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    MOLD COMPOUND HIGH THERMAL CONDUCTIVITY Search Results

    MOLD COMPOUND HIGH THERMAL CONDUCTIVITY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GC321AD7LP103KX18J Murata Manufacturing Co Ltd High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GC331AD7LQ153KX18J Murata Manufacturing Co Ltd High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GC331CD7LQ473KX19K Murata Manufacturing Co Ltd High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GC343DD7LP334KX18K Murata Manufacturing Co Ltd High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GC355DD7LQ224KX18K Murata Manufacturing Co Ltd High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    MOLD COMPOUND HIGH THERMAL CONDUCTIVITY Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PCN0702

    Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line


    Original     		PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermally Conductive Epoxy Encapsulating & Potting Compound 832TC Technical Data Sheet 832TC Description The 832TC Thermally Conductive Epoxy, Encapsulating and Potting Compound, is an electric grade epoxy. It uses high purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This two


    Original     		832TC 832TC PDF

    PCN0516

    Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
    Text: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA


    Original     		PCN0516 x10-5/C x102N/mm2 UL-94 1X10E12 PCN0516 G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo PDF

    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

    Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
    Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .


    Original     		PDF

    AUS308

    Abstract: PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal
    Text: March 21, 2007 CN 032107 Customer Notification CX2751x-12 Material Set Change Dear Valued Customer: This notification is for the CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. Mindspeed’s turnkey supplier has sent notification that all their BGA products will be manufactured using


    Original     		CX2751x-12 CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. CX2751x-12, CX2751xG-12, 2751x-PCN-001-A AUS308 PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal PDF

    what is TG in PCB material

    Abstract: ims pcb irf3205 mosfet transistor FET IRF3205 2804S IRF3205 IR IRFS3006PBF AN949 AN-1140 IPC-2221
    Text: Application Note AN-1140 Continuous dc Current Ratings of International Rectifier’s Large Semiconductor Packages By K. Teasdale Principal Engineer International Rectifier Corporation 1 May 2009 Table of contents Page Section 1: Classic Current Rating for Power Semiconductor .2


    Original     		AN-1140 com/technical-info/appnotes/an-949 IRFS3006PbF what is TG in PCB material ims pcb irf3205 mosfet transistor FET IRF3205 2804S IRF3205 IR AN949 AN-1140 IPC-2221 PDF

    pure tin recommended reflow profile

    Abstract: J-STD-020B JESD22-A113-D 82602
    Text: VISHAY Vishay Semiconductors Properties of Encapsulant When assembling IrDC transceivers on a printed circuit board PCB , it is useful to have an understanding of the properties of the materials used during manufacturing. While IrDC transceivers use semiconductor dice and


    Original     		31-Oct-03 pure tin recommended reflow profile J-STD-020B JESD22-A113-D 82602 PDF

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


    Original     		PDF

    Surface Mount Assembly Instruction

    Abstract: surface
    Text: Surface Mount Assembly Instruction Vishay Semiconductors Soldering Process When assembling IrDC transceivers on a printed circuit board PCB , it is useful to have an understanding of the properties of the materials used during manufacturing. While IrDC transceivers use semiconductor dice


    Original     		20-Sep-06 Surface Mount Assembly Instruction surface PDF

    gold metal detectors

    Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
    Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    Alumina ceramic AI203

    Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
    Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    JEDEC JESD22-B116 free

    Abstract: SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SR-0212-02 DATE: 12/20/2002 Product Affected: TSOP package family (see attachment for affected part #s). Date Effective: 3/20/2003 Contact: George Snell


    Original     		SR-0212-02 EME-G700 JEDEC JESD22-B116 free SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time PDF

    solid solubility

    Abstract: chemical control process block diagram
    Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    DP270

    Abstract: D-1002-72 Oakite E61941 DP-270 C-3174 FR4 epoxy dielectric constant 3.2 DP270-BLACK X103 30035
    Text: 3 Scotch-Weld TM Epoxy Potting Compound/Adhesive DP270 Clear and Black Technical Data Product Description December, 2009 3M TM Scotch-Weld TM Epoxy Potting Compound/Adhesive DP270 or 3M ScotchWeld™ Epoxy Potting Compound/Adhesive 270 B/A is a two-part, low viscosity


    Original     		DP270 DP270 225-3S-06 D-1002-72 Oakite E61941 DP-270 C-3174 FR4 epoxy dielectric constant 3.2 DP270-BLACK X103 30035 PDF

    Untitled

    Abstract: No abstract text available
    Text: High Temperature Epoxy Encapsulating & Potting Compound 832HT Technical Data Sheet 832HT Description The 832HT High Temperature Epoxy Encapsulating and Potting Compound is an electronic grade epoxy designed for high temperature environments. It is also an ideal encapsulant for very chemically aggressive


    Original     		832HT 832HT PDF

    tm 1628 smd

    Abstract: AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		AN598 DS00599B-page tm 1628 smd AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN PDF

    200B

    Abstract: AN598 DK-2750 RG41 popcorn defect analysis to-220
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		AN598 200B AN598 DK-2750 RG41 popcorn defect analysis to-220 PDF

    LDMOS PA Driver IC, Motorola

    Abstract: MHVIC910HR2 AN1949 RO4350
    Text: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN1949/D AN1949 Mounting Method for the MHVIC910HR2 PFP-16 and Similar Surface Mount Packages Prepared by: Wendi Stemmons, Richard Wetz, Mahesh Shah, Eddie Mares, Jin–Wook Jang and Lynn Frye


    Original     		AN1949/D AN1949 MHVIC910HR2 PFP-16) LDMOS PA Driver IC, Motorola MHVIC910HR2 AN1949 RO4350 PDF

    gold metal detectors

    Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
    Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of


    Original     		CH03WIP gold metal detectors soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008 PDF

    Moisture Sensitivity Levels MICROCHIP PIC Package

    Abstract: 78610 delamination leadframe barber excursion AN598
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		AN598 Moisture Sensitivity Levels MICROCHIP PIC Package 78610 delamination leadframe barber excursion AN598 PDF

    1n4733 smd

    Abstract: moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on
    Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of


    Original     		AN598 DS00599B-page 1n4733 smd moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on PDF

    Untitled

    Abstract: No abstract text available
    Text: Flame Retardant Epoxy Encapsulating & Potting Compound 833FRB Technical Data Sheet 833FRB Encapsulating and Potting Epoxy Description The 833FRB Flame Retardant Epoxy Encapsulating and Potting Compound is a UL 94V-0 recognized electric grade epoxy in the QMFZ2 category. This two-part epoxy provides a black, self-extinguishing finish


    Original     		833FRB 833FRB PDF

    footprint dip

    Abstract: TSOP 86 Package CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC TQFP 80 PACKAGE footprint ceramic pin grid array package lead finish
    Text: Plastic Packages National Semiconductor offers a wide variety of plastic packages for through-hole and surface mount applications. Many of these plastic packages provide cost-effective solutions to achieving greater board density surface-mount packages and high performance. Plastic packages are extensively


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Translucent Epoxy Encapsulating & Potting Compound 832C Technical Data Sheet 832C Description The 832C Translucent Epoxy Encapsulating and Potting Compound is an electric grade epoxy. It is simple to mix and easy to use. This two parts clear epoxy provides great insulation and protection value.


    Original     		193rd PDF