SMES-152
Abstract: EIA-364-31 LR19980
Text: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the following A. 2.50 mm centerline pitch 0.64 mm square pin headers B. 2.54 mm centerline (pitch) 0.64 mm square pin headers when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 28
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Original
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E2009-0338
PS-99020-0088
SMES-152
EIA-364-31
LR19980
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PDF
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EP-08-031DE-120
Abstract: EP-08-250BG-120 10 35L VISHAY EK 03 125BZ 10C CEA-XX-125UN-350 EP-08-500BL-350 WK-XX-250AF-350 EP-08-125BT-120 CEA-XX-250UW-10C EP-08-125AD-120
Text: Linear Patterns Vishay Micro-Measurements General Purpose Strain Gages - Linear Patterns FEATURES • Gage patterns designed for measuring strain in a single direction • Single-grid and parallel dual-grid patterns • Gage lengths from 0.008 in 0.20 mm to 0.500 in (12.7 mm)
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Original
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008CL
CEA-XX-500UW-120
CEA-XX-500UW-350
26-Aug-03
EP-08-031DE-120
EP-08-250BG-120
10 35L VISHAY
EK 03 125BZ 10C
CEA-XX-125UN-350
EP-08-500BL-350
WK-XX-250AF-350
EP-08-125BT-120
CEA-XX-250UW-10C
EP-08-125AD-120
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PDF
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SM5108
Abstract: Silicon Microstructures low PRESSURE die pressure sensor die mm
Text: SM5108 SILICON MICROSTRUCTURES INCORPORATED • • Ultra-Small, Low-Cost, OEM Pressure Die For Extremely High-Volume Applications Ultra-Small, Low Cost OEM Pressure Die DESCRIPTION The SM5108 is a extremely small 0.65 mm x 0.65 mm silicon micromachined
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Original
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SM5108
SM5108
Silicon Microstructures
low PRESSURE die
pressure sensor die mm
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PDF
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pin diagram for IC cd 1619 cp
Abstract: cd 1619 CP connection diagram IC cd 1619 CP cd 1619 CP pin configuration of IC 1619 cp cd 1619 CP diagram pin configuration of cd 1619 cp pin diagram for IC cd 1619 BAV199Ls pin configuration of IC cd 1619 cp
Text: Precision Instrumentation Amplifier with Signal Processing Amplifiers AD8295 FEATURES CONNECTION DIAGRAM Saves board space Includes precision in-amp, 2 op amps, and 2 matched resistors 4 mm x 4 mm LFCSP No heat slug for more routing room Differential output fully specified
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Original
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AD8295
8295BCPZ-RL1
AD8295BCPZ-WP1
16-Lead
13-Inch
pin diagram for IC cd 1619 cp
cd 1619 CP connection diagram
IC cd 1619 CP
cd 1619 CP
pin configuration of IC 1619 cp
cd 1619 CP diagram
pin configuration of cd 1619 cp
pin diagram for IC cd 1619
BAV199Ls
pin configuration of IC cd 1619 cp
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PDF
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SMES-152
Abstract: EIA-364-31 EIA-364-65 LR19980 UCP2008-0956
Text: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 2.54 mm .100 inch centerline (pitch) 0.64 mm (.025) square pin headers when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 28 AWG wire using crimp technology.
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Original
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EIA-364-65,
UCP2008-0956
PS-10-07
SMES-152
EIA-364-31
EIA-364-65
LR19980
UCP2008-0956
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PDF
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Untitled
Abstract: No abstract text available
Text: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 2.54 mm .100 inch centerline (pitch) 0.64 mm (.025) square pin headers when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 28 AWG wire using crimp technology.
