SDHC specification
Abstract: SD host controller vhdl tsmc 0.18um GPS clock code using VHDL GPS clock code using verilog vhdl code for memory card digital clock using logic gates sdio sdio memory silicon fingerprint technology
Text: Compatibility SD Memory Card version 2.00 including SDHC SDIO-HOST SDIO Card version 2.00 SD/SDIO/MMC Card Host Controller Core SDIO Host Specification ver- MMC Card version 3.31 sion 1.00 General SD interface features SD1/SD4 modes of operation
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capacitor 103 250v
Abstract: Lbn45.75 PM1-M1.75 BT-N51KRI-LC4.75 capacitor+63v+1000+micro+f
Text: MMC Dimensions MMC Character NISSEI METALLIZED POLYESTER FILM CAPACITOR Type MMC Features Smaller version of MMH type. Very small size, achieved by our unique manufacturing method. Highly reliable because of its self-healing performance. Uniform flame retardant epoxy resin coating through the latest resin technology.
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1000hr
capacitor 103 250v
Lbn45.75
PM1-M1.75
BT-N51KRI-LC4.75
capacitor+63v+1000+micro+f
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MMC specification
Abstract: CMD19 CMD55 CMD14 MMC card USB reader CMD13 cmd6 MMC version 4 CMD8
Text: SEC-FAE-APP-001 High Speed Mode Setting Sequence for the MMC spec 4.X card Application Note July-2006, Version 1.0 1. High Speed Mode Setting Issue Normal MMC operates under 20 MHz and can operate 1 bit data, but High Speed MMC can operate from 0 to 52 MHz. Also it can operate 1 bit to 8 bit data
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SEC-FAE-APP-001
July-2006,
CMD14
CMD19)
26MHz)
CMD55
15MHz)
CMD13
CMD19
MMC specification
CMD19
CMD14
MMC card
USB reader
CMD13
cmd6
MMC version 4
CMD8
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HBM 00-01H
Abstract: HE11020F mmc sd 2001 MMC version 2.11 LQFP80 MMC specification version 1.4
Text: HE11020F Confidential 2001 / 7 / 17 version 0.96 USB to ATA/ATAPI/SD/MMC Interface Controller 1 General Description This chip provides a high-performance interface to bridge USB and ATA/ATAPI/SD/MMC compliance device, therefore, it could be used to connect IDE hard disk, CD-ROM, CD-RW, Compact Flash card, MMC or SD
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HE11020F
12MHz
HBM 00-01H
HE11020F
mmc sd 2001
MMC version 2.11
LQFP80
MMC specification version 1.4
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omnidirectional MHz antenna
Abstract: RG58 male dual tnc
Text: MMC/P3EFME Datasheet version 1.0. Dual Band 806-960/1850-1990 MHz Antenna. 03/08 . Dual Band 806-960/ 1850-1990 MHz Antenna Magnetic Mount Dual Band Cellular/PCS Factory Tuned Antenna With 4 dBi on Both Bands. Pulse Part Number: MMC/P3EFME Electrical Specifications
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860MHz
1920MHz
RG-58
omnidirectional MHz antenna
RG58 male dual tnc
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KLMBG4GE2A-A001
Abstract: KLMDGAGE2A-A001 32GB emmc KLMBG4GEAC-B001 SAMSUNG emmc KLMBG KLMAG2WE4AA001 klm8g KLMAG Samsung eMMC 4.41
Text: 10/22/13 Samsung Memory Link HOME PRODUCTS Home Product Flash Solution APPLICATIONS DESIGN SUPPORT LOG IN NEWS EVENTS PRODUCT SEARCH e-MMC Product Catalogue e-MMC Parameter Selector Overview Product catalogue Related Resources Density Class eMMC Version Card
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KLMDGAGE2A-A001
128GB
Class1500
Class400
KLMCG8GEAC-B001
Class2000
KLMCG8GE2A-A001
KLMBG4WE4A-A001
KLMBG4GE2A-A001
KLMDGAGE2A-A001
32GB emmc
KLMBG4GEAC-B001
SAMSUNG emmc
KLMBG
KLMAG2WE4AA001
klm8g
KLMAG
Samsung eMMC 4.41
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mmc_write
Abstract: onenand xsr SAMSUNG NAND FTL KFAT XSR Porting Guide SAMSUNG NAND FLASH TRANSLATION LAYER samsung xsr abstract fore system m.a hindi K9K2G16U0M
Text: TFS4 Porting Guide 2007.08.16 , Version 1.4.2 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC(or HSMMC) host device driver.
