BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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SG-MLF-7019
Abstract: No abstract text available
Text: GHz MLF Socket - Direct mount, solderless Top View 12.23mm Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required 12.23mm 4.75mm latch Compression plate distributes forces evenly
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475mm.
Ultem1000
MLF28B
MLF20C
MLF40A
MLF36A
SG-MLF-7019
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MLF48G
Abstract: SG-MLF-7005 MLF36 MLF40A
Text: GHz MLF Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly IC guide prevents over compression of elastomer
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225mm
475mm.
Ultem1000
025mm
MLF36A
MLF40A
MLF28B
MLF20C
MLF48G
MLF32D
MLF48G
SG-MLF-7005
MLF36
MLF40A
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