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Original
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EIA-364-65,
UCP2014-1506
PS-10-07
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PDF
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pin diagram for IC cd 1619 cp
Abstract: pin configuration of IC cd 1619 cp IC cd 1619 CP pin configuration of cd 1619 cp
Text: Precision Instrumentation Amplifier with Signal Processing Amplifiers AD8295 CONNECTION DIAGRAM FEATURES Saves board space Includes precision in-amp, 2 op amps, and 2 matched resistors 4 mm x 4 mm LFCSP No heat slug for more routing room Differential output fully specified
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Original
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AD8295
AD8295
16-Lead
13-Inch
pin diagram for IC cd 1619 cp
pin configuration of IC cd 1619 cp
IC cd 1619 CP
pin configuration of cd 1619 cp
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PDF
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pin diagram for IC cd 1619 cp
Abstract: pin configuration of cd 1619 cp pin configuration of IC cd 1619 cp IC cd 1619 CP cd 1619 CP AD8295 AD8295ACPZ cd 1619 CP diagram AD7690 pin configuration of IC 1619 cp
Text: Precision Instrumentation Amplifier with Signal Processing Amplifiers AD8295 FEATURES CONNECTION DIAGRAM Saves board space Includes precision in-amp, 2 op amps, and 2 matched resistors 4 mm x 4 mm LFCSP No heat slug for more routing room Differential output fully specified
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Original
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AD8295
AD8295
16-Lead
13-Inch
pin diagram for IC cd 1619 cp
pin configuration of cd 1619 cp
pin configuration of IC cd 1619 cp
IC cd 1619 CP
cd 1619 CP
AD8295ACPZ
cd 1619 CP diagram
AD7690
pin configuration of IC 1619 cp
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PDF
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smes-152
Abstract: EIA-364-65 42625 molex EIA-364-31 LR19980 molex kk 2695
Text: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 2.54 mm .100 inch centerline (pitch) 0.64 mm (.025) square pin headers when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 28 AWG wire using crimp technology.
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Original
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EIA-364-65,
UCR2002-0299
PS-10-07
smes-152
EIA-364-65
42625 molex
EIA-364-31
LR19980
molex kk 2695
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PDF
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Untitled
Abstract: No abstract text available
Text: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 2.54 mm .100 inch centerline (pitch) 0.64 mm (.025) square compliant pin terminal headers, when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 28 AWG wire using crimp technology.
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Original
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PS-75100-001
UCR2003-0767
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PDF
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Untitled
Abstract: No abstract text available
Text: B G D splay iLD Series $ MADE IN USA ߜ BIG Bright 2.25" 57.2 mm or 4.00" (101.6 mm) LED Digits ߜ Program to Change Colors: RED, AMBER, GREEN ߜ Many Input Choices ߜ Optional Relays for Alarm and Full PID Control ߜ Communications Via Ethernet, RS-232, RS-485,
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RS-232,
RS-485,
1-888-TC-OMEGA
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PDF
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EGP-5-120 strain Gages
Abstract: EGP-5-350 EGP-5-120 EMBEDMENT GAGES concrete 322-DJV Strain Sensing
Text: Embedment Gages Vishay Micro-Measurements Special Purpose Sensors - Embedment Gages The EGP-Series Embedment Strain Gage is specially designed for measuring mechanical strains inside concrete structures. The sensing grid, constructed of a nickel-chromium alloy similar to Karma , has an active gage length of 4 in (100 mm) for
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130-mm)
10-ft
22-AWG
643-mm
015-in
EGP-5-120
EGP-5-350
03-Sep-03
EGP-5-120 strain Gages
EGP-5-350
EGP-5-120
EMBEDMENT GAGES
concrete
322-DJV
Strain Sensing
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PDF
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RY43
Abstract: KFG-02-120-C1-11L3M3R
Text: OMEGA STRAIN GAGES SPECIFICATIONS CHART c a a b b c b a a b c c a Foil strain gages are constructed by embedding a foil measuring element into a carrier. Foil measuring grid Carrier Substrate thickness Cover thickness Connection dimensions in mm [in] Nominal resistance
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Original
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SG-3/350-XY47K
RY43
KFG-02-120-C1-11L3M3R
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PDF
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Untitled
Abstract: No abstract text available
Text: Concrete Embedment Gages Micro-Measurements Special Use Sensors - Concrete Embedment Strain Gages The EGP-Series Embedment Strain Gage is specially designed for measuring mechanical strains inside concrete structures. The sensing grid, constructed of a nickel-chromium alloy similar to Karma , has an active gage length of 4 in [100 mm]
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27-Apr-2011
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PDF
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Untitled
Abstract: No abstract text available
Text: PRODUCT SPECIFICATION VERTICAL MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm .050 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin-lead plating. 2.0 PRODUCT DESCRIPTION
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Original
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SDA-42410-*
E107635
LR19980
PE-76;
PS-42410
UCR2002-0267
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PDF
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LR19980
Abstract: PE-76 UCP2008-0143 SMES-152
Text: PRODUCT SPECIFICATION INVERTED RIGHT ANGLE MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.02 mm .040 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin plating. 2.0 PRODUCT DESCRIPTION
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Original
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SD-43860-001,
SD-44380-001,
SD-43814-001,
SD-44248-001)
UCP2008-0143
PS-43860-003
LR19980
PE-76
UCP2008-0143
SMES-152
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PDF
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EIA-364-65
Abstract: smes-152 EIA-364-31A-83 eia-364-21 PS-45240-001 UCP2004-0139 EIA-364-41 EIA-364-28D-99 EIA-364-23A-85 EIA-364-23A
Text: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 0.65 mm .026 inch centerline (pitch) printed circuit board (PCB) connector series with select gold (over nickel) plated contacts, and select tin/lead (over nickel) plated solder surfaces.