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samsung tfs4
Abstract: samsung xsr Flash Translation Layer XSR Extended Sector Remapper XSR Porting Guide onenand xsr FAT32 NAND XSR SAMSUNG NAND FLASH TRANSLATION LAYER S3C2410
Text: TFS4 v1.5.0 Porting Guide 2006.05.02 , Version 1.5.0 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC (or HSMMC) host device driver.
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samsung xsr
Abstract: FAT32 SAMSUNG NAND FTL XSR Porting Guide onenand xsr samsung tfs4 Nucleus RTOS 0x00000025 samsung sector remapper SAMSUNG NAND FLASH TRANSLATION LAYER
Text: TFS4 v1.6 Porting Guide 2006.05.29, Version 1.6 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC (or HSMMC) host device driver.
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agreement1250
samsung xsr
FAT32
SAMSUNG NAND FTL
XSR Porting Guide
onenand xsr
samsung tfs4
Nucleus RTOS
0x00000025
samsung sector remapper
SAMSUNG NAND FLASH TRANSLATION LAYER
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Untitled
Abstract: No abstract text available
Text: W86L388D Winbond Host Interface SD/MMC Memory Card Bridge W86L388D Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 2 1 08/2001 0.50 First published. 4/26/2005 0.6 Added lead free package W86L388-DG in ordering information 3 4
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W86L388D
W86L388-DG
applica886-35-770066
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emmc 4.4 standard jedec
Abstract: GLS85VM1008A-M-I-LFWE-ND200 Specification eMMC 4.0 emmc bga eMMC data retention BGA EMMC
Text: GLS85VM1008A / 1016A / 1032A Industrial Temp eMMC NANDrive Fact Sheet 01.000 March 2013 Features • Industry Standard Embedded MultiMediaCard eMMC Host Interface - JEDEC/MMC Standard Version 4.4 JESD84-A44 compliant - Backward compatible with eMMC 4.3
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GLS85VM1008A
JESD84-A44
52MHz
180mA
GLS85VM1032A)
150mA
GLS85VM1016A)
120mA
GLS85VM1008A)
S71425-F
emmc 4.4 standard jedec
GLS85VM1008A-M-I-LFWE-ND200
Specification eMMC 4.0
emmc bga
eMMC data retention
BGA EMMC
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K9F1G08U0A
Abstract: SAMSUNG 413 K9F1G08U0M SAMSUNG 413 K9K1G08U0A 48-LQFN 2936A K9F5608U0C Flash Memory mmc "Flash Memory select" CSDN cdi schematics
Text: W86L157 WINBOND MMC CARD CONTROLLER -I- Publication Release Date: December 2, 2004 Revision 0.7 W86L157 Preliminary Revision History VERSION ON WEB PAGES DATES VERSION 1 - 2/2004 0.5 First published. 2 16 4/6/2004 0.6 Add 48-pin LQFN package 3 18, 19 12/2/2004
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W86L157
W86L157
48-pin
produ480,
K9F1G08U0A
SAMSUNG 413 K9F1G08U0M
SAMSUNG 413 K9K1G08U0A
48-LQFN
2936A
K9F5608U0C
Flash Memory mmc
"Flash Memory select"
CSDN
cdi schematics
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48-PIN
Abstract: FR30 GIO10 W86L488 W86L488AY W86L488Y ase qfn 48
Text: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge Preliminary W86L488 W86L488 Data Sheet Revision History Pages Version on Web Dates Version 1 08/2002 0.50 First published. 2 12/2002 0.60 Add QFN package. Main Contents 1.Modify pin function of CLK, ACLK,
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W86L488
W86L488
48-QFN
48-PIN
FR30
GIO10
W86L488AY
W86L488Y
ase qfn 48
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DIM200PHM33-A000
Abstract: No abstract text available
Text: DIM200PHM33-A000 DIM200PHM33-A000 Half Bridge IGBT Module Replaces October 2001, version DS5464-4.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates APPLICATIONS
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DIM200PHM33-A000
DS5464-4
DS5464-5
DIM200PHM33-A000
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W86L388
Abstract: 23GIO 48-PIN NDS352P W86L388D do-15 footprint sd5d14 MMC Electronics America
Text: W86L388D Winbond Host Interface SD/MMC Memory Card Bridge W86L388D Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 08/2001 0.50 First published. 2 3 4 5 6 7 8 9 10 Please note that all data and specifications are subject to change without notice. All the trademarks of
