable; reduces EMI • Outputs can be terminated to LVDS; can drive a wider
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IDT5V41235
16-pin
mark R5B
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IDT5V41235
Abstract: 5V41235NLG pcie X1 edge connector PCB 5V41235NLG8 IDT package marking
Text: DATASHEET IDT5V41235 2 OUTPUT PCIE GEN1/2/3 SYNTHESIZER Recommended Applications Features/Benefits 2 Output synthesizer for PCIe Gen1/2/3 and Ethernet • 16-pin TSSOP and MLF packages; small board footprint • Spread-spectrum capable; reduces EMI • Outputs can be terminated to LVDS; can drive a wider
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IDT5V41235
16-pin
5V41235NLG
pcie X1 edge connector PCB
5V41235NLG8
IDT package marking
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DC/DC Converter
Abstract: No abstract text available
Text: P10SG-xxxxE/Z H30 MLF PM5-SERIES Rev.11-2008 2 Watt Regulated DIP24 Metal Case 1 - 3 kV DC I/O Isolation Single and Dual Output Continuous Short Circuit Prot. Full SMD Technology Mainzer Straße 151–153 D-55299 Nackenheim Tel. +49 6135 7026-0 Fax: +49 6135 931070
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P10SG-xxxxE/Z
DIP24
D-55299
1000VDC,
3000VDC
DC/DC Converter
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Untitled
Abstract: No abstract text available
Text: P22TG-xxxxE/Z2:1 H35 MLF PMD-SERIES Rev.11-2008 5 Watt 2:1 Wide Input Reg. Single and Dual Output 1.5 to 3.5 kV DC I/O Isolation DIP24 Metal Case Continuous Short Circuit Prot. Full SMD Technology Mainzer Straße 151–153 D-55299 Nackenheim Tel. +49 6135 7026-0
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P22TG-xxxxE/Z2
DIP24
D-55299
1500VDC
3500VDC
accu13
DIP24
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amkor exposed pad
Abstract: exposed QFP 128 amkor exposed QFP 144
Text: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small
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Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL51B5263A-K9S REV: 1.0 General Information 4GB 512Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5263A is a 512Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module consists of eighteen CMOS 256Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in an 8-pin MLF
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VL51B5263A-K9S
512Mx72
244-PIN
VL51B5263A
256Mx8
244-pin
244-pin,
PC3-10600
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DQ56
Abstract: K4B1G0846E A6211 DDR3-1333 PC3-10600 DDR3 miniDIMM JEDEC NC177
Text: Product Specifications PART NO.: VL51B5263A-K9S REV: 1.0 General Information 4GB 512Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5263A is a 512Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module consists of eighteen CMOS 256Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in an 8-pin MLF
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VL51B5263A-K9S
512Mx72
244-PIN
VL51B5263A
256Mx8
244-pin
244-pin,
PC3-10600
DQ56
K4B1G0846E
A6211
DDR3-1333
PC3-10600
DDR3 miniDIMM JEDEC
NC177
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Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL41B5263A-K9S/F8S/E7S-S1 REV: 1.0 General Information 4GB 512MX72 DDR3 SDRAM ECC SO-UDIMM 204 PIN Description The VL41B5263A is a 512Mx72 DDR3 SDRAM high density SO-UDIMM. This memory module consists of eighteen CMOS 256M x 8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages and a 2K EEPROM in an 8-pin MLF
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VL41B5263A-K9S/F8S/E7S-S1
512MX72
VL41B5263A
204-pin
204-pin,
VN-121009
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VL41B5663A-K9S
Abstract: DDR3-1066 DDR3-1333 PC3-10600
Text: Product Specifications PART NO.: VL41B5663A-K9S/F8S/E7S-S1 REV: 1.0 General Information 2GB 256MX72 DDR3 SDRAM ECC SO-UDIMM 204 PIN Description The VL41B5663A is a 256Mx72 DDR3 SDRAM high density SO-UDIMM. This memory module consists of eighteen CMOS 128Mx8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages and a 2K EEPROM in an 8-pin MLF
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VL41B5663A-K9S/F8S/E7S-S1
256MX72