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Original
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UCP2004-0139
PS-45240-001
EIA-364-65
smes-152
EIA-364-31A-83
eia-364-21
PS-45240-001
UCP2004-0139
EIA-364-41
EIA-364-28D-99
EIA-364-23A-85
EIA-364-23A
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PDF
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EIA-364-28
Abstract: LR19980 PE-76 UCP2009-1545 IEC 60603-7 vibration PCB separation EIA364-28
Text: PRODUCT SPECIFICATION LOW PROFILE VERTICAL MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm .050 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin plating. 2.0 PRODUCT DESCRIPTION
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Original
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SDA-42878-*
SDA-43090-*
E107635
LR19980
UCP2009-1545
PS-42878
EIA-364-28
LR19980
PE-76
UCP2009-1545
IEC 60603-7 vibration
PCB separation
EIA364-28
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PDF
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Untitled
Abstract: No abstract text available
Text: PRODUCT SPECIFICATION LOW PROFILE VERTICAL MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm .050 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin-lead plating. 2.0 PRODUCT DESCRIPTION
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Original
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SDA-42878-*
SDA-43090-*
E107635
LR19980
PS-42878
UCR2002-0267
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PDF
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LR19980
Abstract: PE-76 UCP2008-0143
Text: PRODUCT SPECIFICATION LOW PROFILE RIGHT ANGLE MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm .050 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin plating. 2.0 PRODUCT DESCRIPTION
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Original
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SDA-43223)
E107635
LR19980
PE-76;
UCP2008-0143
PS-43223-001
LR19980
PE-76
UCP2008-0143
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PDF
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SMES-152
Abstract: No abstract text available
Text: PRODUCT SPECIFICATION INVERTED RIGHT ANGLE MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.02 mm .040 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin-lead plating. 2.0 PRODUCT DESCRIPTION
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Original
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RJ-45/RJ-11
SD-43860ECIFICATION
UCP2004-0028
PS-43860-003
SMES-152
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PDF
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LR19980
Abstract: PE-76 UCP2008-0143 PCB separation iec60603-7
Text: PRODUCT SPECIFICATION LOW PROFILE RIGHT ANGLE MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm .050 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin plating. 2.0 PRODUCT DESCRIPTION
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Original
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SDA-43249)
E107635
LR19980
PE-76;
UCP2008-0143
PSX-43249
LR19980
PE-76
UCP2008-0143
PCB separation
iec60603-7
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PDF
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SMES-152
Abstract: 1050C 300C 500C LR19980 UCP2005-2745 molex 41791
Text: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 3.96 mm .156 inch centerline (pitch) Trifurcon Connectors terminated with 18 to 26 AWG wire using crimp technology when mated with 1.14mm (.045) square pin headers. 2.0 PRODUCT DESCRIPTION
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Original
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SMES-152)
SMES-152
UCP2005-2745
PS-40-02
SMES-152
1050C
300C
500C
LR19980
UCP2005-2745
molex 41791
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PDF
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69308
Abstract: 77138-001 69764
Text: M INITEK is a crimp-to-wire type 2,00 mm 0.079 in. pitch connector system consisting of fem ale terminal, housing, headers and card connector. Its 2,00 mm (0.079 in.) center distance and com pact housing are ideal for dense packaging wire-to-board interconnection
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OCR Scan
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09-xxx
69308
77138-001
69764
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PDF
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