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W86L388D
W86L388D
W86L388
23GIO
48-PIN
NDS352P
do-15 footprint
sd5d14
MMC Electronics America
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Untitled
Abstract: No abstract text available
Text: DIM400GDM33-A000 DIM400GDM33-A000 Dual Switch IGBT Module Replaces June 2002, version DS5495-4.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5495-5.1 June 2002
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DIM400GDM33-A000
DS5495-4
DS5495-5
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bi-directional switches IGBT
Abstract: DIM800DDM17-A000
Text: DIM800DDM17-A000 DIM800DDM17-A000 Dual Switch IGBT Module Replaces March 2002, version DS5433-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5433-4.1 July 2002
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DIM800DDM17-A000
DS5433-3
DS5433-4
240arantee
bi-directional switches IGBT
DIM800DDM17-A000
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12v to 1000v inverters circuit diagrams
Abstract: bi-directional switches IGBT ups circuit diagram using igbt DIM2400ESM17-A000
Text: DIM2400ESM17-A000 DIM2400ESM17-A000 Single Switch IGBT Module Replaces March 2002, version DS5447-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5447-4.1 July 2002
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DIM2400ESM17-A000
DS5447-3
DS5447-4
12v to 1000v inverters circuit diagrams
bi-directional switches IGBT
ups circuit diagram using igbt
DIM2400ESM17-A000
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IC 7800
Abstract: diode current 1200A DIM1200ESM33-A000
Text: DIM1200ESM33-A000 DIM1200ESM33-A000 Single Switch IGBT Module Replaces June 2002, version DS5492-4.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5492-5.0 February 2003
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DIM1200ESM33-A000
DS5492-4
DS5492-5
IC 7800
diode current 1200A
DIM1200ESM33-A000
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bi-directional switches IGBT
Abstract: DIM800DCM17-A000 25675
Text: DIM800DCM17-A000 DIM800DCM17-A000 IGBT Chopper Module Replaces issue March 2002, version DS5444-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5444-4.1 July 2002
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DIM800DCM17-A000
DS5444-3
DS5444-4
DIM800Darantee
bi-directional switches IGBT
DIM800DCM17-A000
25675
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DIM800NSM33-A000
Abstract: No abstract text available
Text: DIM800NSM33-A000 DIM800NSM33-A000 Single Switch IGBT Module Replaces May 2002, version DS5486-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5486-4.1 June 2002
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DIM800NSM33-A000
DS5486-3
DS5486-4
DIM800NSM33-A000
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DIM800DDM17-A000
Abstract: No abstract text available
Text: DIM800DDM17-A000 DIM800DDM17-A000 Dual Switch IGBT Module Replaces March 2002, version DS5433-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5433-4.1 July 2002
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DIM800DDM17-A000
DS5433-3
DS5433-4
240arantee
DIM800DDM17-A000
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Untitled
Abstract: No abstract text available
Text: DIM400GDM33-A000 DIM400GDM33-A000 Dual Switch IGBT Module Replaces December 2001, version DS5495-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5495-4.0 May 2002
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DIM400GDM33-A000
DS5495-3
DS5495-4
DIM400GDlity
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DIM2400ESM17-A000
Abstract: No abstract text available
Text: DIM2400ESM17-A000 DIM2400ESM17-A000 Single Switch IGBT Module Replaces March 2002, version DS5447-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5447-4.1 July 2002
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DIM2400ESM17-A000
DS5447-3
DS5447-4
DIM2400ESM17-A000
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