VL41B5663A
128Mx8
204-pin
204-pin,
VN-121009
VL41B5663A-K9S
DDR3-1066
DDR3-1333
PC3-10600
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Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO.: VL41B5663A-K9S/F8S/E7S-S1 REV: 1.0 General Information 2GB 256MX72 DDR3 SDRAM ECC SO-UDIMM 204 PIN Description The VL41B5663A is a 256Mx72 DDR3 SDRAM high density SO-UDIMM. This memory module consists of eighteen CMOS 128Mx8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages and a 2K EEPROM in an 8-pin MLF
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VL41B5663A-K9S/F8S/E7S-S1
256MX72
VL41B5663A
128Mx8
204-pin
204-pin,
VN-121009
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K4B2G0846C-HCH9
Abstract: roundup DDR3 miniDIMM JEDEC K4B2G0846CHCH9 VL51B5763F VL51B5763F-F8S A6211 DDR3-1066 80 pin miniDIMM K4B2G0846C-HC
Text: Product Specifications PART NO.: VL51B5763F-F8S REV: 1.1 General Information 2GB 256Mx72 DDR3 SDRAM ULP ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5763F is a 256Mx72 DDR3 SDRAM high density Mini-UDIMM. This memory module consists of nine CMOS 256Mx8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages, and a 2K EEPROM in an 8-pin MLF
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VL51B5763F-F8S
256Mx72
244-PIN
VL51B5763F
256Mx8
244-pin
244-pin,
VN-031209
K4B2G0846C-HCH9
roundup
DDR3 miniDIMM JEDEC
K4B2G0846CHCH9
VL51B5763F-F8S
A6211
DDR3-1066
80 pin miniDIMM
K4B2G0846C-HC
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samsung DDR3 SDRAM 2GB
Abstract: DDR3-1066 DDR3-1333 PC3-10600 VL41B5263A-K9
Text: Product Specifications PART NO.: VL41B5263A-K9S/F8S/E7S-S1 REV: 1.0 General Information 4GB 512MX72 DDR3 SDRAM ECC SO-UDIMM 204 PIN Description The VL41B5263A is a 512Mx72 DDR3 SDRAM high density SO-UDIMM. This memory module consists of eighteen CMOS 256M x 8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages and a 2K EEPROM in an 8-pin MLF
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VL41B5263A-K9S/F8S/E7S-S1
512MX72
VL41B5263A
204-pin
204-pin,
VN-121009
samsung DDR3 SDRAM 2GB
DDR3-1066
DDR3-1333
PC3-10600
VL41B5263A-K9
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Untitled
Abstract: No abstract text available
Text: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF
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VL493T2863E-E7S/E6S
128MX72
VL493T2863E
128Mx8
25-bit
200-pin
200-pin,
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DDR2-667
Abstract: DDR2-800 PC2-5300 PC2-6400
Text: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF
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VL493T2863E-E7S/E6S
128MX72
VL493T2863E
128Mx8
25-bit
200-pin
200-pin,
DDR2-667
DDR2-800
PC2-5300
PC2-6400
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Untitled
Abstract: No abstract text available
Text: What HEWLETTÍ mLfíM PACKARD Up to 6 GHz Medium Power Silicon Bipolar Transistor Technical Data AT-42010 Features functions. The 20 emitter finger interdigitated geometry yields a • High Output Power: 12.0 dBm Typical PxdB at 2.0 GHz medium sized transistor with
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AT-42010
AT-42010
Rj/50
DD17bSfl
M4475fl4
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Untitled
Abstract: No abstract text available
Text: Whpl HEW LETT mLfíM PACKARD 2.5 mW 14 Pin DIL Cooled Laser Module Technical Data LSC2110-622 Features Description • 2.5 M illiwatt Peak Optical Power Output LSC2110-622 laser modules are highly reliable fiber optic light sources operating in the 1300 nanometer band. The internal
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LSC2110-622
LSC2110-622
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Untitled
Abstract: No abstract text available
Text: warn H E W L E T T mLfíM P A C K A R D Cascadable Silicon Bipolar MMIC Amplifier Technical Data MSA-0611 Features Description • C ascadable 50 Q Gain B lock The MSA-0611 is a low c o st silicon bipolar M onolithic M icrow ave In teg rated Circuit MMIC hou sed
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MSA-0611
MSA-0611
OT-143
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